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SN74ALS645AN

Part # SN74ALS645AN
Description OCTAL BUS TRANSCEIVER - Rail/Tube
Category IC
Availability In Stock
Qty 79
Qty Price
1 - 16 $0.71036
17 - 33 $0.56828
34 - 49 $0.46883
50 - 66 $0.43568
67 + $0.38833
Manufacturer Available Qty
Texas Instruments
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Texas Instruments
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Texas Instruments
Date Code: 8623
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
84033012A ACTIVE LCCC FK 20 1 None Call TI Level-NC-NC-NC
8403301RA ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
8403301SA ACTIVE CFP W 20 1 None Call TI Level-NC-NC-NC
SN54ALS645AJ ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
SN54AS645J ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
SN74ALS645A-1DW ACTIVE SOIC DW 20 25 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SN74ALS645A-1DWR ACTIVE SOIC DW 20 2000 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SN74ALS645A-1N ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74ALS645A-1N3 OBSOLETE PDIP N 20 None Call TI Call TI
SN74ALS645A-1NSR ACTIVE SO NS 20 2000 Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74ALS645ADW ACTIVE SOIC DW 20 25 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SN74ALS645ADWR ACTIVE SOIC DW 20 2000 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SN74ALS645AN ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74ALS645AN3 OBSOLETE PDIP N 20 None Call TI Call TI
SN74ALS645ANSR ACTIVE SO NS 20 2000 Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74AS645DW ACTIVE SOIC DW 20 25 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SN74AS645DWR ACTIVE SOIC DW 20 2000 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SN74AS645N ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SNJ54ALS645AFK ACTIVE LCCC FK 20 1 None Call TI Level-NC-NC-NC
SNJ54ALS645AJ ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
SNJ54ALS645AW ACTIVE CFP W 20 1 None Call TI Level-NC-NC-NC
SNJ54AS645FK OBSOLETE LCCC FK 20 None Call TI Call TI
SNJ54AS645J ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
SNJ54AS645W ACTIVE CFP W 20 1 None Call TI Level-NC-NC-NC
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
Addendum-Page 1
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
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TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
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Use of such information may require a license from a third party under the patents or other intellectual property
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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
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