Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
no Sb/Br)
SN74ALS640BNSRE4 ACTIVE SO NS 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ALS640BNSRG4 ACTIVE SO NS 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74AS640DW ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74AS640DWE4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74AS640DWG4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74AS640DWR ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74AS640DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74AS640DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74AS640N ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74AS640NE4 ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74AS640NSR ACTIVE SO NS 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74AS640NSRE4 ACTIVE SO NS 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74AS640NSRG4 ACTIVE SO NS 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SNJ54ALS640BFK OBSOLETE LCCC FK 20 TBD Call TI Call TI
SNJ54ALS640BJ ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type
SNJ54ALS640BW ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type
SNJ54AS640FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54AS640J ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2008
Addendum-Page 2
