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SI4850EY-T1-E3

Part # SI4850EY-T1-E3
Description TRANS MOSFET N-CH 60V 6A 8SOIC N - Tape and Reel
Category IC
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Vishay
Date Code: 1523
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Vishay Siliconix
Si4850EY
Document Number: 71146
S09-1341-Rev. F, 13-Jul-09
www.vishay.com
1
N-Channel Reduced Q
g
, Fast Switching MOSFET
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
TrenchFET
®
Power MOSFETs
175 °C Maximum Junction Temperature
Compliant to RoHS Directive 2002/95/EC
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)I
D
(A)
60
0.022 at V
GS
= 10 V
8.5
0.031 at V
GS
= 4.5 V
7.2
SO-8
SD
SD
SD
GD
5
6
7
8
Top View
2
3
4
1
Ordering Information: Si4850EY-T1-E3 (Lead (Pb)-free)
Si4850EY-T1-GE3 (Lead (Pb)-free and Halogen-free)
D
G
S
N-Channel MOSFET
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol 10 s Steady State Unit
Drain-Source Voltage
V
DS
60
V
Gate-Source Voltage
V
GS
± 20
Continuous Drain Current (T
J
= 175 °C)
a
T
A
= 25 °C
I
D
8.5 6.0
A
T
A
= 70 °C
7.1 5.0
Pulsed Drain Current
I
DM
40
Avalanche Current
I
AS
15
Single Pulse Avalanche Energy
E
AS
11 mJ
Maximum Power Dissipation
a
T
A
= 25 °C
P
D
3.3 1.7
W
T
A
= 70 °C
2.3 1.2
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 175 °C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
a
t 10 s
R
thJA
36 45
°C/WSteady State 75 90
Maximum Junction-to-Foot (Drain)
Steady State
R
thJF
17 20
www.vishay.com
2
Document Number: 71146
S09-1341-Rev. F, 13-Jul-09
Vishay Siliconix
Si4850EY
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= 250 µA
60
V
Gate Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA
13
Gate-Body Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 20 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= 60 V, V
GS
= 0 V
1
µA
V
DS
= 60 V, V
GS
= 0 V, T
J
= 55 °C
20
On-State Drain Current
a
I
D(on)
V
DS
5 V, V
GS
= 10 V
40 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= 10 V, I
D
= 6.0 A
0.018 0.022
Ω
V
GS
= 10 V, I
D
= 6.0 A, T
J
= 125 °C
0.031 0.037
V
GS
= 10 V, I
D
= 6.0 A, T
J
= 175 °C
0.039 0.047
V
GS
= 4.5 V, I
D
= 5.1 A
0.025 0.031
Forward Transconductance
a
g
fs
V
DS
= 15 V, I
D
= 6.0 A
25 S
Diode Forward Voltage
a
V
SD
I
S
= 1.7 A, V
GS
= 0 V
0.8 1.2 V
Dynamic
b
Total Gate Charge
Q
g
V
DS
= 30 V, V
GS
= 10 V, I
D
= 6.0 A
18 27
nC
Gate-Source Charge
Q
gs
3.4
Gate-Drain Charge
Q
gd
5.3
Gate Resistance
R
g
V
GS
= 0.1 V, f = 5 MHz
0.5 1.4 2.4 Ω
Tur n -On Delay T i m e
t
d(on)
V
DD
= 30 V, R
L
= 30 Ω
I
D
1 A, V
GEN
= 10 V, R
g
= 6 Ω
10 20
ns
Rise Time
t
r
10 20
Turn-Off Delay Time
t
d(off)
25 50
Fall Time
t
f
12 24
Source-Drain Reverse Recovery Time
t
rr
I
F
= 1.7 A, dI/dt = 100 A/µs
50 80
Output Characteristics
0
8
16
24
32
40
0.0 0.5 1.0 1.5 2.0 2.5 3.0
V
GS
= 10 V thru 5 V
4 V
3 V
I
D
- Drain Current (A)
V
DS
- Drain-to-Source Voltage (V)
Transfer Characteristics
0
8
16
24
32
40
012345
- 55 °C
25 °C
I
D
- Drain Current (A)
V
GS
- Gate-to-Source Voltage (V)
T
C
= 150 °C
Document Number: 71146
S09-1341-Rev. F, 13-Jul-09
www.vishay.com
3
Vishay Siliconix
Si4850EY
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
On-Resistance vs. Drain Current
Gate Charge
Source-Drain Diode Forward Voltage
0.00
0.01
0.02
0.03
0.04
0.05
0.06
0 8 16 24 32 40
V
GS
= 4.5 V
R
DS(on)
- On-Resistance (Ω)
I
D
- Drain Current (A)
V
GS
= 10 V
0
2
4
6
8
10
048 12 16 20
I
D
= 6.0 V
V
DS
= 30 V
Q
g
- Total Gate Charge (nC)
V
GS
- Gate-to-Source Voltage (V)
2.0 2.5
1
10
50
0.00 0.5 1.0 1.5
T
J
= 25 °C
T
J
= 175 °C
I
S
- Source Current (A)
V
SD
- Source-to-Drain Voltage (V)
Capacitance
On-Resistance vs. Junction Temperature
On-Resistance vs. Gate-to-Source Voltage
0
200
400
600
800
1000
1200
1400
0 102030405060
C
rss
C
oss
C
iss
C - Capacitance (pF)
V
DS
- Drain-to-Source Voltage (V)
0.6
0.
8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
- 50 - 25 0 25 50 75 100 125 150 175
V
GS
= 10 V
I
D
= 6.0 A
R
DS(on)
- On-Resistance
(Normalized)
T
J
- Junction Temperature (°C)
0.00
0.01
0.02
0.03
0.04
0.05
0.06
02468 10
I
D
= 6.0 A
V
GS
- Gate-to-Source Voltage (V)
R
DS(on)
- On-Resistance (Ω)
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