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SI2301CDS-T1-GE3

Part # SI2301CDS-T1-GE3
Description P-CHANNEL 20 V (D-S) MOSFET -Tape and Reel
Category IC
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Vishay Siliconix
Si2301CDS
Document Number: 68741
S-81446-Rev. A, 23-Jun-08
www.vishay.com
1
P-Channel 20-V (D-S) MOSFET
FEATURES
Halogen-free Option Available
TrenchFET
®
Power MOSFET
APPLICATIONS
Load Switch
MOSFET PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)
I
D
(A)
a
Q
g
(Typ.)
- 20
0.112 at V
GS
= - 4.5 V
- 3.1
3.3 nC
0.142 at V
GS
= - 2.5 V
- 2.7
G
TO-236
(SOT-23)
S
D
Top View
2
3
1
Si2301CDS (N1)*
* Marking Code
Ordering Information: Si2301CDS-T1-E3 (Lead (Pb)-free)
Si2301CDS-T1-GE3 (Lead (Pb)-free and Halogen-free)
Notes:
a. Based on T
C
= 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. Maximum under Steady State conditions is 175 °C/W.
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
- 20
V
Gate-Source Voltage
V
GS
± 8
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
- 3.1
A
T
C
= 70 °C
- 2.5
T
A
= 25 °C
- 2.3
b, c
T
A
= 70 °C
- 1.8
b, c
Pulsed Drain Current
I
DM
- 10
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
- 1.3
T
A
= 25 °C
- 0.72
b, c
Maximum Power Dissipation
T
C
= 25 °C
P
D
1.6
W
T
C
= 70 °C
1.0
T
A
= 25 °C
0.86
b, c
T
A
= 70 °C
0.55
b, c
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150
°C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b, d
5 s
R
thJA
120 145
°C/W
Maximum Junction-to-Foot (Drain)
Steady State
R
thJF
62 78
RoHS
COMPLIANT
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2
Document Number: 68741
S-81446-Rev. A, 23-Jun-08
Vishay Siliconix
Si2301CDS
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
MOSFET SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
DS
= 0 V, I
D
= - 250 µA
- 20 V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= - 250 µA
- 18
mV/°C
V
GS(th)
Temperature Coefficient
Δ
V
GS(th)
/T
J
2.2
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= - 250 µA
- 0.4 - 1 V
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 8 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= - 20 V, V
GS
= 0 V
- 1
µA
V
DS
= - 20 V, V
GS
= 0 V, T
J
= 55 °C
- 10
On-State Drain Current
a
I
D(on)
V
DS
- 5 V, V
GS
= - 4.5 V
- 6 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= - 4.5 V, I
D
= - 2.8 A
0.090 0.112
Ω
V
GS
= - 2.5 V, I
D
= - 2.0 A
0.110 0.142
Forward Transconductance
a
g
fs
V
DS
= - 5 V, I
D
= - 2.8 A
2.0 S
Dynamic
b
Input Capacitance
C
iss
V
DS
= - 10 V, V
GS
= 0 V, f = 1 MHz
405
pFOutput Capacitance
C
oss
75
Reverse Transfer Capacitance
C
rss
55
Total Gate Charge
Q
g
V
DS
= - 10 V, V
GS
= - 4.5 V, I
D
= - 3 A
5.5 10
nC
V
DS
= - 10 V, V
GS
= - 2.5 V, I
D
= - 3 A
3.3 6
Gate-Source Charge
Q
gs
0.7
Gate-Drain Charge
Q
gd
1.3
Gate Resistance
R
g
f = 1 MHz 6.0 Ω
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 10 V, R
L
= 10 Ω
I
D
= - 1 A, V
GEN
= - 4.5 V, R
G
= 1 Ω
11 20
ns
Rise Time
t
r
35 60
Turn-Off Delay Time
t
d(off)
30 50
Fall Time
t
f
10 20
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
I
S
T
C
= 25 °C
- 1.3
A
Pulse Diode Forward Current
a
I
SM
- 10
Body Diode Voltage
V
SD
I
S
= - 0.7 A
- 0.8 - 1.2 V
Body Diode Reverse Recovery Time
t
rr
I
F
= - 3.0 A, dI/dt = 100 A/µs, T
J
= 25 °C
30 50 ns
Body Diode Reverse Recovery Charge
Q
rr
25 50 nC
Reverse Recovery Fall Time
t
a
15
ns
Reverse Recovery Rise Time
t
b
15
Document Number: 68741
S-81446-Rev. A, 23-Jun-08
www.vishay.com
3
Vishay Siliconix
Si2301CDS
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Output Characteristics
On-Resistance vs. Drain Current and Gate Voltage
Gate Charge
V
GS
=1.5V
0
2
4
6
8
10
0.0 0.5 1.0 1.5 2.0
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)I
D
V
GS
=5thru 2.5 V
V
GS
=1V
V
GS
=2V
0.00
0.05
0.10
0.15
0.20
02468 10
- On-Resistance (Ω)R
DS(on)
I
D
- Drain Current (A)
V
GS
=4.5V
V
GS
=2.5V
0
2
4
6
8
02468 10
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
I
D
=3A
V
DS
=10V
V
DS
=5V
V
DS
=15V
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0.00
0.25
0.50
0.75
1.00
0.0 0.3 0.6 0.9 1.2 1.5
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
T
C
= 25 °C
T
C
= 125 °C
T
C
= - 55 °C
C
rss
0
200
400
600
800
0 5 10 15 20
C
iss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
C
oss
0.7
0.9
1.1
1.3
1.5
- 50 - 25 0 25 50 75 100 125 150
T
J
-Junction Temperature (°C)
(Normalized)
- On-Resistance
R
DS(on)
V
GS
=1.8V
I
D
=2.8 A
V
GS
=4.5V
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