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S29GL256N10TFI020

Part # S29GL256N10TFI020
Description NOR Flash Parallel 3.3V 256M-bit 32M x 8/16M x 16 100ns 56
Category IC
Availability In Stock
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1 + $11.48011
Manufacturer Available Qty
Date Code: 0623
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

May 13, 2004 27631A4 S29GLxxxN MirrorBitTM Flash Family 91
Advance Information
AC Characteristics
* Figure shows word mode. Addresses are A2–A-1 for byte mode.
Figure 12. Page Read Timings
Figure 11. Read Operation Timings
t
OH
t
CE
Outputs
WE#
Addresses
CE#
OE#
HIGH Z
Output Valid
HIGH Z
Addresses Stable
t
RC
t
ACC
t
OEH
t
RH
t
OE
t
RH
0 V
RY/BY#
RESET#
t
DF
t
CEH
A23
-
A2
CE#
OE#
A2
-
A0*
Data Bus
Same Page
Aa
Ab Ac
Ad
Qa Qb Qc Qd
t
ACC
t
PACC
t
PACC
t
PACC
92 S29GLxxxN MirrorBitTM Flash Family 27631A4 May 13, 2004
Advance Information
AC Characteristics
Hardware Reset (RESET#)
Note: Not 100% tested. If ramp rate is equal to or faster than 1V/100µs with a falling edge of the RESET# pin initiated,
the RESET# pin needs to be held low only for 100µs for power-up..
Parameter
Description All Speed Options UnitJEDEC Std.
t
Ready
RESET# Pin Low (During Embedded Algorithms)
to Read Mode (See Note)
Max 1 ms
t
Ready
RESET# Pin Low (NOT During Embedded
Algorithms) to Read Mode (See Note)
Max 1 ms
t
RP
RESET# Pulse Width Min 1 ms
t
RH
Reset High Time Before Read (See Note) Min 50 ns
t
RPD
RESET# Low to Standby Mode Min 20 µs
t
RB
RY/BY# Recovery Time Min 0 ns
RESET#
RY/BY#
RY/BY#
t
RP
t
Ready
Reset Timings NOT during Embedded Algorithms
t
Ready
CE#, OE#
t
RH
CE#, OE#
Reset Timings during Embedded Algorithms
RESET#
t
RP
t
RB
Figure 13. Reset Timings
May 13, 2004 27631A4 S29GLxxxN MirrorBitTM Flash Family 93
Advance Information
AC Characteristics
Erase and Program Operations–S29GL512N Only
Notes:
1. Not 100% tested.
2. See the “Erase and Programming Performance” section for more information.
3. For 1–16 words/1–32 bytes programmed.
4. Effective write buffer specification is based upon a 16-word/32-byte write buffer operation.
5. Unless otherwise indicated, AC specifications for 90 ns and 100 ns speed options are tested with V
IO
= V
CC
= 3 V.
AC specifications for 100 ns and 110 ns speed options are tested with V
IO
= 1.8 V and V
CC
= 3.0 V.
Parameter Speed Options
JEDEC Std.
Description
90 100 100 110 Unit
t
AVAV
t
WC
Write Cycle Time (Note 1) Min 90 100 100 110 ns
t
AVWL
t
AS
Address Setup Time Min 0 ns
t
ASO
Address Setup Time to OE# low during toggle
bit polling
Min 15 ns
t
WLAX
t
AH
Address Hold Time Min 45 ns
t
AHT
Address Hold Time From CE# or OE# high
during toggle bit polling
Min 0 ns
t
DVWH
t
DS
Data Setup Time Min 45 ns
t
WHDX
t
DH
Data Hold Time Min 0 ns
t
OEPH
Output Enable High during toggle bit polling Min 20 ns
t
GHWL
t
GHWL
Read Recovery Time Before Write
(OE# High to WE# Low)
Min 0 ns
t
ELWL
t
CS
CE# Setup Time Min 0 ns
t
WHEH
t
CH
CE# Hold Time Min 0 ns
t
WLWH
t
WP
Write Pulse Width Min 35 ns
t
WHDL
t
WPH
Write Pulse Width High Min 30 ns
t
WHWH1
t
WHWH1
Write Buffer Program Operation (Notes 2, 3) Typ 240 µs
Effective Write Buffer Program
Operation (Notes 2, 4)
Per Word Typ 15 µs
Accelerated Effective Write Buffer
Program Operation (Notes 2, 4)
Per Word Typ 13.5 µs
Program Operation (Note 2) Word Typ 60 µs
Accelerated Programming
Operation (Note 2)
Word Typ 54 µs
t
WHWH2
t
WHWH2
Sector Erase Operation (Note 2) Typ 1.0 sec
t
VHH
V
HH
Rise and Fall Time (Note 1) Min 250 ns
t
VCS
V
CC
Setup Time (Note 1) Min 50 µs
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