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S29GL256N10TFI020

Part # S29GL256N10TFI020
Description NOR Flash Parallel 3.3V 256M-bit 32M x 8/16M x 16 100ns 56
Category IC
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

This document contains information on a product under development at FASL LLC. The information is intended to help you evaluate this product. FASL LLC reserves the
right to change or discontinue work on this proposed product without notice.
Publication Number 27631 Revision A Amendment 4 Issue Date May 13, 2004
ADVANCE
INFORMATION
S29GLxxxN MirrorBit
TM
Flash Family
S29GL512N, S29GL256N, S29GL128N
512 Megabit, 256 Megabit, and 128 Megabit,
3.0 Volt-only Page Mode Flash Memory featuring
110 nm MirrorBit process technology
Datasheet
Distinctive Characteristics
Architectural Advantages
Single power supply operation
3 volt read, erase, and program operations
Enhanced VersatileI/O control
All input levels (address, control, and DQ input levels)
and outputs are determined by voltage on V
IO
input.
V
IO
range is 1.65 to V
CC
Manufactured on 110 nm MirrorBit process
technology
SecSi (Secured Silicon) Sector region
128-word/256-byte sector for permanent, secure
identification through an 8-word/16-byte random
Electronic Serial Number, accessible through a
command sequence
May be programmed and locked at the factory or by
the customer
Flexible sector architecture
S29GL512N: Five hundred twelve 64 Kword (128
Kbyte) sectors
S29GL256N: Two hundred fifty-six 64 Kword (128
Kbyte) sectors
S29GL128N: One hundred twenty-eight 64 Kword
(128 Kbyte) sectors
Compatibility with JEDEC standards
Provides pinout and software compatibility for single-
power supply flash, and superior inadvertent write
protection
100,000 erase cycles per sector typical
20-year data retention typical
Performance Characteristics
High performance
80 ns access time (S29GL128N, S29GL256N),
90 ns access time (S29GL512N)
8-word/16-byte page read buffer
—25 ns page read times
16-word/32-byte write buffer reduces overall
programming time for multiple-word updates
Low power consumption (typical values at 3.0 V, 5
MHz)
25 mA typical active read current;
50 mA typical erase/program current
1 µA typical standby mode current
Package options
—56-pin TSOP
64-ball Fortified BGA
Software & Hardware Features
Software features
Program Suspend & Resume: read other sectors
before programming operation is completed
Erase Suspend & Resume: read/program other
sectors before an erase operation is completed
Data# polling & toggle bits provide status
Unlock Bypass Program command reduces overall
multiple-word or byte programming time
CFI (Common Flash Interface) compliant: allows host
system to identify and accommodate multiple flash
devices
Hardware features
Advanced Sector Protection
WP#/ACC input accelerates programming time
(when high voltage is applied) for greater throughput
during system production. Protects first or last sector
regardless of sector protection settings
Hardware reset input (RESET#) resets device
Ready/Busy# output (RY/BY#) detects program or
erase cycle completion
2 S29GLxxxN MirrorBitTM Flash Family 27631A4 May 13, 2004
Advance Information
General Description
The S29GL512/256/128N family of devices are 3.0V single power flash memory
manufactured using 110 nm MirrorBit technology. The S29GL512N is a 512 Mbit,
organized as 33,554,432 words or 67,108,864 bytes. The S29GL256N is a 256
Mbit, organized as 16,777,216 words or 33,554,432 bytes. The S29GL128N is a
128 Mbit, organized as 8,388,608 words or 16,777,216 bytes. The devices have
a 16-bit wide data bus that can also function as an 8-bit wide data bus by using
the BYTE# input. The device can be programmed either in the host system or in
standard EPROM programmers.
Access times as fast as 80 ns (S29GL128N, S29GL256N) or 90 ns (S29GL512N)
are available. Note that each access time has a specific operating voltage range
(V
CC
) and an I/O voltage range (V
IO
), as specified in the Product Selector Guide
and the Ordering Information (512 Mb) sections. The devices are offered in a 56-
pin TSOP or 64-ball Fortified BGA package. Each device has separate chip enable
(CE#), write enable (WE#) and output enable (OE#) controls.
Each device requires only a single 3.0 volt power supply for both read and
write functions. In addition to a V
CC
input, a high-voltage accelerated program
(WP#/ACC) input provides shorter programming times through increased cur-
rent. This feature is intended to facilitate factory throughput during system
production, but may also be used in the field if desired.
The devices are entirely command set compatible with the JEDEC single-
power-supply Flash standard. Commands are written to the device using
standard microprocessor write timing. Write cycles also internally latch addresses
and data needed for the programming and erase operations.
The sector erase architecture allows memory sectors to be erased and repro-
grammed without affecting the data contents of other sectors. The device is fully
erased when shipped from the factory.
Device programming and erasure are initiated through command sequences.
Once a program or erase operation has begun, the host system need only poll the
DQ7 (Data# Polling) or DQ6 (toggle) status bits or monitor the Ready/Busy#
(RY/BY#) output to determine whether the operation is complete. To facilitate
programming, an Unlock Bypass mode reduces command sequence overhead
by requiring only two write cycles to program data instead of four.
The Enhanced VersatileI/O (V
IO
) control allows the host system to set the
voltage levels that the device generates and tolerates on all input levels (address,
chip control, and DQ input levels) to the same voltage level that is asserted on
the V
IO
pin. This allows the device to operate in a 1.8 V or 3 V system environ-
ment as required.
Hardware data protection measures include a low V
CC
detector that automat-
ically inhibits write operations during power transitions. Persistent Sector
Protection provides in-system, command-enabled protection of any combina-
tion of sectors using a single power supply at V
CC
. Password Sector Protection
prevents unauthorized write and erase operations in any combination of sectors
through a user-defined 64-bit password.
The Erase Suspend/Erase Resume feature allows the host system to pause an
erase operation in a given sector to read or program any other sector and then
complete the erase operation. The Program Suspend/Program Resume fea-
ture enables the host system to pause a program operation in a given sector to
read any other sector and then complete the program operation.
May 13, 2004 27631A4 S29GLxxxN MirrorBitTM Flash Family 3
Advance Information
The hardware RESET# pin terminates any operation in progress and resets the
device, after which it is then ready for a new operation. The RESET# pin may be
tied to the system reset circuitry. A system reset would thus also reset the device,
enabling the host system to read boot-up firmware from the Flash memory
device.
The device reduces power consumption in the standby mode when it detects
specific voltage levels on CE# and RESET#, or when addresses have been stable
for a specified period of time.
The SecSi (Secured Silicon) Sector provides a 128-word/256-byte area for
code or data that can be permanently protected. Once this sector is protected,
no further changes within the sector can occur.
The Write Protect (WP#/ACC) feature protects the first or last sector by as-
serting a logic low on the WP# pin.
MirrorBit flash technology combines years of Flash memory manufacturing expe-
rience to produce the highest levels of quality, reliability and cost effectiveness.
The device electrically erases all bits within a sector simultaneously via hot-hole
assisted erase. The data is programmed using hot electron injection.
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