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MRF175GU

Part # MRF175GU
Description FET RF 2N-CH 28V 100MA 375-04
Category IC
Availability Out of Stock
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Qty Price
1 + $100.05000



Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

1
MRF175GU MRF175GVMOTOROLA RF DEVICE DATA
The RF MOSFET Line
N–Channel Enhancement–Mode
Designed for broadband commercial and military applications using push pull
circuits at frequencies to 500 MHz. The high power, high gain and broadband
performance of these devices makes possible solid state transmitters for FM
broadcast or TV channel frequency bands.
Guaranteed Performance
MRF175GV @ 28 V, 225 MHz (“V” Suffix)
Output Power — 200 Watts
Power Gain — 14 dB Typ
Efficiency — 65% Typ
MRF175GU @ 28 V, 400 MHz (“U” Suffix)
Output Power — 150 Watts
Power Gain — 12 dB Typ
Efficiency — 55% Typ
100% Ruggedness Tested At Rated Output Power
Low Thermal Resistance
Low C
rss
— 20 pF Typ @ V
DS
= 28 V
MAXIMUM RATINGS
Rating Symbol Value Unit
Drain–Source Voltage V
DSS
65 Vdc
Drain–Gate Voltage
(R
GS
= 1.0 M)
V
DGR
65 Vdc
Gate–Source Voltage V
GS
±40 Vdc
Drain Current — Continuous I
D
26 Adc
Total Device Dissipation @ T
C
= 25°C
Derate above 25°C
P
D
400
2.27
Watts
W/°C
Storage Temperature Range T
stg
65 to +150 °C
Operating Junction Temperature T
J
200 °C
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Case R
θJC
0.44 °C/W
ELECTRICAL CHARACTERISTICS (T
C
= 25°C unless otherwise noted)
Characteristic
Symbol Min Typ Max Unit
OFF CHARACTERISTICS (1)
Drain–Source Breakdown Voltage
(V
GS
= 0, I
D
= 50 mA)
V
(BR)DSS
65 Vdc
Zero Gate Voltage Drain Current
(V
DS
= 28 V, V
GS
= 0)
I
DSS
2.5 mAdc
Gate–Source Leakage Current
(V
GS
= 20 V, V
DS
= 0)
I
GSS
1.0 µAdc
(continued)
Handling and Packaging — MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and
packaging MOS devices should be observed.
Order this document
by MRF175GU/D
SEMICONDUCTOR TECHNICAL DATA
200/150 WATTS, 28 V, 500 MHz
N–CHANNEL MOS
BROADBAND
RF POWER FETs
CASE 375–04, STYLE 2
Motorola, Inc. 1995
D
G
S
(FLANGE)
D
G
REV 7
MRF175GU MRF175GV
2
MOTOROLA RF DEVICE DATA
ELECTRICAL CHARACTERISTICS — continued (T
C
= 25°C unless otherwise noted)
Characteristic
Symbol Min Typ Max Unit
ON CHARACTERISTICS (1)
Gate Threshold Voltage (V
DS
= 10 V, I
D
= 100 mA) V
GS(th)
1.0 3.0 6.0 Vdc
Drain–Source On–Voltage (V
GS
= 10 V, I
D
= 5.0 A) V
DS(on)
0.1 0.9 1.5 Vdc
Forward Transconductance (V
DS
= 10 V, I
D
= 2.5 A) g
fs
2.0 3.0 mhos
DYNAMIC CHARACTERISTICS (1)
Input Capacitance (V
DS
= 28 V, V
GS
= 0, f = 1.0 MHz) C
iss
180 pF
Output Capacitance (V
DS
= 28 V, V
GS
= 0, f = 1.0 MHz) C
oss
200 pF
Reverse Transfer Capacitance (V
DS
= 28 V, V
GS
= 0, f = 1.0 MHz) C
rss
20 pF
FUNCTIONAL CHARACTERISTICS — MRF175GV (2) (Figure 1)
Common Source Power Gain
(V
DD
= 28 Vdc, P
out
= 200 W, f = 225 MHz, I
DQ
= 2.0 x 100 mA)
G
ps
12 14 dB
Drain Efficiency
(V
DD
= 28 Vdc, P
out
= 200 W, f = 225 MHz, I
DQ
= 2.0 x 100 mA)
η 55 65 %
Electrical Ruggedness
(V
DD
= 28 Vdc, P
out
= 200 W, f = 225 MHz, I
DQ
= 2.0 x 100 mA,
VSWR 10:1 at all Phase Angles)
ψ
No Degradation in Output Power
NOTES:
1. Each side of device measured separately.
2. Measured in push–pull configuration.
Figure 1. 225 MHz Test Circuit
C1 — Arco 404, 8.060 pF
C2, C3, C7, C8 — 1000 pF Chip
C4, C9 — 0.1 µF Chip
C5 — 180 pF Chip
C6 — 100 pF and 130 pF Chips in Parallel
C10 — 0.47 µF Chip, Kemet 1215 or Equivalent
L1 — 10 Turns AWG #16 Enamel Wire, Close
L1 — Wound, 1/4 I.D.
L2 — Ferrite Beads of Suitable Material for
L2 — 1.52.0 µH Total Inductance
Board material — .062 fiberglass (G10),
Two sided, 1 oz. copper, ε
r
5
Unless otherwise noted, all chip capacitors
are ATC Type 100 or Equivalent.
R1 — 100 Ohms, 1/2 W
R2 — 1.0 k Ohm, 1/2 W
T1 — 4:1 Impedance Ratio RF Transformer.
T1 — Can Be Made of 25 Ohm Semirigid Coax,
T1 — 4752 Mils O.D.
T2 — 1:9 Impedance Ratio RF Transformer.
T2 — Can Be Made of 1518 Ohms Semirigid
T2 — Coax, 6290 Mils O.D.
NOTE: For stability, the input transformer T1 should be loaded
NOTE: with ferrite toroids or beads to increase the common
NOTE: mode inductance. For operation below 100 MHz. The
NOTE: same is required for the output transformer.
BIAS 0 6 V
R1
C3 C4
R2
C1 C2
T1
C5
D.U.T.
C6
T2
C7
L1
C8 C9
L2
C10
+
28 V
3
MRF175GU MRF175GVMOTOROLA RF DEVICE DATA
ELECTRICAL CHARACTERISTICS (T
C
= 25°C unless otherwise noted)
Characteristic
Symbol Min Typ Max Unit
FUNCTIONAL CHARACTERISTICS — MRF175GU (1) (Figure 2)
Common Source Power Gain
(V
DD
= 28 Vdc, P
out
= 150 W, f = 400 MHz, I
DQ
= 2.0 x 100 mA)
G
ps
10 12 dB
Drain Efficiency
(V
DD
= 28 Vdc, P
out
= 150 W, f = 400 MHz, I
DQ
= 2.0 x 100 mA)
η 50 55 %
Electrical Ruggedness
(V
DD
= 28 Vdc, P
out
= 150 W, f = 400 MHz, I
DQ
= 2.0 x 100 mA,
VSWR 10:1 at all Phase Angles)
ψ
No Degradation in Output Power
NOTE:
1. Measured in push–pull configuration.
Figure 2. 400 MHz Test Circuit
B1 — Balun 50 Semi Rigid Coax 0.086 O.D. 2 Long
B2 — Balun 50 Semi Rigid Coax 0.141 O.D. 2 Long
C1, C2, C8, C9 — 270 pF ATC Chip Cap
C3, C5, C7 — 1.020 pF Trimmer Cap
C4 — 15 pF ATC Chip Cap
C6 — 33 pF ATC Chip Cap
C10, C12, C13, C16, C17 — 0.01 µF Ceramic Cap
C11 — 1.0 µF 50 V Tantalum
C14, C15 — 680 pF Feedthru Cap
C18 — 20 µF 50 V Tantalum
L1, L2 — Hairpin Inductor #18 Wire
L3, L4 — 12 Turns #18 Enameled Wire 0.340I.D.
L5 — Ferroxcube VK200 20/4B
L6 — 3 Turns #16 Enameled Wire 0.340 I.D.
R1 — 1.0 k 1/4 W Resistor
R2, R3 — 10 k 1/4 W Resistor
Z1, Z2 — Microstrip Line 0.400 x 0.250
Z3, Z4 — Microstrip Line 0.870 x 0.250
Z5, Z6 — Microstrip Line 0.500 x 0.250
Board material — 0.060 Teflon–fiberglass,
ε
r
= 2.55, copper clad both sides, 2 oz. copper.
BIAS
C10 C11
R1
C12 C13
C14 C15
L5 L6
C18
28 V
B1
C3 C4
C5
C6
C7
B2
C2
L2
R3
L4
C16 C17
BA
Z2
Z1 Z3 Z5
Z4 Z6
0.180
0.200
A
B
D.U.T.
R2
L3
C9
C1
L1
C8
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