LMC7221
SNOS748E –SEPTEMBER 1999–REVISED MARCH 2013
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Absolute Maximum Ratings
(1)
ESD Tolerance
(2)
2 kV
Differential Input Voltage V
+
+0.3V, V
−
−0.3V
Voltage at Input V
+
+0.3V, V
−
−0.3V
Voltage at Output Pin 15V
Supply Voltage (V
+
–V
−
) 16V
Current at Input Pin
(3)
±5 mA
Current at Output Pin
(4) (5)
±30 mA
Current at Power Supply Pin 40 mA
Lead Temperature (soldering, 10 sec.) 260°C
Junction Temperature
(6)
150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(3) All limits are specified by testing or statistical analysis.
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30 mA may adversely affect reliability.
(5) Limiting input pin current is only necessary for input voltages which exceed the absolute maximum input voltage rating.
(6) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
– T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
Operating Ratings
(1)
Supply Voltage 2.7 ≤ V
CC
≤ 15V
Temperature Range
(2)
LMC7221AI, LMC7221BI −40°C to +85°C
Thermal Resistance (θ
JA
)
8-Pin SOIC 180°C/W
5-Pin SOT-23 325°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
– T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
2.7V Electrical Characteristics
Unless otherwise specified, all limits ensured for T
J
= 25°C, V
+
= 2.7V, V
−
= 0V, V
CM
= V
O
= V
+
/2. Boldface limits apply at the
temperature extremes.
Parameter Test Conditions LMC7221AI LMC7221BI Units
Typ
(1)
Limit
(2)
Limit
(2)
V
OS
Input Offset Voltage 3 5 15 mV
8 18 max
TCV
OS
Input Offset Voltage 1.0
μV/°C
Temperature Drift
Input Offset Voltage Average
(3)
3.3
μV/Month
Drift
I
B
Input Current 0.04 pA
I
OS
Input Offset Current 0.02 pA
CMRR Common Mode Rejection Ratio 0V ≤ V
CM
≤ 2.7V 75 dB
PSRR Power Supply Rejection Ratio 2.7V ≤ V
+
≤ 15V 80 dB
(1) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
(2) All limits are specified by testing or statistical analysis.
(3) C
L
includes the probe and test jig capacitance.
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