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LTC1538CG-AUX

Part # LTC1538CG-AUX
Description IC REG CTRLR BUCK PWM CM 28-SSOP
Category IC
Availability In Stock
Qty 85
Qty Price
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18 - 35 $7.43994
36 - 53 $7.01480
54 - 71 $6.51881
72 + $5.81024
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Linear Technology
Date Code: 9825
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

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LTC1538-AUX/LTC1539
APPLICATIONS INFORMATION
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Automotive Considerations: Plugging into the
Cigarette Lighter
As battery-powered devices go mobile, there is a natural
interest in plugging into the cigarette lighter in order to
conserve or even recharge battery packs during operation.
But before you connect, be advised: you are plugging into
the supply from hell. The main battery line in an automo-
bile is the source of a number of nasty potential transients,
including load dump, reverse battery and double battery.
Load dump is the result of a loose battery cable. When the
cable breaks connection, the field collapse in the alternator
can cause a positive spike as high as 60V which takes
several hundred milliseconds to decay. Reverse battery is
just what it says, while double battery is a consequence of
tow-truck operators finding that a 24V jump start cranks
cold engines faster than 12V.
The network shown in Figure 12 is the most straightfor-
ward approach to protect a DC/DC converter from the
ravages of an automotive battery line. The series diode
prevents current from flowing during reverse battery,
while the transient suppressor clamps the input voltage
during load dump. Note that the transient suppressor
should not conduct during double battery operation, but
must still clamp the input voltage below breakdown of the
converter. Although the LTC1538-AUX/LTC1539 has a
maximum input voltage of 36V, most applications will be
limited to 30V by the MOSFET BV
DSS
.
Design Example
As a design example, assume V
IN
= 12V(nominal), V
IN
=
22V(max), V
OUT
= 3.3V, I
MAX
= 3A and f = 250kHz, R
SENSE
and C
OSC
can immediately be calculated:
R
SENSE
= 100mV/3A = 0.033
C
OSC
= (1.37(10
4
)/250) – 11 43pF
Referring to Figure 3, a 10µH inductor falls within the
recommended range. To check the actual value of the
ripple current the following equation is used :
I
V
fL
V
V
L
OUT OUT
IN
=
()()
1
The highest value of the ripple current occurs at the
maximum input voltage:
I
V
kHz H
V
V
A
L
=
µ
=
33
250 10
1
33
22
112
.
()
.
.
The power dissipation on the topside MOSFET can be
easily estimated. Using a Siliconix Si4412DY for example;
R
DS(ON)
= 0.042, C
RSS
= 100pF. At maximum input
voltage with T(estimated) = 50°C:
The most stringent requirement for the synchronous
N-channel MOSFET is with V
OUT
= 0V (i.e. short circuit).
During a continuous short circuit, the worst-case dissipa-
tion rises to:
P
SYNC
= [I
SC(AVG)
]
2
(1 + δ)R
DS(ON)
1538 F12
50A I
PK
RATING
LTC1538-AUX/
LTC1539
TRANSIENT VOLTAGE
SUPPRESSOR
GENERAL INSTRUMENT
1.5KA24A
V
IN
12V
Figure 12. Automotive Application Protection
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LTC1538-AUX/LTC1539
APPLICATIONS INFORMATION
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With the 0.033 sense resistor I
SC(AVG)
= 4A will result,
increasing the Si4412DY dissipation to 950mW at a die
temperature of 105°C.
C
IN
will require an RMS current rating of at least 1.5A at
temperature and C
OUT
will require an ESR of 0.03 for low
output ripple. The output ripple in continuous mode will be
highest at the maximum input voltage. The output voltage
ripple due to ESR is approximately:
V
ORIPPLE
= R
ESR
(I
L
) = 0.03(1.12A) = 34mV
P-P
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of the
LTC1538-AUX/LTC1539. These items are also illustrated
graphically in the layout diagram of Figure 13. Check the
following in your layout:
1. Are the high current power ground current paths using
or running through any part of signal ground? The
LTC1438/LTC1438X/LTC1439 IC’s have their sensitive
pins on one side of the package. These pins include the
signal ground for the reference, the oscillator input, the
voltage and current sensing for both controllers and the
low battery/comparator input. The signal ground area
used on this side of the IC must return to the bottom
plates of all of the output capacitors. The high current
power loops formed by the input capacitors and the
ground returns to the sources of the bottom
N-channel MOSFETs, anodes of the Schottky diodes,
and (-) plates of C
IN
, should be as short as possible and
tied through a low resistance path to the bottom plates
of the output capacitors for the ground return.
2. Do the LTC1538-AUX/LTC1539 SENSE
1 and V
OSENSE2
pins connect to the (+) plates of C
OUT
? In adjustable
applications, the resistive divider R1/R2 must be con-
nected between the (+) plate of C
OUT
and signal ground
and the HF decoupling capacitor should be as close as
possible to the LTC1538-AUX/LTC1539.
3. Are the SENSE
and SENSE
+
leads routed together with
minimum PC trace spacing? The filter capacitors be-
tween SENSE
+
1 (SENSE
+
2) and SENSE
1 (SENSE
2)
should be as close as possible to the LTC1538-AUX/
LTC1539.
4. Do the (+) plates of C
IN
connect to the drains of the
topside MOSFETs as closely as possible? This capaci-
tor provides the AC current to the MOSFETs.
5. Is the INTV
CC
decoupling capacitor connected closely
between
INTV
CC
and the power ground pin? This ca-
pacitor carries the MOSFET driver peak currents.
6. Keep the switching nodes, SW1 (SW2), away from
sensitive small-signal nodes. Ideally the switch nodes
should be placed at the furthest point from the
LTC1538-AUX/LTC1539.
7. Use a low impedance source such as a logic gate to drive
the PLLIN pin and keep the lead as short as possible.
PC BOARD LAYOUT SUGGESTIONS
Switching power supply printed circuit layouts are cer-
tainly among the most difficult analog circuits to design.
The following suggestions will help to get a reasonably
close solution on the first try.
The output circuits, including the external switching
MOSFETs, inductor, secondary windings, sense resistor,
input capacitors and output capacitors all have very large
voltage and/or current levels associated with them. These
components and the radiated fields (electrostatic and/or
electromagnetic) must be kept away from the very sensi-
tive control circuitry and loop compensation components
required for a current mode switching regulator.
The electrostatic or capacitive coupling problems can be
reduced by increasing the distance from the radiator,
typically a very large or very fast moving voltage signal.
The signal points that cause problems generally include:
the “switch” node, any secondary flyback winding voltage
and any nodes which also move with these nodes. The
switch, MOSFET gate, and boost nodes move between VIN
and Pgnd each cycle with less than a 100ns transition time.
The secondary flyback winding output has an AC signal
component of –V
IN
times the turns ratio of the trans-
former, and also has a similar < 100ns transition time. The
feedback control input signals need to have less than a few
millivolts of noise in order for the regulator to perform
properly. A rough calculation shows that 80dB of isolation
at 2MHz is required from the switch node for low noise
switcher operation. The situation is worse by a factor of the
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LTC1538-AUX/LTC1539
APPLICATIONS INFORMATION
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turns ratio for the secondary flyback winding. Keep these
switch-node-related PC traces small and away from the
“quiet” side of the IC (not just above and below each other
on the opposite side of the board).
The electromagnetic or current-loop induced feedback
problems can be minimized by keeping the high AC-
current (transmitter) paths and the feedback circuit (re-
ceiver) path small and/or short. Maxwell’s equations are at
work here, trying to disrupt our clean flow of current and
voltage information from the output back to the controller
input. It is crucial to understand and minimize the suscep-
tibility of the control input stage as well as the more
obvious reduction of radiation from the high-current out-
put stage(s). An inductive transmitter depends upon the
frequency, current amplitude and the size of the current
loop to determine the radiation characteristic of the gen-
erated field. The current levels are set in the output stage
once the input voltage, output voltage and inductor value(s)
have been selected. The frequency is set by the output-
stage transition times. The only parameter over which we
have some control is the size of the antenna we create on
the PC board, i.e., the loop. A loop is formed with the input
capacitance, the top MOSFET, the Schottky diode, and the
path from the Schottky diode’s ground connection and the
input capacitor’s ground connection. A second path is
formed when a secondary winding is used comprising the
secondary output capacitor, the secondary winding and
the rectifier diode or switching MOSFET (in the case of a
synchronous approach). These “loops” should be kept as
small and tightly packed as possible in order to minimize
their “far field” radiation effects. The radiated field pro-
duced is picked up by the current comparator input filter
circuit(s), as well as by the voltage feedback circuit(s). The
current comparator’s filter capacitor placed across the
sense pins attenuates the radiated current signal. It is
important to place this capacitor immediately adjacent to
the IC sense pins. The voltage sensing input(s) minimizes
the inductive pickup component by using an input capaci-
tance filter to SGND. The capacitors in both case serve to
integrate the induced current, reducing the susceptibility
to both the “loop” radiated magnetic fields and the trans-
former or inductor leakage fields.
The capacitor on INTV
CC
acts as a reservoir to supply the
high transient currents to the bottom gates and to re-
charge the boost capacitor. This capacitor should be a
4.7µF tantalum capacitor placed as close as possible to the
INTV
CC
and PGND pins of the IC. Peak current driving the
MOSFET gates exceeds 1A. The power ground pin of the
IC, connected to this capacitor, should connect directly to
the lower plates of the output capacitors to minimize the
AC ripple on the INTV
CC
IC power supply.
The previous instructions will yield a PC layout which has
three separate ground regions returning separately to the
bottom plates of the output capacitors: a signal ground, a
MOSFET gate/INTV
CC
ground and the ground from the
input capacitors, Schottky diode and synchronous
MOSFET. In practice, this may produce a long power
ground path from the input and output capacitors. A long,
low resistance path between the input and output capaci-
tor power grounds will not upset the operation of the
switching controllers as long as the signal and power
grounds from the IC pins does not “tap in” along this path.
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