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LMC6482IMM

Part # LMC6482IMM
Description CMOS DUAL RAIL-TO-RAIL INPUTAND OUTPUT - Tape and Reel
Category IC
Availability Out of Stock
Qty 0
Qty Price
1 + $0.37305



Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LMC6482AIM NRND SOIC D 8 95 TBD Call TI Call TI -40 to 85 LMC64
82AIM
LMC6482AIM/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br)
SN | CU SN Level-1-260C-UNLIM -40 to 85 LMC64
82AIM
LMC6482AIMX NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 85 LMC64
82AIM
LMC6482AIMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
SN | CU SN Level-1-260C-UNLIM -40 to 85 LMC64
82AIM
LMC6482AIN NRND PDIP P 8 40 TBD Call TI Call TI -40 to 85 LMC64
82AIN
LMC6482AIN/NOPB ACTIVE PDIP P 8 40 Green (RoHS
& no Sb/Br)
SN | CU SN Level-1-NA-UNLIM -40 to 85 LMC64
82AIN
LMC6482IM NRND SOIC D 8 95 TBD Call TI Call TI -40 to 85 LMC64
82IM
LMC6482IM/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br)
SN | CU SN Level-1-260C-UNLIM -40 to 85 LMC64
82IM
LMC6482IMM NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 85 A10
LMC6482IMM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 A10
LMC6482IMMX NRND VSSOP DGK 8 3500 TBD Call TI Call TI -40 to 85 A10
LMC6482IMMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 A10
LMC6482IMX NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 85 LMC64
82IM
LMC6482IMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
SN | CU SN Level-1-260C-UNLIM -40 to 85 LMC64
82IM
LMC6482IN NRND PDIP P 8 40 TBD Call TI Call TI -40 to 85 LMC6482IN
LMC6482IN/NOPB ACTIVE PDIP P 8 40 Green (RoHS
& no Sb/Br)
CU SN Level-1-NA-UNLIM -40 to 85 LMC6482IN
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
Addendum-Page 2
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
LMC6482AIMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMC6482AIMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMC6482IMM VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMC6482IMM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMC6482IMMX VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMC6482IMMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMC6482IMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMC6482IMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 26-Mar-2013
Pack Materials-Page 1
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