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LMC6482IMM

Part # LMC6482IMM
Description CMOS DUAL RAIL-TO-RAIL INPUTAND OUTPUT - Tape and Reel
Category IC
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

LMC6482
www.ti.com
SNOS674D NOVEMBER 1997REVISED MARCH 2013
Figure 62. Pulse Response of
LMC6482 Circuit in Figure 61
COMPENSATING FOR INPUT CAPACITANCE
It is quite common to use large values of feedback resistance with amplifiers that have ultra-low input current,
like the LMC6482. Large feedback resistors can react with small values of input capacitance due to transducers,
photo diodes, and circuits board parasitics to reduce phase margins.
Figure 63. Canceling the Effect of Input Capacitance
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LMC6482
SNOS674D NOVEMBER 1997REVISED MARCH 2013
www.ti.com
The effect of input capacitance can be compensated for by adding a feedback capacitor. The feedback capacitor
(as in Figure 63), C
f
, is first estimated by:
(1)
or
R
1
C
IN
R
2
C
f
(2)
which typically provides significant overcompensation.
Printed circuit board stray capacitance may be larger or smaller than that of a bread-board, so the actual
optimum value for C
f
may be different. The values of C
f
should be checked on the actual circuit. (Refer to the
LMC660 quad CMOS amplifier data sheet for a more detailed discussion.)
PRINTED-CIRCUIT-BOARD LAYOUT FOR HIGH-IMPEDANCE WORK
It is generally recognized that any circuit which must operate with less than 1000pA of leakage current requires
special layout of the PC board. When one wishes to take advantage of the ultra-low input current of the
LMC6482, typically less than 20fA, it is essential to have an excellent layout. Fortunately, the techniques of
obtaining low leakages are quite simple. First, the user must not ignore the surface leakage of the PC board,
even through it may sometimes appear acceptably low, because under conditions of high humidity or dust or
contamination, the surface leakage will be appreciable.
To minimize the effect of any surface leakage, lay out a ring of foil completely surrounding the LM6482's inputs
and the terminals of capacitors, diodes, conductors, resistors, relay terminals, etc. connected to the op-amp's
inputs, as in Figure 64. To have a significant effect, guard rings should be placed on both the top and bottom of
the PC board. This PC foil must then be connected to a voltage which is at the same voltage as the amplifier
inputs, since no leakage current can flow between two points at the same potential. For example, a PC board
trace-to-pad resistance of 10
12
Ω, which is normally considered a very large resistance, could leak 5pA if the trace
were a 5V bus adjacent to the pad of the input. This would cause a 250 times degradation from the LMC6482's
actual performance. However, if a guard ring is held within 5 mV of the inputs, then even a resistance of 10
11
Ω
would cause only 0.05pA of leakage current. See Figure 65 through Figure 67 for typical connections of guard
rings for standard op-amp configurations.
Figure 64. Example of Guard Ring in P.C. Board Layout Typical Connections of Guard Rings
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LMC6482
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SNOS674D NOVEMBER 1997REVISED MARCH 2013
Figure 65. Inverting Amplifier Typical Connections of Guard Rings
Figure 66. Non-Inverting Amplifier Typical Connections of Guard Rings
Figure 67. Follower Typical Connections of Guard Rings
The designer should be aware that when it is inappropriate to lay out a PC board for the sake of just a few
circuits, there is another technique which is even better than a guard ring on a PC board: Don't insert the
amplifier's input pin into the board at all, but bend it up in the air and use only air as an insulator. Air is an
excellent insulator. In this case you may have to forego some of the advantages of PC board construction, but
the advantages are sometimes well worth the effort of using point-to-point up-in-the-air wiring. See Figure 68.
(Input pins are lifted out of PC board and soldered directly to components. All other pins connected to PC board.)
Figure 68. Air Wiring
OFFSET VOLTAGE ADJUSTMENT
Offset voltage adjustment circuits are illustrated in Figure 69 and Figure 70. Large value resistances and
potentiometers are used to reduce power consumption while providing typically ±2.5mV of adjustment range,
referred to the input, for both configurations with V
S
= ±5V.
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