*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMC6482AIMX SOIC D 8 2500 367.0 367.0 35.0
LMC6482AIMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMC6482IMM VSSOP DGK 8 1000 210.0 185.0 35.0
LMC6482IMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMC6482IMMX VSSOP DGK 8 3500 367.0 367.0 35.0
LMC6482IMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LMC6482IMX SOIC D 8 2500 367.0 367.0 35.0
LMC6482IMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 26-Mar-2013
Pack Materials-Page 2