
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMC555CMM VSSOP DGK 8 1000 210.0 185.0 35.0
LMC555CMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMC555CMMX VSSOP DGK 8 3500 367.0 367.0 35.0
LMC555CMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LMC555CMX SOIC D 8 2500 367.0 367.0 35.0
LMC555CMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMC555CTP/NOPB DSBGA YPB 8 250 210.0 185.0 35.0
LMC555CTPX/NOPB DSBGA YPB 8 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 26-Mar-2013
Pack Materials-Page 2