Freelance Electronics Components Distributor
Closed Dec 25th-26th
800-300-1968

We Stock Hard to Find Parts
My Account | My Orders | My Cart
Questions? (800) 300-1968

LMC555CMMX

Part # LMC555CMMX
Description Standard Timer Single 8-Pin MSOP T/R - R01
Category IC
Availability Out of Stock
Qty 0
Qty Price
1 + $0.41000

Related Items

LMC555CM
National Semiconductor Corp
IC
LMC555CM
$0.34055
LMC555CMX
National Semiconductor Corp
IC
LMC555CMX
$0.34736
008-25424
Fairchild Semiconductor
IC
008-25424
$11.58351
01-6945-9
Harris Corporation
IC
01-6945-9
 
010-143121-0002
Motorola Corp
IC
010-143121-0002
 
01295-672141D
Texas Instruments
IC
01295-672141D
 


Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

PACKAGE OPTION ADDENDUM
www.ti.com
15-May-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
LMC555CM ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 85 LMC
555CM
LMC555CM/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 LMC
555CM
LMC555CMM ACTIVE VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 85 ZC5
LMC555CMM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 ZC5
LMC555CMMX ACTIVE VSSOP DGK 8 3500 TBD Call TI Call TI -40 to 85 ZC5
LMC555CMMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 ZC5
LMC555CMX ACTIVE SOIC D 8 2500 TBD Call TI Call TI -40 to 85 LMC
555CM
LMC555CMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 LMC
555CM
LMC555CN ACTIVE PDIP P 8 40 TBD Call TI Call TI -40 to 85 LMC
555CN
LMC555CN/NOPB ACTIVE PDIP P 8 40 Green (RoHS
& no Sb/Br)
Call TI Level-1-NA-UNLIM -40 to 85 LMC
555CN
LMC555CTP/NOPB ACTIVE DSBGA YPB 8 250 Green (RoHS
& no Sb/Br)
SNAGCU Level-1-260C-UNLIM -40 to 85 F
02
LMC555CTPX/NOPB ACTIVE DSBGA YPB 8 3000 Green (RoHS
& no Sb/Br)
SNAGCU Level-1-260C-UNLIM -40 to 85 F
02
LMC555IM/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 LMC
555IM
LMC555IMX/NOPB ACTIVE SOIC D 8 2500 TBD Call TI Call TI -40 to 85 LMC
555IM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com
15-May-2013
Addendum-Page 2
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
LMC555CMM VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMC555CMM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMC555CMMX VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMC555CMMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMC555CMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMC555CMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMC555CTP/NOPB DSBGA YPB 8 250 178.0 8.4 1.5 1.5 0.66 4.0 8.0 Q1
LMC555CTPX/NOPB DSBGA YPB 8 3000 178.0 8.4 1.5 1.5 0.66 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 26-Mar-2013
Pack Materials-Page 1
PREVIOUS1234567NEXT
Address
Freelance Electronics
13197 Sandoval Street
Santa Fe Springs, CA 90670
 
Hours of Operation  (Holiday Hours)
Monday-Friday 7:30am-4:30pm PST
(Deadline for next day shipment 2:00pm PST)
Seal
Government Cage code#-1V4R6
Duns Number# 788130532
Certified Small Disadvantaged Business
Customer Service
Company
Information
Connect with Us
Twitter Facebook Instagra,
This site is protected by Trustwave's Trusted Commerce program