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CC2540F128RHAR

Part # CC2540F128RHAR
Description SimpleLink Bluetooth low energy wireless MCU USB 40-VQFN
Category IC
Availability Out of Stock
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

CC2540F128, CC2540F256
www.ti.com
SWRS084 OCTOBER 2010
2.4-GHz Bluetooth
®
low energy System-on-Chip
Check for Samples: CC2540F128, CC2540F256
1
FEATURES
Peripherals
23456
True Single-Chip BLE Solution: CC2540 Can
12-Bit ADC with Eight Channels and
Run Both Application and BLE Protocol Stack, Configurable Resolution
Includes Peripherals to Interface With Wide
Integrated High-Performance Op-Amp and
Range of Sensors, Etc.
Ultralow-Power Comparator
6-mm × 6-mm Package
General-Purpose Timers (One 16-Bit, Two
RF 8-Bit)
Bluetooth low energy technology 21 General-Purpose I/O Pins (19× 4 mA,
Compatible 20 mA)
Excellent Link Budget (up to 97 dB), 32-kHz Sleep Timer With Capture
Enabling Long-Range Applications Without
Two Powerful USARTs With Support for
External Front End
Several Serial Protocols
Accurate Digital Received Signal-Strength
Full-Speed USB Interface
Indicator (RSSI)
IR Generation Circuitry
Suitable for Systems Targeting Compliance
Powerful Five-Channel DMA
With Worldwide Radio Frequency
AES Security Coprocessor
Regulations: ETSI EN 300 328 and EN 300
Battery Monitor and Temperature Sensor
440 Class 2 (Europe), FCC CFR47 Part 15
(US), and ARIB STD-T66 (Japan) Each CC2540 Contains a Unique 48-bit
IEEE Address
Layout
Development Tools
Few External Components
CC2540 Mini Development Kit
Reference Design Provided
Royalty-Free Bluetooth low energy Protocol
6-mm × 6-mm QFN40 Package
Stack
Low Power
SmartRF™ Software
Active Mode RX Down to 19.6 mA
Supported by IAR Embedded Workbench™
Active Mode TX (–6 dBm): 24 mA
Software for 8051
Power Mode 1 (3-ms Wake-Up): 235 mA
Power Mode 2 (Sleep Timer On): 0.9 mA
APPLICATIONS
Power Mode 3 (External Interrupts): 0.4 mA
2.4-GHz Bluetooth low energy Systems
Wide Supply Voltage Range (2 V–3.6 V)
Mobile Phone Accessories
Sports and Leisure Equipment
Full RAM and Register Retention in All
Power Modes
Consumer Electronics
Human Interface Devices (Keyboard, Mouse,
Microcontroller
Remote Control)
High-Performance and Low-Power 8051
USB Dongles
Microcontroller Core
Health Care and Medical
In-System-Programmable Flash, 128 KB or
256 KB
8-KB SRAM
A
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2SmartRF is a trademark of Texas Instruments.
3Bluetooth is a registered trademark of Bluetooth SIG, Inc.
4Supported by IAR Embedded Workbench is a trademark of IAR Systems AB.
5ZigBee is a registered trademark of ZigBee Alliance.
6All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
RESET
WATCHDOG
TIMER
IRQ CTRL
FLASH CTRL
DEBUG
INTERFACE
CLOCK MUX
and
CALIBRATION
DMA
8051 CPU
CORE
32-MHz
CRYSTAL OSC
OP-AMP
32.768-kHz
CRYSTAL OSC
HIGH-
SPEED
RC-OSC
POWER MANAGEMENT CONTROLLER
USART 0
USB
USART 1
TIMER 1 (16-Bit)
TIMER 3 (8-Bit)
TIMER 4 (8-Bit)
TIMER 2
(BLE LL TIMER)
FLASH
SRAM
SRAM
FIFOCTRL
1 KB SRAM
ON-CHIP VOLTAGE
REGULATOR
POWER-ON RESET
BROWN OUT
VDD (2 V–3.6 V)
DCOUPL
RESET_N
XOSC_Q2
XOSC_Q1
P2_4
P1_7
P0_7
P2_3
P1_6
P0_6
P2_2
P1_5
P0_5
P1_2
P0_2
P2_1
P1_4
P0_4
P1_1
P0_1
P2_0
P1_3
P0_3
P1_0
P0_0
MODULATOR
DEMODULATOR
RECEIVE
TRANSMIT
FREQUENCY
SYNTHESIZER
SYNTH
RF_P
RF_N
B0301-05
RADIO REGISTERS
SFR Bus
SFR Bus
DS
ADC
AUDIO/DC
AES
ENCRYPTION
AND
DECRYPTION
MEMORY
ARBITRATOR
FLASH
RAM
UNIFIED
SFR
IRAM
XRAM
PDATA
SLEEP TIMER
32-kHz
RC-OSC
I/O CONTROLLER
DIGITAL
ANALOG
MIXED
ANALOG COMPARATOR
USB_N
USB_P
Radio Arbiter
Link Layer Engine
CC2540F128, CC2540F256
SWRS084 OCTOBER 2010
www.ti.com
DESCRIPTION
The CC2540 is a cost-effective, low-power, true system-on-chip (SoC) for Bluetooth low energy applications. It
enables robust BLE master or slave nodes to be built with very low total bill-of-material costs. The CC2540
combines an excellent RF transceiver with an industry-standard enhanced 8051 MCU, in-system programmable
flash memory, 8-KB RAM, and many other powerful supporting features and peripherals. The CC2540 is suitable
for systems where very low power consumption is required. Very low-power sleep modes are available. Short
transition times between operating modes further enable low power consumption.
The CC2540 comes in two different versions: CC2540F128/F256, with 128 and 256 KB of flash memory,
respectively.
Combined with the Bluetooth low energy protocol stack from Texas Instruments, the CC2540F128/F256 forms
the market’s most flexible and cost-effective single-mode Bluetooth low energy solution.
2 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): CC2540F128 CC2540F256
CC2540F128, CC2540F256
www.ti.com
SWRS084 OCTOBER 2010
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS
(1)
MIN MAX UNIT
Supply voltage All supply pins must have the same voltage –0.3 3.9 V
–0.3 VDD + 0.3,
Voltage on any digital pin V
3.9
Input RF level 10 dBm
Storage temperature range –40 85 °C
All pads, according to human-body model, JEDEC STD 22, method
2 kV
A114
ESD
(2)
According to charged-device model, JEDEC STD 22, method C101 500 V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) CAUTION: ESD sensitive device. Precautions should be used when handing the device in order to prevent permanent damage.
RECOMMENDED OPERATING CONDITIONS
MIN MAX UNIT
Operating ambient temperature range, T
A
–40 85 °C
Operating supply voltage 2 3.6 V
ELECTRICAL CHARACTERISTICS
Measured on Texas Instruments CC2540 EM reference design with T
A
= 25°C and VDD = 3 V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Power mode 1. Digital regulator on; 16-MHz RCOSC and
32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD 235
and sleep timer active; RAM and register retention
Power mode 2. Digital regulator off; 16-MHz RCOSC and
µA
32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, and 0.9
I
core
Core current consumption
sleep timer active; RAM and register retention
Power mode 3. Digital regulator off; no clocks; POR active;
0.4
RAM and register retention
Low MCU activity: 32-MHz XOSC running. No radio or
6.7 mA
peripherals. No flash access, no RAM access.
Timer 1. Timer running, 32-MHz XOSC used 90 mA
Timer 2. Timer running, 32-MHz XOSC used 90 mA
Peripheral current consumption
Timer 3. Timer running, 32-MHz XOSC used 60 mA
I
peri
(Adds to core current I
core
for each
Timer 4. Timer running, 32-MHz XOSC used 70 mA
peripheral unit activated)
Sleep timer, including 32.753-kHz RCOSC 0.6 mA
ADC, when converting 1.2 mA
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): CC2540F128 CC2540F256
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