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LM311P

Part # LM311P
Description SINGLE STROBED DIFFERENTIAL COMPARATOR
Category IC
Availability In Stock
Qty 35
Qty Price
1 + $0.39395
Manufacturer Available Qty
Texas Instruments
Date Code: 0327
  • Shipping Freelance Stock: 20
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Texas Instruments
  • Shipping Freelance Stock: 15
    Ships Immediately



Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

LM111, LM211, LM311
DIFFERENTIAL COMPARATORS WITH STROBES
SLCS007H – SEPTEMBER 1973 – REVISED AUGUST 2003
16
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
APPLICATION INFORMATION
300
V
CC+
V
CC–
100 k
Output
100 k
47
10 k
620
Input
0.1 µF 300
620
1
2
BAL/STRB
BAL/STRB
Figure 28. Switching Power Amplifier
V+
0.22 µF
300 k
620
1
V
CC–
2
V
CC–
620
620
620
620
620
39 k
510
510
15 k
15 k
39 k
300 k
Outputs
V
CC+
Input
Reference
BAL/STRB
BAL/STRB
Figure 29. Switching Power Amplifiers
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
JM38510/10304BPA ACTIVE CDIP JG 8 1 None A42 SNPB Level-NC-NC-NC
LM111FKB ACTIVE LCCC FK 20 1 None POST-PLATE Level-NC-NC-NC
LM111JG ACTIVE CDIP JG 8 1 None A42 SNPB Level-NC-NC-NC
LM111JGB ACTIVE CDIP JG 8 1 None A42 SNPB Level-NC-NC-NC
LM211D ACTIVE SOIC D 8 75 Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
LM211DR ACTIVE SOIC D 8 2500 Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
LM211P ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
LM211PW ACTIVE TSSOP PW 8 150 Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
LM211PWR ACTIVE TSSOP PW 8 2000 Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
LM211QD ACTIVE SOIC D 8 75 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
LM211QDR ACTIVE SOIC D 8 2500 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
LM311D ACTIVE SOIC D 8 75 Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
LM311DR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
LM311P ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
LM311PSR ACTIVE SO PS 8 2000 Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
LM311PW ACTIVE TSSOP PW 8 150 Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
LM311PWLE OBSOLETE TSSOP PW 8 None Call TI Call TI
LM311PWR ACTIVE TSSOP PW 8 2000 Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
LM311Y OBSOLETE XCEPT Y 0 None Call TI Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
PACKAGE OPTION ADDENDUM
www.ti.com
25-Feb-2005
Addendum-Page 1
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
25-Feb-2005
Addendum-Page 2
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