PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
JM38510/10304BPA ACTIVE CDIP JG 8 1 None A42 SNPB Level-NC-NC-NC
LM111FKB ACTIVE LCCC FK 20 1 None POST-PLATE Level-NC-NC-NC
LM111JG ACTIVE CDIP JG 8 1 None A42 SNPB Level-NC-NC-NC
LM111JGB ACTIVE CDIP JG 8 1 None A42 SNPB Level-NC-NC-NC
LM211D ACTIVE SOIC D 8 75 Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
LM211DR ACTIVE SOIC D 8 2500 Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
LM211P ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
LM211PW ACTIVE TSSOP PW 8 150 Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
LM211PWR ACTIVE TSSOP PW 8 2000 Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
LM211QD ACTIVE SOIC D 8 75 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
LM211QDR ACTIVE SOIC D 8 2500 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
LM311D ACTIVE SOIC D 8 75 Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
LM311DR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
LM311P ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
LM311PSR ACTIVE SO PS 8 2000 Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
LM311PW ACTIVE TSSOP PW 8 150 Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
LM311PWLE OBSOLETE TSSOP PW 8 None Call TI Call TI
LM311PWR ACTIVE TSSOP PW 8 2000 Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
LM311Y OBSOLETE XCEPT Y 0 None Call TI Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
PACKAGE OPTION ADDENDUM
www.ti.com
25-Feb-2005
Addendum-Page 1
