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LM2574HVN-5.0

Part # LM2574HVN-5.0
Description IC REG BUCK 5V 0.5A 8-DIP
Category IC
Availability Out of Stock
Qty 0
Qty Price
1 + $1.41000

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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
LM2574HVMX-ADJ ACTIVE SOIC NPA 14 1000 TBD Call TI Call TI -40 to 125 LM2574HVM
-ADJ P+
LM2574HVMX-ADJ/NOPB ACTIVE SOIC NPA 14 1000 Green (RoHS
& no Sb/Br)
CU SN Level-3-260C-168 HR -40 to 125 LM2574HVM
-ADJ P+
LM2574HVN-12 ACTIVE PDIP P 8 40 TBD Call TI Call TI -40 to 125 LM2574HVN
-12 P+
LM2574HVN-12/NOPB ACTIVE PDIP P 8 40 Green (RoHS
& no Sb/Br)
Call TI Level-1-NA-UNLIM -40 to 125 LM2574HVN
-12 P+
LM2574HVN-15 ACTIVE PDIP P 8 40 TBD Call TI Call TI -40 to 125 LM2574HVN
-15 P+
LM2574HVN-15/NOPB ACTIVE PDIP P 8 40 Green (RoHS
& no Sb/Br)
Call TI Level-1-NA-UNLIM -40 to 125 LM2574HVN
-15 P+
LM2574HVN-5.0 ACTIVE PDIP P 8 40 TBD Call TI Call TI -40 to 125 LM2574HVN
-5.0 P+
LM2574HVN-5.0/NOPB ACTIVE PDIP P 8 40 Green (RoHS
& no Sb/Br)
Call TI Level-1-NA-UNLIM -40 to 125 LM2574HVN
-5.0 P+
LM2574HVN-ADJ ACTIVE PDIP P 8 40 TBD Call TI Call TI -40 to 125 LM2574HVN
-ADJ P+
LM2574HVN-ADJ/NOPB ACTIVE PDIP P 8 40 Green (RoHS
& no Sb/Br)
Call TI Level-1-NA-UNLIM -40 to 125 LM2574HVN
-ADJ P+
LM2574M-12 ACTIVE SOIC NPA 14 50 TBD Call TI Call TI -40 to 125 LM2574M
-12 P+
LM2574M-12/NOPB ACTIVE SOIC NPA 14 50 Green (RoHS
& no Sb/Br)
CU SN Level-3-260C-168 HR -40 to 125 LM2574M
-12 P+
LM2574M-3.3 ACTIVE SOIC NPA 14 50 TBD Call TI Call TI -40 to 125 LM2574M
-3.3 P+
LM2574M-3.3/NOPB ACTIVE SOIC NPA 14 50 Green (RoHS
& no Sb/Br)
CU SN Level-3-260C-168 HR -40 to 125 LM2574M
-3.3 P+
LM2574M-5.0 ACTIVE SOIC NPA 14 50 TBD Call TI Call TI -40 to 125 LM2574M
-5.0 P+
LM2574M-5.0/NOPB ACTIVE SOIC NPA 14 50 Green (RoHS
& no Sb/Br)
CU SN Level-3-260C-168 HR -40 to 125 LM2574M
-5.0 P+
LM2574M-ADJ ACTIVE SOIC NPA 14 50 TBD Call TI Call TI -40 to 125 LM2574M
-ADJ P+
LM2574M-ADJ/NOPB ACTIVE SOIC NPA 14 50 Green (RoHS
& no Sb/Br)
CU SN Level-3-260C-168 HR -40 to 125 LM2574M
-ADJ P+
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
LM2574MX-12 ACTIVE SOIC NPA 14 1000 TBD Call TI Call TI -40 to 125 LM2574M
-12 P+
LM2574MX-12/NOPB ACTIVE SOIC NPA 14 1000 Green (RoHS
& no Sb/Br)
CU SN Level-3-260C-168 HR -40 to 125 LM2574M
-12 P+
LM2574MX-3.3 ACTIVE SOIC NPA 14 1000 TBD Call TI Call TI -40 to 125 LM2574M
-3.3 P+
LM2574MX-3.3/NOPB ACTIVE SOIC NPA 14 1000 Green (RoHS
& no Sb/Br)
CU SN Level-4-260C-72 HR -40 to 125 LM2574M
-3.3 P+
LM2574MX-5.0 ACTIVE SOIC NPA 14 1000 TBD Call TI Call TI -40 to 125 LM2574M
-5.0 P+
LM2574MX-5.0/NOPB ACTIVE SOIC NPA 14 1000 Green (RoHS
& no Sb/Br)
CU SN Level-3-260C-168 HR -40 to 125 LM2574M
-5.0 P+
LM2574MX-ADJ ACTIVE SOIC NPA 14 1000 TBD Call TI Call TI -40 to 125 LM2574M
-ADJ P+
LM2574MX-ADJ/NOPB ACTIVE SOIC NPA 14 1000 Green (RoHS
& no Sb/Br)
CU SN Level-3-260C-168 HR -40 to 125 LM2574M
-ADJ P+
LM2574N-12 ACTIVE PDIP P 8 40 TBD Call TI Call TI -40 to 125 LM2574N
-12 P+
LM2574N-12/NOPB ACTIVE PDIP P 8 40 Green (RoHS
& no Sb/Br)
Call TI Level-1-NA-UNLIM -40 to 125 LM2574N
-12 P+
LM2574N-3.3 ACTIVE PDIP P 8 40 TBD Call TI Call TI -40 to 125 LM2574N
-3.3 P+
LM2574N-3.3/NOPB ACTIVE PDIP P 8 40 Green (RoHS
& no Sb/Br)
Call TI Level-1-NA-UNLIM -40 to 125 LM2574N
-3.3 P+
LM2574N-5.0 ACTIVE PDIP P 8 40 TBD Call TI Call TI -40 to 125 LM2574N
-5.0 P+
LM2574N-5.0/NOPB ACTIVE PDIP P 8 40 Green (RoHS
& no Sb/Br)
Call TI Level-1-NA-UNLIM -40 to 125 LM2574N
-5.0 P+
LM2574N-ADJ ACTIVE PDIP P 8 40 TBD Call TI Call TI -40 to 125 LM2574N
-ADJ P+
LM2574N-ADJ/NOPB ACTIVE PDIP P 8 40 Green (RoHS
& no Sb/Br)
Call TI Level-1-NA-UNLIM -40 to 125 LM2574N
-ADJ P+
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 4
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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