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LM2574HVN-5.0

Part # LM2574HVN-5.0
Description IC REG BUCK 5V 0.5A 8-DIP
Category IC
Availability Out of Stock
Qty 0
Qty Price
1 + $1.41000

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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
LM2574HVMX-12/NOPB SOIC NPA 14 1000 330.0 16.4 10.9 9.5 3.2 12.0 16.0 Q1
LM2574HVMX-15 SOIC NPA 14 1000 330.0 16.4 10.9 9.5 3.2 12.0 16.0 Q1
LM2574HVMX-15/NOPB SOIC NPA 14 1000 330.0 16.4 10.9 9.5 3.2 12.0 16.0 Q1
LM2574HVMX-3.3 SOIC NPA 14 1000 330.0 16.4 10.9 9.5 3.2 12.0 16.0 Q1
LM2574HVMX-3.3/NOPB SOIC NPA 14 1000 330.0 16.4 10.9 9.5 3.2 12.0 16.0 Q1
LM2574HVMX-5.0 SOIC NPA 14 1000 330.0 16.4 10.9 9.5 3.2 12.0 16.0 Q1
LM2574HVMX-5.0/NOPB SOIC NPA 14 1000 330.0 16.4 10.9 9.5 3.2 12.0 16.0 Q1
LM2574HVMX-ADJ SOIC NPA 14 1000 330.0 16.4 10.9 9.5 3.2 12.0 16.0 Q1
LM2574HVMX-ADJ/NOPB SOIC NPA 14 1000 330.0 16.4 10.9 9.5 3.2 12.0 16.0 Q1
LM2574MX-12 SOIC NPA 14 1000 330.0 16.4 10.9 9.5 3.2 12.0 16.0 Q1
LM2574MX-12/NOPB SOIC NPA 14 1000 330.0 16.4 10.9 9.5 3.2 12.0 16.0 Q1
LM2574MX-3.3 SOIC NPA 14 1000 330.0 16.4 10.9 9.5 3.2 12.0 16.0 Q1
LM2574MX-3.3/NOPB SOIC NPA 14 1000 330.0 16.4 10.9 9.5 3.2 12.0 16.0 Q1
LM2574MX-5.0 SOIC NPA 14 1000 330.0 16.4 10.9 9.5 3.2 12.0 16.0 Q1
LM2574MX-5.0/NOPB SOIC NPA 14 1000 330.0 16.4 10.9 9.5 3.2 12.0 16.0 Q1
LM2574MX-ADJ SOIC NPA 14 1000 330.0 16.4 10.9 9.5 3.2 12.0 16.0 Q1
LM2574MX-ADJ/NOPB SOIC NPA 14 1000 330.0 16.4 10.9 9.5 3.2 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM2574HVMX-12/NOPB SOIC NPA 14 1000 367.0 367.0 38.0
LM2574HVMX-15 SOIC NPA 14 1000 367.0 367.0 38.0
LM2574HVMX-15/NOPB SOIC NPA 14 1000 367.0 367.0 38.0
LM2574HVMX-3.3 SOIC NPA 14 1000 367.0 367.0 38.0
LM2574HVMX-3.3/NOPB SOIC NPA 14 1000 367.0 367.0 38.0
LM2574HVMX-5.0 SOIC NPA 14 1000 367.0 367.0 38.0
LM2574HVMX-5.0/NOPB SOIC NPA 14 1000 367.0 367.0 38.0
LM2574HVMX-ADJ SOIC NPA 14 1000 367.0 367.0 38.0
LM2574HVMX-ADJ/NOPB SOIC NPA 14 1000 367.0 367.0 38.0
LM2574MX-12 SOIC NPA 14 1000 367.0 367.0 38.0
LM2574MX-12/NOPB SOIC NPA 14 1000 367.0 367.0 38.0
LM2574MX-3.3 SOIC NPA 14 1000 367.0 367.0 38.0
LM2574MX-3.3/NOPB SOIC NPA 14 1000 367.0 367.0 38.0
LM2574MX-5.0 SOIC NPA 14 1000 367.0 367.0 38.0
LM2574MX-5.0/NOPB SOIC NPA 14 1000 367.0 367.0 38.0
LM2574MX-ADJ SOIC NPA 14 1000 367.0 367.0 38.0
LM2574MX-ADJ/NOPB SOIC NPA 14 1000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2013
Pack Materials-Page 2
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