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LAN8700-AEZG

Part # LAN8700-AEZG
Description HI-PERF MII/RMII 10/100 ETHERNET PHY
Category IC
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

SMSC LAN8700/LAN8700I DATASHEET Revision 1.0 (02-09-07)
Datasheet
PRODUCT FEATURES
LAN8700/LAN8700I
±15kV ESD Protected
MII/RMII Fast-Ethernet
PHY with HP Auto-MDIX
and SMSC flexPWR
TM
in a Small Footprint
Single-Chip Ethernet Physical Layer Transceiver
(PHY)
ESD Protection levels of ±8kV HBM without external
protection devices
ESD protection levels of IEC61000-4-2, ±8kV contact
mode, and ±15kV for air discharge mode per
independent test facility
Comprehensive SMSC flexPWR
TM
Technology
Flexible Power Management Architecture
LVCMOS Variable I/O voltage range: +1.6V to +3.6V
Integrated 3.3V to 1.8V regulator for optional single
supply operation.
Regulator can be disabled if 1.8V system supply is
available.
Performs HP Auto-MDIX in accordance with IEEE
802.3ab specification
Cable length greater than 150 meters
Automatic Polarity Correction
Latch-Up Performance Exceeds 150mA per
EIA/JESD 78, Class II
Energy Detect power-down mode
Low Current consumption power down mode
Low operating current consumption:
39mA typical in 10BASE-T and
79mA typical in 100BASE-TX mode
Supports Auto-negotiation and Parallel Detection
Supports the Media Independent Interface (MII) and
Reduced Media Independent Interface (RMII)
Compliant with IEEE 802.3-2005 standards
MII Pins tolerant to 3.6V
IEEE 802.3-2005 compliant register functions
Integrated DSP with Adaptive Equalizer
Baseline Wander (BLW) Correction
Vendor Specific register functions
Low profile 36-pin QFN lead-free RoHS compliant
package (6 x 6 x 0.9mm height)
4 LED status indicators
Commercial Operating Temperature 0° C to 70° C
Industrial Operating Temperature -40° C to 85° C
version available (LAN8700I)
Applications
Set Top Boxes
Network Printers and Servers
LAN on Motherboard
10/100 PCMCIA/CardBus Applications
Embedded Telecom Applications
Video Record/Playback Systems
Cable Modems/Routers
DSL Modems/Routers
Digital Video Recorders
Personal Video Recorders
IP and Video Phones
Wireless Access Points
Digital Televisions
Digital Media Adaptors/Servers
POS Terminals
Automotive Networking
Gaming Consoles
Security Systems
POE Applications
Access Control
Order Numbers:
LAN8700-AEZG for 36-pin, QFN Lead-Free RoHS Compliant Package
LAN8700I-AEZG for (Industrial Temp) 36-pin, QFN Lead-Free RoHS Compliant Package
±15kV ESD Protected MII/RMII Fast-Ethernet PHY with HP Auto-MDIX and SMSC flexPWR
TM
in a Small Footprint
Datasheet
Revision 1.0 (02-09-07) 2 SMSC LAN8700/LAN8700I
DATASHEET
80 ARKAY DRIVE, HAUPPAUGE, NY 11788 (631) 435-6000, FAX (631) 273-3123
Copyright © 2007 SMSC or its subsidiaries. All rights reserved.
Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently, complete information sufficient for
construction purposes is not necessarily given. Although the information has been checked and is believed to be accurate, no responsibility is assumed for inaccuracies. SMSC
reserves the right to make changes to specifications and product descriptions at any time without notice. Contact your local SMSC sales office to obtain the latest specifications
before placing your product order. The provision of this information does not convey to the purchaser of the described semiconductor devices any licenses under any patent
rights or other intellectual property rights of SMSC or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated
version of SMSC's standard Terms of Sale Agreement dated before the date of your order (the "Terms of Sale Agreement"). The product may contain design defects or errors
known as anomalies which may cause the product's functions to deviate from published specifications. Anomaly sheets are available upon request. SMSC products are not
designed, intended, authorized or warranted for use in any life support or other application where product failure could cause or contribute to personal injury or severe property
damage. Any and all such uses without prior written approval of an Officer of SMSC and further testing and/or modification will be fully at the risk of the customer. Copies of
this document or other SMSC literature, as well as the Terms of Sale Agreement, may be obtained by visiting SMSC’s website at http://www.smsc.com. SMSC is a registered
trademark of Standard Microsystems Corporation (“SMSC”). Product names and company names are the trademarks of their respective holders.
SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION ANY AND ALL IMPLIED WARRANTIES OF MERCHANTABILITY,
FITNESS FOR A PARTICULAR PURPOSE, TITLE, AND AGAINST INFRINGEMENT AND THE LIKE, AND ANY AND ALL WARRANTIES ARISING FROM ANY COURSE
OF DEALING OR USAGE OF TRADE. IN NO EVENT SHALL SMSC BE LIABLE FOR ANY DIRECT, INCIDENTAL, INDIRECT, SPECIAL, PUNITIVE, OR CONSEQUENTIAL
DAMAGES; OR FOR LOST DATA, PROFITS, SAVINGS OR REVENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION, WHETHER BASED ON CONTRACT;
TORT; NEGLIGENCE OF SMSC OR OTHERS; STRICT LIABILITY; BREACH OF WARRANTY; OR OTHERWISE; WHETHER OR NOT ANY REMEDY OF BUYER IS HELD
TO HAVE FAILED OF ITS ESSENTIAL PURPOSE, AND WHETHER OR NOT SMSC HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
±15kV ESD Protected MII/RMII Fast-Ethernet PHY with HP Auto-MDIX and SMSC flexPWR
TM
in a Small Footprint
Datasheet
SMSC LAN8700/LAN8700I 3 Revision 1.0 (02-09-07)
DATASHEET
Table of Contents
Chapter 1 General Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.1 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Chapter 2 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.1 Package Pin-out Diagram and Signal Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Chapter 3 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.1 I/O Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Chapter 4 Architecture Details. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.1 Top Level Functional Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.2 100Base-TX Transmit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.2.1 100M Transmit Data Across the MII/RMII Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.2.2 4B/5B Encoding. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.2.3 Scrambling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.2.4 NRZI and MLT3 Encoding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.2.5 100M Transmit Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.2.6 100M Phase Lock Loop (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.3 100Base-TX Receive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.3.1 100M Receive Input. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.3.2 Equalizer, Baseline Wander Correction and Clock and Data Recovery . . . . . . . . . . . . . 21
4.3.3 NRZI and MLT-3 Decoding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.3.4 Descrambling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.3.5 Alignment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.3.6 5B/4B Decoding. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.3.7 Receive Data Valid Signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.3.8 Receiver Errors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.3.9 100M Receive Data Across the MII/RMII Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.4 10Base-T Transmit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.4.1 10M Transmit Data Across the MII/RMII Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.4.2 Manchester Encoding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.4.3 10M Transmit Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.5 10Base-T Receive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.5.1 10M Receive Input and Squelch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.5.2 Manchester Decoding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.5.3 10M Receive Data Across the MII/RMII Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.5.4 Jabber Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.6 MAC Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.6.1 MII . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.6.2 RMII . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.6.3 MII vs. RMII Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.7 Auto-negotiation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.7.1 Parallel Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.7.2 Re-starting Auto-negotiation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.7.3 Disabling Auto-negotiation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.7.4 Half vs. Full Duplex . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.8 HP Auto-MDIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.9 Internal +1.8V Regulator Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.9.1 Disable the Internal +1.8V Regulator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.9.2 Enable the Internal +1.8V Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.10 nINT/TX_ER/TXD4 Strapping. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
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