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ISPLSI2032-80LT44

Part # ISPLSI2032-80LT44
Description CPLD - Complex Programmable Logic Devices USE ispMACH 4000
Category IC
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

ispLSI
®
2032/A
In-System Programmable High Density PLD
2032_10 1
USE ispLSI 2032E FOR NEW DESIGNS
Features
ENHANCEMENTS
ispLSI 2032A is Fully Form and Function Compatible
to the ispLSI 2032, with Identical Timing
Specifcations and Packaging
ispLSI 2032A is Built on an Advanced 0.35 Micron
E
2
CMOS
®
Technology
HIGH DENSITY PROGRAMMABLE LOGIC
1000 PLD Gates
32 I/O Pins, Two Dedicated Inputs
32 Registers
High Speed Global Interconnect
Wide Input Gating for Fast Counters, State
Machines, Address Decoders, etc.
Small Logic Block Size for Random Logic
HIGH PERFORMANCE E
2
CMOS
®
TECHNOLOGY
fmax = 180 MHz Maximum Operating Frequency
tpd = 5.0 ns Propagation Delay
TTL Compatible Inputs and Outputs
Electrically Erasable and Reprogrammable
Non-Volatile
100% Tested at Time of Manufacture
Unused Product Term Shutdown Saves Power
IN-SYSTEM PROGRAMMABLE
In-System Programmable (ISP™) 5V Only
Increased Manufacturing Yields, Reduced Time-to-
Market and Improved Product Quality
Reprogram Soldered Devices for Faster Prototyping
OFFERS THE EASE OF USE AND FAST SYSTEM
SPEED OF PLDs WITH THE DENSITY AND FLEXIBILITY
OF FIELD PROGRAMMABLE GATE ARRAYS
Complete Programmable Device Can Combine Glue
Logic and Structured Designs
Enhanced Pin Locking Capability
Three Dedicated Clock Input Pins
Synchronous and Asynchronous Clocks
Programmable Output Slew Rate Control to
Minimize Switching Noise
Flexible Pin Placement
Optimized Global Routing Pool Provides Global
Interconnectivity
Description
The ispLSI 2032 and 2032A are High Density Program-
mable Logic Devices. The devices contain 32 Registers,
32 Universal I/O pins, two Dedicated Input Pins, three
Dedicated Clock Input Pins, one dedicated Global OE
input pin and a Global Routing Pool (GRP). The GRP
provides complete interconnectivity between all of these
elements. The ispLSI 2032 and 2032A feature 5V in-
system programmability and in-system diagnostic
capabilities. The ispLSI 2032 and 2032A offer non-
volatile reprogrammability of the logic, as well as the
interconnect to provide truly reconfigurable systems.
The basic unit of logic on these devices is the Generic
Logic Block (GLB). The GLBs are labeled A0, A1 .. A7
(Figure 1). There are a total of eight GLBs in the ispLSI
2032 and 2032A devices. Each GLB is made up of four
macrocells. Each GLB has 18 inputs, a programmable
AND/OR/Exclusive OR array, and four outputs which can
be configured to be either combinatorial or registered.
Inputs to the GLB come from the GRP and dedicated
inputs. All of the GLB outputs are brought back into the
GRP so that they can be connected to the inputs of any
GLB on the device.
Functional Block Diagram
Global Routing Pool
(GRP)
A0
A1
A3
Input Bus
Output Routing Pool (ORP)
A7
A6
A5
A4
Input Bus
Output Routing Pool (ORP)
A2
GLB
Logic
Array
DQ
DQ
DQ
DQ
0139Bisp/2000
Copyright © 2002 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject
to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A.
Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
January 2002
Specifications ispLSI 2032/A
2
USE ispLSI 2032E FOR NEW DESIGNS
Functional Block Diagram
Figure 1. ispLSI 2032/A Functional Block Diagram
Global Routing Pool
(GRP)
A0
A1
A3
Input Bus
Output Routing Pool (ORP)
A7
A6
A5
A4
Input Bus
Output Routing Pool (ORP)
A2
CLK 0
CLK 1
CLK 2
GOE 0
Notes:
*Y1 and RESET are multiplexed on the same pin
I/O 0
I/O 1
I/O 2
I/O 3
I/O 6
I/O 7
I/O 8
I/O 9
I/O 10
I/O 11
I/O 12
I/O 13
I/O 14
I/O 15
I/O 31
I/O 30
I/O 29
I/O 28
I/O 27
I/O 26
I/O 25
I/O 24
I/O 23
I/O 22
I/O 21
I/O 20
I/O 19
I/O 18
I/O 17
I/O 16
SDI/IN 0
SDO/IN 1
I/O 4
I/O 5
Y0
*Y1/RESET
SCLK/Y2
ispEN
MODE
0139B(1)isp/200
0
The devices also have 32 I/O cells, each of which is
directly connected to an I/O pin. Each I/O cell can be
individually programmed to be a combinatorial input,
output or bi-directional I/O pin with 3-state control. The
signal levels are TTL compatible voltages and the output
drivers can source 4 mA or sink 8 mA. Each output can
be programmed independently for fast or slow output
slew rate to minimize overall output switching noise.
Eight GLBs, 32 I/O cells, two dedicated inputs and two
ORPs are connected together to make a Megablock
(Figure 1). The outputs of the eight GLBs are connected
to a set of 32 universal I/O cells by the ORP. Each ispLSI
2032 and 2032A device contains one Megablock.
The GRP has as its inputs, the outputs from all of the
GLBs and all of the inputs from the bi-directional I/O cells.
All of these signals are made available to the inputs of the
GLBs. Delays through the GRP have been equalized to
minimize timing skew.
Clocks in the ispLSI 2032 and 2032A devices are se-
lected using the dedicated clock pins. Three dedicated
clock pins (Y0, Y1, Y2) or an asynchronous clock can be
selected on a GLB basis. The asynchronous or Product
Term clock can be generated in any GLB for its own clock.
Specifications ispLSI 2032/A
3
USE ispLSI 2032E FOR NEW DESIGNS
Absolute Maximum Ratings
1
Supply Voltage V
cc
...................................-0.5 to +7.0V
Input Voltage Applied........................ -2.5 to V
CC
+1.0V
Off-State Output Voltage Applied ..... -2.5 to V
CC
+1.0V
Storage Temperature................................ -65 to 150°C
Case Temp. with Power Applied .............. -55 to 125°C
Max. Junction Temp. (T
J
) with Power Applied ... 150°C
1. Stresses above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional
operation of the device at these or at any other conditions above those indicated in the operational sections of this specification
is not implied (while programming, follow the programming specifications).
DC Recommended Operating Condition
T
A
= 0°C to + 70°C
T
A
= -40°C to + 85°C
SYMBOL
Table 2 - 0005/2032
VCC
VIH
VIL
PARAMETER
Supply Voltage
Input High Voltage
Input Low Voltage
MIN. MAX. UNITS
4.75
4.5
2.0
0
5.25
5.5
V
cc
+1
0.8
V
V
V
V
Commercial
Industrial
Capacitance (T
A
=25°C, f=1.0 MHz)
C
SYMBOL
Table 2-0006/2032
C
PARAMETER
I/O Capacitance
7
UNITSTYPICAL TEST CONDITIONS
1
2
6Dedicated Input Capacitance
pf
pf
V = 5.0V, V = 2.0V
V = 5.0V, V = 2.0V
CC
CC I/O
IN
C
Clock Capacitance
10
3
pf V = 5.0V, V = 2.0V
CC Y
Data Retention Specifications
Table 2-0008A-isp
PARAMETER
Data Retention
MINIMUM MAXIMUM UNITS
Erase/Reprogram Cycles
20
10000
–
–
Years
Cycles
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