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CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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HIP2101
100V/2A Peak, Low Cost, High Frequency
Half Bridge Driver
The HIP2101 is a high frequency, 100V Half Bridge
N-Channel power MOSFET driver IC. It is equivalent to the
HIP2100 with the added advantage of full TTL/CMOS
compatible logic input pins. The low-side and high-side gate
drivers are independently controlled and matched to 13ns.
This gives users total control over dead-time for specific
power circuit topologies. Undervoltage protection on both
the low-side and high-side supplies force the outputs low. An
on-chip diode eliminates the discrete diode required with
other driver ICs. A new level-shifter topology yields the low-
power benefits of pulsed operation with the safety of DC
operation. Unlike some competitors, the high-side output
returns to its correct state after a momentary undervoltage of
the high-side supply.
Features
• Drives N-Channel MOSFET Half Bridge
• SOIC, EPSOIC, QFN and DFN Package Options
• SOIC, EPSOIC and DFN Packages Compliant with 100V
Conductor Spacing Guidelines of IPC-2221
• Pb-free Product Available (RoHS Compliant)
• Bootstrap Supply Max Voltage to 114VDC
• On-Chip 1Ω Bootstrap Diode
• Fast Propagation Times for Multi-MHz Circuits
• Drives 1000pF Load with Rise and Fall Times Typ. 10ns
• TTL/CMOS Input Thresholds Increase Flexibility
• Independent Inputs for Non-Half Bridge Topologies
• No Start-Up Problems
• Outputs Unaffected by Supply Glitches, HS Ringing Below
Ground, or HS Slewing at High dv/dt
• Low Power Consumption
• Wide Supply Range
• Supply Undervoltage Protection
•3Ω Output Driver Resistance
• QFN/DFN Package:
- Compliant to JEDEC PUB95 MO-220
QFN - Quad Flat No Leads - Package Outline
- Near Chip Scale Package footprint, which improves
PCB efficiency and has a thinner profile
Applications
• Telecom Half Bridge Power Supplies
• Avionics DC-DC Converters
• Two-Switch Forward Converters
• Active Clamp Forward Converters
Ordering Information
PART NUMBER
TEMP.
RANGE (°C) PACKAGE
PKG.
DWG. #
HIP2101IB -40 to 125 8 Ld SOIC M8.15
HIP2101IBZ (Note 1) -40 to 125 8 Ld SOIC (Pb-free) M8.15
HIP2101EIB -40 to 125 8 Ld EPSOIC M8.15C
HIP2101EIBZ
(Note 1)
-40 to 125 8 Ld EPSOIC
(Pb-free)
M8.15C
HIP2101IR -40 to 125 16 Ld 5x5 QFN L16.5x5
HIP2101IRZ (Note 1) -40 to 125 16 Ld 5x5 QFN
(Pb-free)
L16.5x5
HIP2101IR4 -40 to 125 12 Ld 4x4 DFN L12.4x4A
HIP2101IR4Z
(Note 1)
-40 to 125 12 Ld 4x4 DFN
(Pb-free)
L12.4x4A
NOTES:
1. Intersil Pb-free products employ special Pb-free material sets;
molding compounds/die attach materials and 100% matte tin
plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020C.
2. Add “T” suffix for Tape and Reel packing option.
Data Sheet October 21, 2004 FN9025.8
