2
Selection Guide–Package Styles and Lead Configuration Options
Package 8 Pin DIP 8 Pin DIP 16 Pin Flat Pack 20 Pad LCCC
Lead Style Through Hole Through Hole Unformed Leads Surface Mount
Channels 1 2 4 2
Common Channel None V
CC
, GND V
CC
, GND None
Wiring
Agilent Part # & Options
Commercial HCPL-5200 HCPL-5230 HCPL-6250 HCPL-6230
MIL-PRF-38534, Class H HCPL-5201 HCPL-5231 HCPL-6251 HCPL-6231
MIL-PRF-38534, Class K HCPL-520K HCPL-523K HCPL-625K HCPL-623K
Standard Lead Finish Gold Plate Gold Plate Gold Plate Soldered Pads
Solder Dipped Option #200 Option #200
Butt Cut/Gold Plate Option #100 Option #100
Gull Wing/Soldered Option #300 Option #300
Class H SMD Part #
Prescript for all below 5962- 5962- 5962- 5962-
Either Gold or Solder 8876801PX 8876901PX 8876903FX 88769022X
Gold Plate 8876801PC 8876901PC 8876903FC
Solder Dipped 8876801PA 8876901PA 88769022A
Butt Cut/Gold Plate 8876801YC 8876901YC
Butt Cut/Soldered 8876801YA 8876901YA
Gull Wing/Soldered 8876801XA 8876901XA
Class K SMD Part #
Prescript for all below 5962- 5962- 5962- 5962-
Either Gold or Solder 8876802KPX 8876904KPX 8876906KFX 8876905K2X
Gold Plate 8876802KPC 8876904KPC 8876906KFC
Solder Dipped 8876802KPA 8876904KPA 8876905K2A
Butt Cut/Gold Plate 8876802KYC 8876904KYC
Butt Cut/Soldered 8876802KYA 8876904KYA
Gull Wing/Soldered 8876802KXA 8876904KXA
which allows for direct connection
to data buses. The output is non-
inverting. The detector IC has an
internal shield that provides a
guaranteed common mode
transient immunity of up to
10,000 V/µs. Improved power
supply rejection eliminates the
need for special power supply
bypass precautions.
Package styles for these parts are
8 pin DIP through hole (case
outline P), 16 pin DIP flat pack
(case outline F), and leadless
ceramic chip carrier (case outline
2). Devices may be purchased
with a variety of lead bend and
plating options, see Selection
Guide Table for details. Standard
Microcircuit Drawing (SMD)
parts are available for each
package and lead style.
Because the same electrical die
(emitters and detectors) are used
for each channel of each device
listed in this data sheet, absolute
maximum ratings, recommended
operating conditions, electrical
specifications, and performance
characteristics shown in the
figures are identical for all parts.
Occasional exceptions exist due
to package variations and limita-
tions and are as noted. Addition-
ally, the same package assembly
processes and materials are used
in all devices. These similarities
give justification for the use of
data obtained from one part to
represent other part’s per-
formance for die related
reliability and certain limited
radiation test results.
