1-560
capability will enable the designer
to interface any TTL family to
CMOS. The availability of the
base lead allows optimized gain/
bandwidth adjustment in analog
applications. The shallow depth
of the IC photodiode provides
better radiation immunity than
conventional phototransistor
couplers.
These products are also available
with the transistor base node
connected to improve common
mode noise immunity and ESD
susceptibility. In addition, higher
CTR minimums are available by
special request.
Package styles for these parts are
8 and 16 pin DIP through hole
(case outlines P and E respec-
tively), 16 pin DIP flat pack (case
outline F), and leadless ceramic
chip carrier (case outline 2).
Devices may be purchased with a
variety of lead bend and plating
options, see Selection Guide
Table for details. Standard
Military Drawing (SMD) parts are
available for each package and
lead style.
Because the same functional die
(emitters and detectors) are used
for each channel of each device
listed in this data sheet, absolute
maximum ratings, recommended
operating conditions, electrical
specifications, and performance
characteristics shown in the
figures are identical for all parts.
Occasional exceptions exist due
to package variations and
limitations and are as noted.
Additionally, the same package
assembly processes and materials
are used in all devices. These
similarities give justification for
the use of data obtained from one
part to represent other part’s
performance for die related
reliability and certain limited
radiation test results.
Selection Guide–Package Styles and Lead Configuration Options
Package 16 Pin DIP 8 Pin DIP 8 Pin DIP 16 Pin Flat Pack 20 Pad LCCC
Lead Style Through Hole Through Hole Through Hole Unformed Leads Surface Mount
Channels 2 1 2 4 2
Common Channel Wiring None None V
CC
GND V
CC
GND None
HP Part # & Options
Commercial 4N55* HCPL-5500 HCPL-5530 HCPL-6550 HCPL-6530
MIL-PRF-38534, Class H 4N55/883B HCPL-5501 HCPL-5531 HCPL-6551 HCPL-6531
MIL-PRF-38534, Class K HCPL-257K HCPL-550K HCPL-553K HCPL-655K HCPL-653K
Standard Lead Finish Gold Plate Gold Plate Gold Plate Gold Plate Solder Pads
Solder Dipped Option #200 Option #200 Option #200
Butt Cut/Gold Plate Option #100 Option #100 Option #100
Gull Wing/Soldered Option #300 Option #300 Option #300
SMD Part #
Prescript for all below 5962- 5962- 5962- 5962- 5962-
Either Gold or Solder 8767901EX 9085401HPX 8767902PX 8767904FX 87679032X
Gold Plate 8767901EC 9085401HPC 8767902PC 8767904FC
Solder Dipped 8767901EA 9085401HPA 8767902PA 87679032A
Butt Cut/Gold Plate 8767901UC 9085401HYC 8767902YC
Butt Cut/Soldered 8767901UA 9085401HYA 8767902YA
Gull Wing/Soldered 8767901TA 9085401HXA 8767902XA
*JEDEC registered part.
8 Pin Ceramic DIP Single
Channel Schematic
ANODE
3
CATHODE
6
5
V
O
GND
I
O
I
F
2
+
–
V
F
8
V
CC
7
V
B
I
B
I
CC
Note base pin 7.
