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FDS4885C

Part # FDS4885C
Description MOSFET N/P-CH 40V 7.5A/6A 8SOIC
Category IC
Availability In Stock
Qty 2515
Qty Price
1 - 181 $0.82656
182 - 456 $0.65749
457 - 887 $0.61992
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1,346 + $0.51347
Manufacturer Available Qty
Fairchild Semiconductor
Date Code: 0804
  • Shipping Freelance Stock: 2500
    Ships Immediately
Fairchild Semiconductor
Date Code: 8548
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

January 2005
2005 Fairchild Semiconductor Corporation
FDS4885C Rev D(W)
FDS4885C
Dual N & P-Channel PowerTrench
MOSFET
General Description
These dual N- and P-Channel enhancement mode
power field effect transistors are produced using
Fairchild Semiconductor’s advanced PowerTrench
process that has been especially tailored to minimize
on-state resistance and yet maintain superior switching
performance.
These devices are well suited for low voltage and
battery powered applications where low in-line power
loss and fast switching are required.
Applications
Synchronous rectifier
Backlight inverter stage
Features
Q1: N-Channel
7.5A, 40V R
DS(on)
= 22m @ V
GS
= 10V
R
DS(on)
= 35m @ V
GS
= 7V
Q2: P-Channel
–6A, –40V R
DS(on)
= 31m @ V
GS
= –10V
R
DS(on)
= 42m @ V
GS
= –4.5V
Fast switching speed
High power and handling capability in a widely
used surface mount package
S
D
S
S
SO-8
D
D
D
G
D1
D1
D2
D2
S1
G1
S2
G2
Pin 1
SO-8
4
3
2
1
5
6
7
8
Q1
Q2
Absolute Maximum Ratings T
A
= 25°C unless otherwise noted
Symbol Parameter Q1 Q2 Units
V
DSS
Drain-Source Voltage 40 40 V
V
GSS
Gate-Source Voltage
±20 ±20
V
I
D
Drain Current - Continuous (Note 1a) 7.5 –6 A
- Pulsed 20 –20
P
D
Power Dissipation for Dual Operation 2 W
Power Dissipation for Single Operation (Note 1a) 1.6
(Note 1b)
1
(Note 1c)
0.9
T
J
, T
STG
Operating and Storage Junction Temperature Range –55 to +150
°C
Thermal Characteristics
R
θJA
Thermal Resistance, Junction-to-Ambient (Note 1a) 78
°C/W
R
θJC
Thermal Resistance, Junction-to-Case (Note 1) 40
Package Marking and Ordering Information
Device Marking Device Reel Size Tape width Quantity
FDS4885C FDS4885C 13” 12mm 2500 units
FDS4885C
FDS4885C Rev D(W)
Electrical Characteristics T
A
= 25°C unless otherwise noted
Symbol Parameter Test Conditions Type Min Typ Max Units
Off Characteristics
BV
DSS
Drain-Source Breakdown
Voltage
V
GS
= 0 V, I
D
= 250 µA
V
GS
= 0 V, I
D
= –250 µA
Q1
Q2
40
–40
V
BVDSS
T
J
Breakdown Voltage
Temperature Coefficient
I
D
= 250 µA, Referenced to 25°C
I
D
= –250 µA, Referenced to 25°C
Q1
Q2
40
–30
mV/°C
I
DSS
Zero Gate Voltage Drain
Current
V
DS
= 32 V, V
GS
= 0 V
V
DS
= –32 V, V
GS
= 0 V
Q1
Q2
1
–1
µA
I
GSSF
Gate-Body Leakage, Forward V
GS
= 20 V, V
DS
= 0 V All 100 nA
I
GSSR
Gate-Body Leakage, Reverse V
GS
= –20 V, V
DS
= 0 V All –100 nA
On Characteristics (Note 2)
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= V
GS
, I
D
= –250 µA
Q1
Q2
2
–1
4
–1.6
5
–3
V
VGS(th)
T
J
Gate Threshold Voltage
Temperature Coefficient
I
D
= 250 µA, Referenced to 25°C
I
D
= –250 µA, Referenced to 25°C
Q1
Q2
–9
5
mV/°C
V
GS
= 10 V, I
D
= 7.5 A
V
GS
= 7 V, I
D
= 6.5 A
V
GS
= 10 V, I
D
= 7.5 A, T
J
= 125°C
Q1 17
27
26
22
35
36
m
R
DS(on)
Static Drain-Source
On-Resistance
V
GS
= –10 V, I
D
= –6 A
V
GS
= –4.5 V, I
D
= –5.3 A
V
GS
= –10 V, I
D
= –6 A, T
J
= 125°C
Q2 26
34
37
31
42
47
g
FS
Forward Transconductance V
DS
= 10 V, I
D
= 7.5 A
V
DS
= –10 V, I
D
=–6 A
Q1
Q2
14
19
S
Dynamic Characteristics
C
iss
Input Capacitance Q1
Q2
900
1560
pF
C
oss
Output Capacitance Q1
Q2
200
215
pF
C
rss
Reverse Transfer Capacitance
Q1
V
DS
= 20 V, V
GS
= 0 V, f = 1.0 MHz
Q2
V
DS
= –20 V, V
GS
= 0 V, f = 1.0 MHz
Q1
Q2
100
110
pF
R
G
Gate Resistance V
GS
= 15 mV, f = 1.0 MHz Q1
Q2
2
9
FDS4885C
FDS4885C Rev D(W)
Electrical Characteristics (continued) T
A
= 25°C unless otherwise noted
Symbol Parameter Test Conditions Type Min Typ Max Units
Switching Characteristics (Note 2)
t
d(on)
Turn-On Delay Time Q1
Q2
26
11
42
20
ns
t
r
Turn-On Rise Time Q1
Q2
36
14
58
25
ns
t
d(off)
Turn-Off Delay Time Q1
Q2
45
71
72
114
ns
t
f
Turn-Off Fall Time
Q1
V
DD
= 20 V, I
D
= 1 A,
V
GS
= 10V, R
GEN
= 6
Q2
V
DD
= –20 V, I
D
= –1 A,
V
GS
= –10V, R
GEN
= 6
Q1
Q2
33
30
53
48
ns
Q
g
Total Gate Charge Q1
Q2
15
29
21
41
nC
Q
gs
Gate-Source Charge Q1
Q2
5
4
nC
Q
gd
Gate-Drain Charge
Q1
V
DS
= 20 V, I
D
= 7.5 A, V
GS
= 10 V
Q2
V
DS
= –20 V, I
D
= –6 A,V
GS
= –10 V
Q1
Q2
4.6
5
nC
Drain–Source Diode Characteristics and Maximum Ratings
I
S
Maximum Continuous Drain-Source Diode Forward Current Q1
Q2
1.3
–1.3
A
V
SD
Drain-Source Diode Forward
Voltage
V
GS
= 0 V, I
S
= 1.3 A (Note 2)
V
GS
= 0 V, I
S
= –1.3 A (Note 2)
Q1
Q2
0.7
–0.7
1.2
–1.2
V
t
rr
Diode Reverse Recovery
Time
Q1
Q2
26
26
nS
Q
rr
Diode Reverse Recovery
Charge
Q1
I
F
= 7.5 A, d
iF
/d
t
= 100 A/µs
Q2
I
F
= 6 A, d
iF
/d
t
= 100 A/µs
Q1
Q2
18
13
nC
Notes:
1. R
θJA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R
θJC
is guaranteed by design while R
θCA
is determined by the user's board design.
a) 78°/W when
mounted on a
0.5 in
2
pad of 2 oz
copper
b) 125°/W when
mounted on a .02 in
2
pad of 2 oz copper
c) 135°/W when mounted on a
minimum pad.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
FDS4885C
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