Electrical Characteristics (T
A
= 25
O
C unless otherwise noted )
Symbol Parameter Conditions Min Typ Max Units
OFF CHARACTERISTICS
BV
DSS
Drain-Source Breakdown Voltage V
GS
= 0 V, I
D
= 250 µA 30 V
∆BV
DSS
/∆T
J
Breakdown Voltage Temp. Coefficient
I
D
= 250 µA, Referenced to 25
o
C
41
mV/
o
C
I
DSS
Zero Gate Voltage Drain Current
V
DS
= 24 V, V
GS
= 0 V
1 µA
T
J
= 55°C
10 µA
I
GSSF
Gate - Body Leakage, Forward V
GS
= 8 V,V
DS
= 0 V 100 nA
I
GSSR
Gate - Body Leakage, Reverse
V
GS
= -8 V, V
DS
= 0 V
-100 nA
ON CHARACTERISTICS (Note)
V
GS(th)
Gate Threshold Voltage V
DS
= V
GS
, I
D
= 250 µA 0.4 0.7 1 V
∆V
GS(th)
/∆T
J
Gate Threshold Voltage Temp. Coefficient
I
D
= 250 µA, Referenced to 25
o
C
-2.3
mV/
o
C
R
DS(ON)
Static Drain-Source On-Resistance
V
GS
= 4.5 V, I
D
= 2.2 A
0.054 0.065
Ω
T
J
=125°C 0.08 0.11
V
GS
= 2.5 V, I
D
= 2 A
0.07 0.082
I
D(ON)
On-State Drain Current V
GS
= 4.5 V, V
DS
= 5 V 10 A
g
FS
Forward Transconductance
V
DS
= 5 V, I
D
= 2.2 A
13 S
DYNAMIC CHARACTERISTICS
C
iss
Input Capacitance V
DS
= 10 V, V
GS
= 0 V,
f = 1.0 MHz
300 pF
C
oss
Output Capacitance 145 pF
C
rss
Reverse Transfer Capacitance 35 pF
SWITCHING CHARACTERISTICS (Note)
t
D(on)
Turn - On Delay Time
V
DD
= 5 V, I
D
= 1 A,
V
GS
= 4.5 V, R
GEN
= 6 Ω
4 10 ns
t
r
Turn - On Rise Time 10 18 ns
t
D(off)
Turn - Off Delay Time 17 28 ns
t
f
Turn - Off Fall Time 4 10 ns
Q
g
Total Gate Charge
V
DS
= 10 V, I
D
= 2.2 A,
V
GS
= 4.5 V
7 9 nC
Q
gs
Gate-Source Charge 1.1 nC
Q
gd
Gate-Drain Charge 1.9 nC
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
I
S
Maximum Continuous Drain-Source Diode Forward Current 0.42 A
V
SD
Drain-Source Diode Forward Voltage V
GS
= 0 V, I
S
= 0.42 A (Note) 0.65 1.2 V
Note:
1. R
θ
JA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R
θ
JC
is guaranteed by
design while R
θ
CA
is determined by the user's board design.
Typical R
θ
JA
using the board layouts shown below on FR-4 PCB in a still air environment :
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.
FDN337N Rev.C
a. 250
o
C/W when mounted on a
0.02 in
2
pad of 2oz Cu.
b. 270
o
C/W when mounted on
a 0.001 in
2
pad of 2oz Cu.
