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EPM3032ATC44-10N

Part # EPM3032ATC44-10N
Description CPLD MAX 3000A Family 600 Gates 32 Macro Cells 103.1MHz CM
Category IC
Availability Out of Stock
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Altera Corporation 19
MAX 3000A Programmable Logic Device Family Data Sheet
Figure 7 shows the timing information for the JTAG signals.
Figure 7. MAX 3000A JTAG Waveforms
Table 10 shows the JTAG timing parameters and values for MAX 3000A
devices.
Table 10. JTAG Timing Parameters & Values for MAX 3000A Devices
Symbol Parameter Min Max Unit
t
JCP
TCK clock period 100 ns
t
JCH
TCK clock high time 50 ns
t
JCL
TCK clock low time 50 ns
t
JPSU
JTAG port setup time 20 ns
t
JPH
JTAG port hold time 45 ns
t
JPCO
JTAG port clock to output 25 ns
t
JPZX
JTAG port high impedance to valid output 25 ns
t
JPXZ
JTAG port valid output to high impedance 25 ns
t
JSSU
Capture register setup time 20 ns
t
JSH
Capture register hold time 45 ns
t
JSCO
Update register clock to output 25 ns
t
JSZX
Update register high impedance to valid output 25 ns
t
JSXZ
Update register valid output to high impedance 25 ns
TDO
TCK
t
JPZX
t
JPCO
t
JPH
t
JPXZ
t
JCP
t
JPSU
t
JCL
t
JCH
TDI
TMS
Signal
to Be
Captured
Signal
to Be
Driven
t
JSZX
t
JSSU
t
JSH
t
JSCO
t
JSXZ
20 Altera Corporation
MAX 3000A Programmable Logic Device Family Data Sheet
Programmable
Speed/Power
Control
MAX 3000A devices offer a power–saving mode that supports low-power
operation across user–defined signal paths or the entire device. This
feature allows total power dissipation to be reduced by 50% or more
because most logic applications require only a small fraction of all gates to
operate at maximum frequency.
The designer can program each individual macrocell in a MAX 3000A
device for either high–speed or low–power operation. As a result,
speed-critical paths in the design can run at high speed, while the
remaining paths can operate at reduced power. Macrocells that run at low
power incur a nominal timing delay adder (t
LPA
) for the t
LAD
, t
LAC
, t
IC
,
t
ACL
, t
EN
, t
CPPW
and t
SEXP
parameters.
Output
Configuration
MAX 3000A device outputs can be programmed to meet a variety of
system–level requirements.
MultiVolt I/O Interface
The MAX 3000A device architecture supports the MultiVolt I/O interface
feature, which allows MAX 3000A devices to connect to systems with
differing supply voltages. MAX 3000A devices in all packages can be set
for 2.5–V, 3.3–V, or 5.0–V I/O pin operation. These devices have one set of
V
CC
pins for internal operation and input buffers (VCCINT), and another
set for I/O output drivers (VCCIO).
The VCCIO pins can be connected to either a 3.3–V or 2.5–V power supply,
depending on the output requirements. When the VCCIO pins are
connected to a 2.5–V power supply, the output levels are compatible with
2.5–V systems. When the VCCIO pins are connected to a 3.3–V power
supply, the output high is at 3.3 V and is therefore compatible with 3.3-V
or 5.0–V systems. Devices operating with V
CCIO
levels lower than 3.0 V
incur a nominally greater timing delay of t
OD2
instead of t
OD1
. Inputs can
always be driven by 2.5–V, 3.3–V, or 5.0–V signals.
Table 11 summarizes the MAX 3000A MultiVolt I/O support.
Note:
(1) When V
CCIO
is 3.3 V, a MAX 3000A device can drive a 2.5–V device that has 3.3–V
tolerant inputs.
Table 11. MAX 3000A MultiVolt I/O Support
V
CCIO
Voltage Input Signal (V) Output Signal (V)
2.5 3.3 5.0 2.5 3.3 5.0
2.5
vvvv
3.3
vvvvvv
Altera Corporation 21
MAX 3000A Programmable Logic Device Family Data Sheet
Open–Drain Output Option
MAX 3000A devices provide an optional open–drain (equivalent to
open-collector) output for each I/O pin. This open–drain output enables
the device to provide system–level control signals (e.g., interrupt and
write enable signals) that can be asserted by any of several devices. It can
also provide an additional wired–OR plane.
Open-drain output pins on MAX 3000A devices (with a pull-up resistor to
the 5.0-V supply) can drive 5.0-V CMOS input pins that require a high V
IH
.
When the open-drain pin is active, it will drive low. When the pin is
inactive, the resistor will pull up the trace to 5.0 V, thereby meeting CMOS
requirements. The open-drain pin will only drive low or tri-state; it will
never drive high. The rise time is dependent on the value of the pull-up
resistor and load impedance. The I
OL
current specification should be
considered when selecting a pull-up resistor
Slew–Rate Control
The output buffer for each MAX 3000A I/O pin has an adjustable output
slew rate that can be configured for low–noise or high–speed
performance. A faster slew rate provides high–speed transitions for
high-performance systems. However, these fast transitions may introduce
noise transients into the system. A slow slew rate reduces system noise,
but adds a nominal delay of 4 to 5 ns. When the configuration cell is
turned off, the slew rate is set for low–noise performance. Each I/O pin
has an individual EEPROM bit that controls the slew rate, allowing
designers to specify the slew rate on a pin–by–pin basis. The slew rate
control affects both the rising and falling edges of the output signal.
Design Security
All MAX 3000A devices contain a programmable security bit that controls
access to the data programmed into the device. When this bit is
programmed, a design implemented in the device cannot be copied or
retrieved. This feature provides a high level of design security because
programmed data within EEPROM cells is invisible. The security bit that
controls this function, as well as all other programmed data, is reset only
when the device is reprogrammed.
Generic Testing
MAX 3000A devices are fully tested. Complete testing of each
programmable EEPROM bit and all internal logic elements ensures 100%
programming yield. AC test measurements are taken under conditions
equivalent to those shown in Figure 8. Test patterns can be used and then
erased during early stages of the production flow.
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