4-3
Absolute Maximum Ratings Thermal Information
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44.0V
V- to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25V
Digital Inputs, V
S
, V
D
(Note 1). . . . . . . . . . . . . (V-) - 2V to (V+) + 2V
or 30mA, Whichever Occurs First
Continuous Current, (Any Terminal). . . . . . . . . . . . . . . . . . . . . 30mA
Peak Current, S or D (Pulsed 1ms, 10% Duty Cycle Max) . . 100mA
Operating Conditions
Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±15V
Temperature Range
“A” Suffix. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55
o
C to 125
o
C
“B” Suffix. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -25
o
C to 85
o
C
“C” Suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0
o
C to 70
o
C
Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.8V (Max)
Input High Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.0V (Min)
Input Rise and Fall Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≤20ns
Thermal Resistance (Typical, Note 2) θ
JA
(
o
C/W) θ
JC
(
o
C/W)
SOIC Package . . . . . . . . . . . . . . . . . . . 100 N/A
PDIP Package . . . . . . . . . . . . . . . . . . . 100 N/A
CERDIP Package. . . . . . . . . . . . . . . . . 75 20
Maximum Junction Temperature
Hermetic Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
o
C
Plastic Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
o
C
Maximum Storage Temperature Range. . . . . . . . . . -65
o
C to 150
o
C
Maximum Lead Temperature (Soldering, 10s). . . . . . . . . . . . 300
o
C
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operationofthe
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. Signals on S
X
, D
X
or IN
X
exceeding V+ or V- will be clamped by internal diodes. Limit diode forward current to maximum current ratings.
2. θ
JA
is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications V+ = +15V, V- = -15V, GND = 0V, T
A
= 25
o
C
PARAMETER TEST CONDITIONS
“A” SUFFIX “B” AND “C” SUFFIX
UNITSMIN
(NOTE 3)
TYP MAX MIN
(NOTE 3)
TYP MAX
DYNAMIC CHARACTERISTICS
Turn-ON Time, t
ON
See Figure 3 - 150 300 - 150 - ns
Turn-OFF Time, t
OFF
See Figure 3 - 130 250 - 130 - ns
Break-Before-Make
Interval, t
D
See Figure 2, DG301A/DG303A - 50 - - 50 - ns
Charge Injection, Q C
L
= 10nF, R
S
= 0, V
S
= 0 -3--3-mV
OFF Isolation (Note 4) V
IN
= 0, R
L
= 1kΩ, V
S
= 1V
RMS
,
f = 500kHz
-62--62-dB
Crosstalk
(Channel-to-Channel)
- -74 - - -74 - dB
Source OFF Capacitance,
C
S(OFF)
f = 1MHz,
V
IN
= 0.8V or
V
IN
= 4.0V
V
S
= 0 - 14 - - 14 - pF
Drain OFF Capacitance,
C
D(OFF)
V
D
= 0 - 14 - - 14 - pF
Channel ON Capacitance,
C
D(ON)
+ C
S(ON)
V
S
= V
D
= 0 - 40 - - 40 - pF
Input Capacitance, C
IN
f = 1MHz V
IN
= 0 -6--6-pF
V
IN
= 15V - 7 - - 7 - pF
DIGITAL INPUT CHARACTERISTICS
Input Current with Voltage
High, I
IH
V
IN
= 5.0V -1 -0.001 - -1 -0.001 - µA
V
IN
= 15.0V - 0.001 1 - 0.001 1 µA
Input Current with Voltage
Low, I
IL
V
IN
= 0V -1 -0.001 - -1 -0.001 - µA
DG300A, DG301A, DG303A
