PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
5962-9221401M2A ACTIVE LCCC FK 20 1 None Call TI Level-NC-NC-NC
5962-9221401MRA ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
5962-9221403M2A ACTIVE LCCC FK 20 1 None Call TI Level-NC-NC-NC
5962-9221403MRA ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
5962-9221405M2A ACTIVE LCCC FK 20 1 None Call TI Level-NC-NC-NC
5962-9221405MRA ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
CY54FCT245ATDMB ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
CY54FCT245CTLMB ACTIVE LCCC FK 20 1 None Call TI Level-NC-NC-NC
CY54FCT245TLMB ACTIVE LCCC FK 20 1 None Call TI Level-NC-NC-NC
CY74FCT245ATPC ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CY74FCT245ATQCT ACTIVE SSOP/
QSOP
DBQ 20 2500 Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CY74FCT245ATSOC ACTIVE SOIC DW 20 25 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CY74FCT245ATSOCT ACTIVE SOIC DW 20 2000 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CY74FCT245CTQCT ACTIVE SSOP/
QSOP
DBQ 20 2500 Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CY74FCT245CTSOC ACTIVE SOIC DW 20 25 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CY74FCT245CTSOCT ACTIVE SOIC DW 20 2000 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CY74FCT245DTQCT ACTIVE SSOP/
QSOP
DBQ 20 2500 Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CY74FCT245TQCT ACTIVE SSOP/
QSOP
DBQ 20 2500 Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CY74FCT245TSOC ACTIVE SOIC DW 20 25 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CY74FCT245TSOCT ACTIVE SOIC DW 20 2000 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
Addendum-Page 1
