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CPC5611A

Part # CPC5611A
Description Data Access Arrangement IC 32-Pin SOIC Tube
Category IC
Availability In Stock
Qty 18
Qty Price
1 - 3 $12.20381
4 - 7 $9.70758
8 - 11 $9.15286
12 - 15 $8.50569
16 + $7.58115
Manufacturer Available Qty
LITELINK
Date Code: 0616
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

DS-CPC5610/5611-R9.0 www.clare.com 1
Features
Full-duplex data and voice transmission
Transformerless telephone line isolation interface
Operates at all modem speeds, including V.90 (56K)
3.3 or 5 V power supply operation
Half-wave ring detector (CPC5610) or full-wave ring
detector (CPC5611)
Caller ID signal reception
Small 32-pin SOIC plastic package
Printed-circuit board space and cost savings
Meets PC Card (PCMCIA) height requirements
Easy interface with modem ICs and voice CODECs
Worldwide dial-up telephone network compatibility
Supplied application circuit complies with the
requirements of TIA/EIA/IS-968 (FCC part 68),
UL1950, UL60950, EN60950, IEC60950,
EN55022B, CISPR22B, EN55024, and TBR-21
CPC5610 and CPC5611 comply with UL1577
TTL compatible logic inputs and outputs
Line-side circuit powered from telephone line
Applications
Satellite and cable set-top boxes
V.90 (and other standard) modems
Fax machines
Voicemail systems
Computer telephony
PBXs
Telephony gateways
Embedded modems for such applications as POS
terminals, automated banking, remote metering,
vending machines, security, and surveillance
Description
Clare CPC5610 and CPC5611 LITELINKs are silicon
data access arrangement (DAA) ICs used in data and
voice communication applications to make connec-
tions to the public switched telephone network
(PSTN). LITELINK uses on-chip optical components
and a few inexpensive external components to form a
complete voice or high-speed data telephone line
interface.
LITELINK eliminates the need for the large isolation
transformers or capacitors as used in other DAA con-
figurations. It incorporates the required high-voltage
isolation barrier in the surface-mount SOIC package.
The CPC5610 (half-wave ring detect) and CPC5611
(full-wave ring detect) build upon Clare’s existing
LITELINK line, with improved performance and 3.3 V
operation.
Ordering Information
Figure 1. CPC5610/CPC5611 Block Diagram
Part Number Description
CPC5610A
32-pin surface mount DAA with half-wave ring
detect, tubed
CPC5610ATR
32-pin surface mount DAA with half-wave ring
detect, tape and reel
CPC5611A
32-pin surface mount DAA with full-wave ring
detect, tubed
CPC5611ATR
32-pin surface mount DAA with full-wave ring
detect, tape and reel
Transconductance
Stage
2-4 Wire Hybrid
AC/DC Termination
Hookswitch
Isolation Barrier
Vref
AGC
Vref
AGC
Snoop Amplifier
Receive
Isolation
Amplifier
Transmit
Isolation
Amplifier
TIP+
RING-
Transmit
Diff.
Amplifier
Receive
Diff.
Amplifier
CID/
RING
MUX
Tx+
Tx-
OH
RING
CID
Rx+
Rx-
Current Limit Control
AC Impedance Control
VI Slope Control
C
SNOOP
C
SNOOP
R
SNOOP
R
SNOOP
CPC5610/CPC5611
LITELINK™ II Silicon Data Access Arrangement (DAA) IC
CPC5610/CPC5611
2 www.clare.com R9.0
1 Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Application Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Resistive Termination Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1.1 Resistive Termination Application Circuit Part List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Reactive Termination Application Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2.1 Reactive Termination Application Circuit Part List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3 Using LITELINK. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1 Switch Hook Control (On-hook and Off-hook States) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.2 On-hook Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.2.1 Ring Signal Detection via the Snoop Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.2.2 Polarity Reversal Detection with CPC5611 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.2.3 On-hook Caller ID Signal Processing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.3 Off-Hook Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.3.1 Receive Signal Path. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.3.2 Transmit Signal Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.4 DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.4.1 Resistive Termination Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.4.2 Reactive Termination Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.5 AC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.5.1 Resistive Termination Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.5.2 Reactive Termination Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4 Regulatory Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5 LITELINK Design Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.1 Clare, Inc. Design Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.2 Third Party Design Resources. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6 LITELINK Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7 Manufacturing Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.1 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.2 Tape and Reel Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.3 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.3.1 Moisture Reflow Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.3.2 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.4 Washing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
CPC5610/CPC5611
Rev. 9.0 www.clare.com 3
1. Electrical Specifications
1.1 Absolute Maximum Ratings
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at these or
any other conditions beyond those indicated in the opera-
tional sections of this data sheet is not implied. Exposure of
the device to the absolute maximum ratings for an
extended period may degrade the device and affect its reli-
ability.
1.2 Performance
Parameter Minimum Maximum Unit
Isolation Voltage 1500 -
V
RMS
Continuous Tip to Ring
Current (R
ZDC
= 5.2)
150 mA
Total Package Power Dis-
sipation
1W
Operating temperature 0 +85 °C
Storage temperature -40 +125 °C
Soldering temperature - +220 °C
Parameter Minimum Typical Maximum Unit Conditions
DC Characteristics
Operating Voltage V
DD
3.0 - 5.50 V Host side
Operating Current I
DD
- - 10 mA Host side
Operating Voltage V
DDL
2.8 - 3.2 V Line side, derived from tip and ring
Operating Current I
DDL
- 10.5 12 mA Line side, drawn from tip and ring while off-hook
On-hook Characteristics
Metallic DC Resistance 10 - - M Tip to ring, 100 Vdc applied
Longitudinal DC Resistance 10 - - M 150 Vdc applied from tip and ring to Earth ground
Ring Signal Detect Level 5 - -
V
RMS
68 Hz ring signal applied to tip and ring
Ring Signal Detect Level 28 - -
V
RMS
15 Hz ring signal applied across tip and ring
Snoop Circuit Frequency Response 166 - >4000 Hz -3 dB corner frequency @ 166 Hz
Snoop Circuit CMRR - -40 - dB
120 V
RMS
60 Hz common mode signal across tip
and ring
Ringer Equivalence - 0.1B - REN
Longitudinal Balance 60 - - dB Per FCC part 68.3
Off-Hook Characteristics
AC Impedance - 600 -
Tip to ring, using resistive termination application
circuit
Longitudinal Balance 40 - - dB Per FCC part 68.3
Return Loss - 26 - dB Into 600 at 1800 Hz
Transmit and Receive Characteristics
Frequency Response 30 - 4000 Hz -3 dB corner frequency 30 Hz
Trans-Hybrid Loss - 36 - dB Into 600 at 1800 Hz, with C18
Transmit and Receive Insertion Loss -1 0 1 dB 30 Hz to 4 kHz
Average In-band Noise - -120 - dBm/Hz 4 kHz flat bandwidth
Harmonic Distortion - -80 - dB
-3 dBm, 600 Hz, 2
nd
harmonic
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