3
Absolute Maximum Ratings Thermal Information
DC Supply Voltage, V
CC
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, I
IK
For V
I
< -0.5V or V
I
> V
CC
+ 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
DC Drain Current, per Output, I
O
For -0.5V < V
O
< V
CC
+ 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA
DC Output Diode Current, I
OK
For V
O
< -0.5V or V
O
> V
CC
+ 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Source or Sink Current per Output Pin, I
O
For V
O
> -0.5V or V
O
< V
CC
+ 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC V
CC
or Ground Current, I
CC
. . . . . . . . . . . . . . . . . . . . . . . . .±50mA
Operating Conditions
Temperature Range, T
A
. . . . . . . . . . . . . . . . . . . . . . -55
o
C to 125
o
C
Supply Voltage Range, V
CC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, V
I
, V
O
. . . . . . . . . . . . . . . . . 0V to V
CC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
Package Thermal Impedance, θ
JA
(see Note 1)
E (PDIP) package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67
o
C/W
M (SOIC) package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
o
C/W
NS (SOP) package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64
o
C/W
PW (TSSOP) package. . . . . . . . . . . . . . . . . . . . . . . . . .108
o
C/W
Maximum Junction Temperature (Hermetic Package or Die) . . . 175
o
C
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150
o
C
Maximum Storage Temperature Range . . . . . . . . . .-65
o
C to 150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300
o
C
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
PARAMETER SYMBOL
TEST
CONDITIONS
V
CC
(V)
25
o
C -40
o
C TO 85
o
C -55
o
C TO 125
o
C
UNITSV
I
(V) I
O
(mA) MIN TYP MAX MIN MAX MIN MAX
HC TYPES
High Level Input
Voltage
V
IH
- - 2 1.5 - - 1.5 - 1.5 - V
4.5 3.15 - - 3.15 - 3.15 - V
6 4.2 - - 4.2 - 4.2 - V
Low Level Input
Voltage
V
IL
- - 2 - - 0.5 - 0.5 - 0.5 V
4.5 - - 1.35 - 1.35 - 1.35 V
6 - - 1.8 - 1.8 - 1.8 V
High Level Output
Voltage
CMOS Loads
V
OH
V
IH
or
V
IL
-0.02 2 1.9 - - 1.9 - 1.9 - V
4.5 4.4 - - 4.4 - 4.4 - V
6 5.9 - - 5.9 - 5.9 - V
High Level Output
Voltage
TTL Loads
---------V
-4 4.5 3.98 - - 3.84 - 3.7 - V
-5.2 6 5.48 - - 5.34 - 5.2 - V
Low Level Output
Voltage
CMOS Loads
V
OL
V
IH
or
V
IL
0.02 2 - - 0.1 - 0.1 - 0.1 V
4.5 - - 0.1 - 0.1 - 0.1 V
6 - - 0.1 - 0.1 - 0.1 V
Low Level Output
Voltage
TTL Loads
---------V
4 4.5 - - 0.26 - 0.33 - 0.4 V
5.2 6 - - 0.26 - 0.33 - 0.4 V
Input Leakage
Current
I
I
V
CC
or
GND
-6--±0.1 - ±1-±1 µA
CD54HC75, CD74HC75, CD54HCT75, CD74HCT75
