PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
5962-8974201RA ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
CD54HC374F3A ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
CD54HC574F ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
CD54HC574F3A ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
CD54HCT374F3A ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
CD54HCT574F ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
CD54HCT574F3A ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
CD74HC374E ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CD74HC374M ACTIVE SOIC DW 20 25 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HC374M96 ACTIVE SOIC DW 20 2000 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HC574E ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CD74HC574M ACTIVE SOIC DW 20 25 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HC574M96 ACTIVE SOIC DW 20 2000 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HCT374E ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CD74HCT374M ACTIVE SOIC DW 20 25 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HCT374M96 ACTIVE SOIC DW 20 2000 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HCT574E ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CD74HCT574M ACTIVE SOIC DW 20 25 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HCT574M96 ACTIVE SOIC DW 20 2000 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HCT574PWR ACTIVE TSSOP PW 20 2000 Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
Addendum-Page 1