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CD54HC244F

Part # CD54HC244F
Description OCTAL BUFFER/LINE DRIVER - Rail/Tube
Category IC
Availability In Stock
Qty 1
Qty Price
1 + $3.62964
Manufacturer Available Qty
RCA
Date Code: 8615
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

7
NOTE: Open drain waveforms t
PLZ
and t
PZL
are the same as those for three-state shown on the left. The test circuit is Output R
L
=1kto
V
CC
, C
L
= 50pF.
FIGURE 5. HC AND HCT THREE-STATE PROPAGATION DELAY TEST CIRCUIT
Test Circuits and Waveforms (Continued)
IC WITH
THREE-
STATE
OUTPUT
OTHER
INPUTS
T
IED HIGH
OR LOW
OUTPUT
DISABLE
V
CC
FOR t
PLZ
AND t
PZL
GND FOR t
PHZ
AND t
PZ
H
OUTPUT
R
L
= 1k
C
L
50pF
CD54/74HC240, CD54/74HCT240, CD74HC241, CD54/74HCT241, CD54/74HC244, CD54/74HCT244
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
CD54HC240F3A ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
CD54HC244F ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
CD54HC244F3A ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
CD54HCT240F3A ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
CD54HCT241F3A ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
CD54HCT244F ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
CD54HCT244F3A ACTIVE CDIP J 20 1 None Call TI Level-NC-NC-NC
CD74HC240E ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CD74HC240M ACTIVE SOIC DW 20 25 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HC240M96 ACTIVE SOIC DW 20 2000 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HC241E ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CD74HC241M ACTIVE SOIC DW 20 25 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HC241M96 ACTIVE SOIC DW 20 2000 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HC244E ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CD74HC244M ACTIVE SOIC DW 20 25 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HC244M96 ACTIVE SOIC DW 20 2000 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HCT240E ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CD74HCT240M ACTIVE SOIC DW 20 25 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HCT240M96 ACTIVE SOIC DW 20 2000 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HCT240PW ACTIVE TSSOP PW 20 70 Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
CD74HCT240PWR ACTIVE TSSOP PW 20 2000 Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
CD74HCT240PWT ACTIVE TSSOP PW 20 250 Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
CD74HCT241E ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CD74HCT241M ACTIVE SOIC DW 20 25 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HCT241M96 ACTIVE SOIC DW 20 2000 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HCT244E ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CD74HCT244M ACTIVE SOIC DW 20 25 Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HCT244M96 ACTIVE SOIC DW 20 2000 Pb-Free CU NIPDAU Level-2-250C-1 YEAR/
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
Addendum-Page 1
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
(RoHS) Level-1-235C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
Addendum-Page 2
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