CC1000
SWRS048A Page 52 of 55
35. Ordering Information
Chipcon Part
Number*
TI Part Number Description Minimum Order
Quantity (MOQ)
CC1000-RTB1 CC1000PW Single Chip RF Transceiver. CC1000,
TSSOP 28 package, RoHS compliant Pb-
free assembly in tubes with 50 pcs per tube.
250 (5 tubes of 50
units per tube)
CC1000-RTR1 CC1000PWR Single Chip RF Transceiver. CC1000,
TSSOP 28 package, RoHS compliant Pb-
free assembly, T&R with 2500 pcs per reel.
2500 (tape and
reel)
CC1000-RWP2 CC1000YZ Single Chip RF Transceiver. CC1000,
UltraCSP™ package, RoHS compliant Pb-
free assembly with 117 pcs per waffle pack.
585 (5 waffle
packs with 117
pcs per waffle
pack)
CC1000-RTR2 CC1000YZR Single Chip RF Transceiver. CC1000,
UltraCSP™ package, RoHS compliant Pb-
free assembly, T&R with 2500 pcs per reel.
2500 (tape and
reel)
CC1000DK-433 CC1000DK-433 CC1000 Development Kit, 433 MHz 1
CC1000DK-868-915 CC1000DK-868-915 CC1000 Development Kit, 868/915 MHz 1
CC1000PPK-433 CC1000PPK-433 CC1000 Plug & Play Kit, 433 MHz 1
CC1000PPK-868 CC1000PPK-868 CC1000 Plug & Play Kit, 868/915 MHz 1
* Chipcon part numbers are obsolete, but included for reference. Use the TI part numbers when ordering parts.
36. General Information
36.1 Document Revision History
Revision Date Description/Changes
SWRS048A January 2007 Reflow soldering temperature according to IPC/JEDEC J-STD-020C.
Max reflow temperature for CC1000 UltraCSP™ updated to 255 °C.
Added waffle pack specification.
Updated ordering information with TI part numbers.
Updated address information.
Updated header and footer.
Updated Important Notice.
Removed Chipcon specific Disclaimer, Trademarks and Life Support Policy
sections.
SWRS048
(2.3)
August 2005 UltraCSP™ package included
Minor corrections and editorial changes
2.2 April 2004 Shaping feature removed
Application circuit simplified
Additional information added for the demodulator
Additional information added for frequency calculation
Additional information added for calibration
Additional information added for crystal oscillator
Preliminary version removed
Narrow band information removed
REFDIV different in RX and TX
Minor corrections and editorial changes
36.2 Product Status Definitions
Data Sheet Identification Product Status Definition
Advance Information Planned or Under
Development
This data sheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary Engineering Samples
and First Production
This data sheet contains preliminary data, and
supplementary data will be published at a later date.
Chipcon reserves the right to make changes at any
time without notice in order to improve design and
supply the best possible product.
No Identification Noted Full Production This data sheet contains the final specifications.
Chipcon reserves the right to make changes at any
time without notice in order to improve design and
supply the best possible product.
