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AX1000-1FG896

Part # AX1000-1FG896
Description FPGA AXCELERATOR 612K GATES 12096 CELLS 763MHZ 0.15UM 1.5V
Category IC
Availability In Stock
Qty 1
Qty Price
1 + $464.44948
Manufacturer Available Qty
ACTEL
Date Code: 0833
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

November 2008 i
© 2008 Actel Corporation *See Actel’s website for the latest version of the datasheet.
Axcelerator Family FPGAs
Leading-Edge Performance
350+ MHz System Performance
500+ MHz Internal Performance
High-Performance Embedded FIFOs
700 Mb/s LVDS Capable I/Os
Specifications
Up to 2 Million Equivalent System Gates
Up to 684 I/Os
Up to 10,752 Dedicated Flip-Flops
Up to 295 kbits Embedded SRAM/FIFO
Manufactured on Advanced 0.15 μm CMOS Antifuse
Process Technology, 7 Layers of Metal
Features
Single-Chip, Nonvolatile Solution
Up to 100% Resource Utilization with 100% Pin Locking
1.5V Core Voltage for Low Power
Footprint Compatible Packaging
Flexible, Multi-Standard I/Os:
1.5V, 1.8V, 2.5V, 3.3V Mixed Voltage Operation
Bank-Selectable I/Os – 8 Banks per Chip
Single-Ended I/O Standards: LVTTL, LVCMOS, 3.3V
PCI, and 3.3V PCI-X
Differential I/O Standards: LVPECL and LVDS
Voltage-Referenced I/O Standards: GTL+, HSTL
Class 1, SSTL2 Class 1 and 2, SSTL3 Class 1 and 2
Registered I/Os
Hot-Swap Compliant I/Os (except PCI)
Programmable Slew Rate and Drive Strength on
Outputs
Programmable Delay and Weak Pull-Up/Pull-Down
Circuits on Inputs
Embedded Memory:
Variable-Aspect 4,608-bit RAM Blocks (x1, x2, x4,
x9, x18, x36 Organizations Available)
Independent, Width-Configurable Read and Write Ports
Programmable Embedded FIFO Control Logic
Segmentable Clock Resources
Embedded Phase-Locked Loop:
14-200 MHz Input Range
Frequency Synthesis Capabilities up to 1 GHz
Deterministic, User-Controllable Timing
Unique In-System Diagnostic and Debug Capability
with Actel Silicon Explorer II
Boundary-Scan Testing Compliant with IEEE Standard
1149.1 (JTAG)
•FuseLock
TM
Secure Programming Technology
Prevents Reverse Engineering and Design Theft
e
u
Table 1-1 Axcelerator Family Product Profile
Device AX125 AX250 AX500 AX1000 AX2000
Capacity (in Equivalent System Gates) 125,000 250,000 500,000 1,000,000 2,000,000
Typical Gates 82,000 154,000 286,000 612,000 1,060,000
Modules
Register (R-cells) 672 1,408 2,688 6,048 10,752
Combinatorial (C-cells) 1,344 2,816 5,376 12,096 21,504
Maximum Flip-Flops 1,344 2,816 5,376 12,096 21,504
Embedded RAM/FIFO
Number of Core RAM Blocks 4 12 16 36 64
Total Bits of Core RAM 18,432 55,296 73,728 165,888 294,912
Clocks (Segmentable)
Hardwired 4 4 4 4 4
Routed 4 4 4 4 4
PLLs 88888
I/Os
I/O Banks 8 8 8 8 8
Maximum User I/Os 168 248 336 516 684
Maximum LVDS Channels 84 124 168 258 342
Total I/O Registers 504 744 1,008 1,548 2,052
Package
CSP
PQFP
BGA
FBGA
CQFP
CCGA
180
256, 324
208
256, 484
208, 352
208
484, 676
208, 352
729
484, 676, 896
352
624
896, 1152
352
624
v2.7
Axcelerator Family FPGAs
ii v2.7
Ordering Information
Device Resources
AX1000 1 FG
_
Blank
=
Standard Speed
=
Approximately 15% Faster than Standard
1
=
Approximately 25% Faster than Standard2
Package Type
=
Ball Grid Array (1.27mm pitch)
=
Fine Ball Grid Array (1.0mm pitch)
=
Chip Scale Package (0.8mm pitch)
PQ
=
Plastic Quad Flat Pack (0.5mm pitch)
CQ
=
Ceramic Quad Flat Pack (0.5mm pitch)
896 I
Package Lead C
ount
G
Application
Blank = Commercial (0 to +70° C)
I=Industrial (-40 to +85° C)
PP = Pre-Production
125,000 Equivalent System Gates
AX125 =
AX250
250,000 Equivalent System Gates
=
AX500
500,000 Equivalent System Gates
=
AX1000
1,000,000 Equivalent System Gates
=
AX2000
2,000,000 Equivalent System Gates
=
Part Number
Speed Grade
BG
FG
CS
CG
=
Ceramic Column Grid Array
M=Military (-55 to +125° C)
B=MIL-STD-883 Class B
Lead-Free Packaging
Blank = Standard Packaging
G= RoHS-Compliant Packaging
User I/Os (Including Clock Buffers)
Package AX125 AX250 AX500 AX1000 AX2000
CS180 98––––
PQ208 115 115
CQ208 115 115
FG256 138 138
FG324 168––––
CQ352 198 198 198 198
FG484 248 317 317
CG624 418 418
FG676 336 418
BG729 516
FG896 516 586
FG1152 684
Note: The FG256, FG324, and FG484 are footprint compatible with one another. The FG676, FG896, and FG1152 are also footprint
compatible with one another.
Axcelerator Family FPGAs
v2.7 iii
Temperature Grade Offerings
Speed Grade and Temperature Grade Matrix
Packaging Data
Refer to the following documents located on the Actel website for additional packaging information.
Package Mechanical Drawings
Package Thermal Characteristics and Weights
Hermatic Package Mechanical Information
Contact your local Actel representative for device availability.
Package AX125 AX250 AX500 AX1000 AX2000
CS180 C, I
PQ208 C, I, M C, I, M
CQ208 M, B M, B
FG256 C, I C, I, M
FG324 C, I–––
CQ352 M, B M, B M, B M, B
FG484 C, I, M C, I, M C, I, M
CG624 M, B M, B
FG676 C, I, M C, I, M
BG729 C, I, M
FG896 C, I, M C, I, M
FG1152 C, I, M
Notes:
1. C = Commercial
2. I = Industrial
3. M = Military
4. B = MIL-STD-883 Class B
Std –1 –2
C ✓✓
I ✓✓
M ✓✓
B ✓✓
Notes:
5. C = Commercial
6. I = Industrial
7. M = Military
8. B = MIL-STD-883 Class B
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