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AT45DB081D-SU-2.5

Part # AT45DB081D-SU-2.5
Description DATAFLASH, 8M, SERIAL, 2.5V -IND TEMP, GREEN 8 LEAD SOIC
Category IC
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

46
3596E–DFLASH–02/07
AT45DB081D
Figure 25-2. Algorithm for Randomly Modifying Data
Notes: 1. To preserve data integrity, each page of a DataFlash sector must be updated/rewritten at least once within every 10,000
cumulative page erase and program operations.
2. A Page Address Pointer must be maintained to indicate which page is to be rewritten. The Auto Page Rewrite command
must use the address specified by the Page Address Pointer.
3. Other algorithms can be used to rewrite portions of the Flash array. Low-power applications may choose to wait until 10,000
cumulative page erase and program operations have accumulated before rewriting all pages of the sector. See application
note AN-4 (“Using Atmel’s Serial DataFlash”) for more details.
START
MAIN MEMORY PAGE
TO BUFFER TRANSFER
(53H, 55H)
INCREMENT PAGE
ADDRESS POINTER
(2)
AUTO PAGE REWRITE
(2)
(58H, 59H)
END
provide address of
page to modify
If planning to modify multiple
bytes currently stored within
a page of the Flash array
MAIN MEMORY PAGE PROGRAM
THROUGH BUFFER
(82H, 85H)
BUFFER WRITE
(84H, 87H)
BUFFER TO MAIN
MEMORY PAGE PROGRAM
(83H, 86H)
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3596E–DFLASH–02/07
AT45DB081D
26. Ordering Information
26.1 Green Package Options (Pb/Halide-free/RoHS Compliant)
f
SCK
(MHz)
I
CC
(mA)
Ordering Code Package Operation RangeActive Standby
66 15 0.05
AT45DB081D-SSU 8S1
Industrial
(-40°C to 85°C)
AT45DB081D-SU 8S2
AT45DB081D-MU 8M1-A
50 15 0.05
AT45DB081D-SSU-2.5 8S1
AT45DB081D-SU-2.5 8S2
AT45DB081D-MU-2.5 8M1-A
Package Type
8S1 8-lead, 0.150” Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8S2 8-lead, 0.209” Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8M1-A 8-lead, 6 mm x 5 mm Very Thin Micro Lead-frame Package (MLF)
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3596E–DFLASH–02/07
AT45DB081D
27. Packaging Information
27.1 8S1 – JEDEC SOIC
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TITLE
DRAWING NO.
R
REV.
Note:
3/17/05
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
8S1 C
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A1 0.10 0.25
These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.
Ø
Ø
E
E
1
1
N
N
TOP VIEW
C
C
E1
E1
END VIEW
A
A
b
b
L
L
A1
A1
e
e
D
D
SIDE VIEW
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