13
5298A–SEEPR–1/08
AT24C32C/64C
Notes: 1. “-B” denotes Bulk.
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini-MAP and dBGA2 = 5K per reel.
3. Available in waffle pack, tape and reel, and wafer form; order as SL788 for inkless wafer form. Bumped die available upon
request. Please contact Serial Interface Marketing.
AT24C32C Ordering Information
Ordering Code Voltage Package Operation Range
AT24C32C-PU
(Bulk form only)
AT24C32CN-SH-B
(1)
(NiPdAu Lead Finish)
AT24C32CN-SH-T
(2)
(NiPdAu Lead Finish)
AT24C32C-TH-B
(1)
(NiPdAu Lead Finish)
AT24C32C-TH-T
(2)
(NiPdAu Lead Finish)
AT24C32CY6-YH-T
(2)
(NiPdAu Lead Finish)
AT24C32CD3-DH-T
(2)
(NiPdAu Lead Finish)
AT24C32CU2-UU-T
(2)
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
8P3
8S1
8S1
8A2
8A2
8Y6
8D3
8U2-1
Lead-free/Halogen-free
Industrial Temperature
(-40°C to 85°C)
AT24C32C-W-11
(3)
1.8 Die Sale
Industrial Temperature
(-40°C to 85°C)
Package Type
8Y6 8-lead, 2.00mm x 3.00mm Body, 0.50mm Pitch, Ultra Thin Mini-MAP, Dual no Lead Package (DFN), (MLP 2x3)
8P3 8-lead, 0.300” Wide, Plastic Dual Inline Package (PDIP)
8S1 8-lead, 0.150” Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2 8-lead, 4.4 mm Body, Plastic, Thin Shrink Small Outline Package (TSSOP)
8U2-1 8-ball, die Ball Grid Array Package (dBGA2)
8D3 8-lead, 1.80 mm x 2.20 mm Body, Ultra Lead Frame Land Grid Array (ULA)
Options
-1.8 Low Voltage (1.8V to 5.5V)
