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AM26LS33AMFKB

Part # AM26LS33AMFKB
Description
Category IC
Availability Out of Stock
Qty 0
Qty Price
1 + $13.00000

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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
5962-7802003M2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
5962-7802003MEA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
5962-7802003MFA ACTIVE CFP W 16 1 TBD A42 SNPB N / A for Pkg Type
5962-7802004M2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
5962-7802004MEA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
5962-7802004MFA ACTIVE CFP W 16 1 TBD A42 SNPB N / A for Pkg Type
AM26LS32ACD ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
AM26LS32ACDE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
AM26LS32ACDR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
AM26LS32ACDRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
AM26LS32ACN ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
AM26LS32ACNE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
AM26LS32ACNSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
AM26LS32ACNSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
AM26LS32AID ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
AM26LS32AIDE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
AM26LS32AIDR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
AM26LS32AIDRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
AM26LS32AIN ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
AM26LS32AINE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
AM26LS32AMFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
AM26LS32AMJ ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
AM26LS32AMJB ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
AM26LS32AMWB ACTIVE CFP W 16 1 TBD A42 SNPB N / A for Pkg Type
AM26LS33ACD ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
AM26LS33ACDE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
AM26LS33ACDG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
AM26LS33ACDR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
AM26LS33ACDRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com
19-Oct-2006
Addendum-Page 1
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
AM26LS33ACDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
AM26LS33ACN ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
AM26LS33ACNE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
AM26LS33AMFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
AM26LS33AMJ ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
AM26LS33AMJB ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
AM26LS33AMWB ACTIVE CFP W 16 1 TBD A42 SNPB N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
19-Oct-2006
Addendum-Page 2
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