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A3P250-FGG144

Part # A3P250-FGG144
Description IC FPGA 97 I/O 144FBGA
Category IC
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

ProASIC3 DC and Switching Characteristics
v1.3 2-107
Advance v0.5
(continued)
The "I/O Banks" section is new. This section explains the following types of I/Os:
Advanced
Standard+
Standard
Table 2-12 Automotive ProASIC3 Bank Types Definition and Differences is
new. This table describes the standards listed above.
2-29
PCI-X 3.3 V was added to the Compatible Standards for 3.3 V in Table 2-
11 VCCI Voltages and Compatible Standards
2-29
Table 2-13 ProASIC3 I/O Features was updated. 2-30
The "Double Data Rate (DDR) Support" section was updated to include
information concerning implementation of the feature.
2-32
The "Electrostatic Discharge (ESD) Protection" section was updated to include
testing information.
2-35
Level 3 and 4 descriptions were updated in Table 2-43 I/O Hot-Swap and 5 V
Input Tolerance Capabilities in ProASIC3 Devices.
2-64
The notes in Table 2-43 I/O Hot-Swap and 5 V Input Tolerance Capabilities in
ProASIC3 Devices were updated.
2-64
The "Simultaneous Switching Outputs (SSOs) and Printed Circuit Board Layout"
section is new.
2-41
A footnote was added to Table 2-14 Maximum I/O Frequency for Single-Ended
and Differential I/Os in All Banks in Automotive ProASIC3 Devices (maximum
drive strength and high slew selected).
2-30
Table 2-18 Automotive ProASIC3 I/O Attributes vs. I/O Standard Applications 2-45
Table 2-50 ProASIC3 Output Drive (OUT_DRIVE) for Standard I/O Bank Type
(A3P030 device)
2-83
Table 2-51 ProASIC3 Output Drive for Standard+ I/O Bank Type was updated. 2-84
Table 2-54 ProASIC3 Output Drive for Advanced I/O Bank Type was updated. 2-84
The "x" was updated in the "User I/O Naming Convention" section. 2-48
The "V
CC
Core Supply Voltage" pin description was updated. 2-50
The "VMVx I/O Supply Voltage (quiet)" pin description was updated to include
information concerning leaving the pin unconnected.
2-50
The "V
JTAG
JTAG Supply Voltage" pin description was updated. 2-50
The "V
PUMP
Programming Supply Voltage" pin description was updated to
include information on what happens when the pin is tied to ground.
2-50
The "I/O User Input/Output" pin description was updated to include information
on what happens when the pin is unused.
2-50
The "JTAG Pins" section was updated to include information on what happens
when the pin is unused.
2-51
The "Programming" section was updated to include information concerning
serialization.
2-53
The "JTAG 1532" section was updated to include SAMPLE/PRELOAD
information.
2-54
"DC and Switching Characteristics" chapter was updated with new information. 3-1
Previous Version Changes in Current Version (v1.3) Page
ProASIC3 DC and Switching Characteristics
2-108 v1.3
Advance v0.3 M7 device information is new. N/A
Table 2-4 ProASIC3 Globals/Spines/Rows by Device was updated to include the
number or rows in each top or bottom spine.
2-16
EXTFB was removed from Figure 2-24 ProASIC3E CCC Options. 2-24
The "PLL Macro" section was updated. EXTFB information was removed from
this section.
2-15
The CCC Output Peak-to-Peak Period Jitter F
CCC_OUT
was updated in Table 2-
11 ProASIC3 CCC/PLL Specification
2-29
EXTFB was removed from Figure 2-27 CCC/PLL Macro. 2-28
Table 2-13 ProASIC3 I/O Features was updated. 2-30
The "Hot-Swap Support" section was updated. 2-33
The "Cold-Sparing Support" section was updated. 2-34
"Electrostatic Discharge (ESD) Protection" section was updated. 2-35
The LVPECL specification in Table 2-43 I/O Hot-Swap and 5 V Input Tolerance
Capabilities in ProASIC3 Devices was updated.
2-64
In the Bank 1 area of Figure 2-72, VMV2 was changed to VMV1 and V
CCI
B2 was
changed to V
CCI
B1.
2-97
The VJTAG and I/O pin descriptions were updated in the "Pin Descriptions"
section.
2-50
The "JTAG Pins" section was updated. 2-51
"128-Bit AES Decryption" section was updated to include M7 device
information.
2-53
Table 3-6 was updated. 3-6
Table 3-7 was updated. 3-6
In Table 3-11, PAC4 was updated. 3-93-8
Table 3-20 was updated. 3-20
The note in Table 3-32 was updated. 3-27
All Timing Characteristics tables were updated from LVTTL to Register Delays 3-31 to
3-73
The Timing Characteristics for RAM4K9, RAM512X18, and FIFO were updated. 3-85 to
3-90
F
TCKMAX
was updated in Table 3-110. 3-97
Advance v0.2 Figure 2-11 was updated. 2-9
The "Clock Resources (VersaNets)" section was updated. 2-9
The "VersaNet Global Networks and Spine Access" section was updated. 2-9
The "PLL Macro" section was updated. 2-15
Figure 2-27 was updated. 2-28
Figure 2-20 was updated. 2-19
Table 2-5 was updated. 2-25
Table 2-6 was updated. 2-25
Previous Version Changes in Current Version (v1.3) Page
ProASIC3 DC and Switching Characteristics
v1.3 2-109
Advance v0.2
(continued)
The "FIFO Flag Usage Considerations" section was updated. 2-27
Table 2-13 was updated. 2-30
Figure 2-24 was updated. 2-31
The "Cold-Sparing Support" section is new. 2-34
Table 2-43 was updated. 2-64
Table 2-18 was updated. 2-45
Pin descriptions in the "JTAG Pins" section were updated. 2-51
The "User I/O Naming Convention" section was updated. 2-48
Table 3-7 was updated. 3-6
The "Methodology" section was updated. 3-10
Table 3-40 and Table 3-39 were updated. 3-33,
3-32
Previous Version Changes in Current Version (v1.3) Page
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