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A3P250-FGG144

Part # A3P250-FGG144
Description IC FPGA 97 I/O 144FBGA
Category IC
Availability Out of Stock
Qty 0
Qty Price
1 + $15.25371



Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

ProASIC3 DC and Switching Characteristics
2-20 v1.3
Summary of I/O Timing Characteristics – Default I/O Software Settings
Table 2-21 • Summary of Maximum and Minimum DC Input Levels
Applicable to Commercial and Industrial Conditions
DC I/O Standards
Commercial
1
Industrial
2
I
IL
I
IH
I
IL
I
IH
µA µA µA µA
3.3 V LVTTL / 3.3 V LVCMOS 10 10 15 15
2.5 V LVCMOS 10 10 15 15
1.8 V LVCMOS 10 10 15 15
1.5 V LVCMOS 10 10 15 15
3.3 V PCI 10 10 15 15
3.3 V PCI-X 10 10 15 15
Notes:
1. Commercial range (0°C < T
A
< 70°C)
2. Industrial range (–40°C < T
A
< 85°C)
Table 2-22 • Summary of AC Measuring Points
Standard Measuring Trip Point (V
trip
)
3.3 V LVTTL / 3.3 V LVCMOS 1.4 V
2.5 V LVCMOS 1.2 V
1.8 V LVCMOS 0.90 V
1.5 V LVCMOS 0.75 V
3.3 V PCI 0.285 * V
CCI
(RR)
0.615 * V
CCI
(FF)
3.3 V PCI-X 0.285 * V
CCI
(RR)
0.615 * V
CCI
(FF)
Table 2-23 • I/O AC Parameter Definitions
Parameter Parameter Definition
t
DP
Data to Pad delay through the Output Buffer
t
PY
Pad to Data delay through the Input Buffer
t
DOUT
Data to Output Buffer delay through the I/O interface
t
EOUT
Enable to Output Buffer Tristate Control delay through the I/O interface
t
DIN
Input Buffer to Data delay through the I/O interface
t
HZ
Enable to Pad delay through the Output Buffer—HIGH to Z
t
ZH
Enable to Pad delay through the Output Buffer—Z to HIGH
t
LZ
Enable to Pad delay through the Output Buffer—LOW to Z
t
ZL
Enable to Pad delay through the Output Buffer—Z to LOW
t
ZHS
Enable to Pad delay through the Output Buffer with delayed enable—Z to HIGH
t
ZLS
Enable to Pad delay through the Output Buffer with delayed enable—Z to LOW
ProASIC3 DC and Switching Characteristics
v1.3 2-21
Table 2-24 • Summary of I/O Timing Characteristics—Software Default Settings
–2 Speed Grade, Commercial-Case Conditions: T
J
= 70°C, Worst Case V
CC
= 1.425 V,
Worst Case V
CCI
= 3.0 V
Advanced I/O Banks
I/O Standard
Drive Strength (mA)
Slew Rate
Capacitive Load (pF)
External Resistor ()
t
DOUT
(ns)
t
DP
(ns)
t
DIN
(ns)
t
PY
(ns)
t
EOUT
(ns)
t
ZL
(ns)
t
ZH
(ns)
t
LZ
(ns)
t
HZ
(ns)
t
ZLS
(ns)
t
ZHS
(ns)
Units
3.3 V LVTTL /
3.3 V LVCMOS
12 High 35 0.492.640.030.760.322.692.112.402.684.363.78 ns
2.5 V LVCMOS 12 High 35 0.492.660.030.980.322.712.562.472.574.384.23 ns
1.8 V LVCMOS 12 High 35 0.492.640.030.910.322.692.272.763.054.363.94 ns
1.5 V LVCMOS 12 High 35 0.493.050.031.070.323.102.672.953.144.774.34 ns
3.3 V PCI Per PCI spec. High 10 25
2
0.49 2.00 0.03 0.65 0.32 2.04 1.46 2.40 2.68 3.71 3.13 ns
3.3 V PCI-X Per PCI-X spec. High 10 25
2
0.49 2.00 0.03 0.65 0.32 2.04 1.46 2.40 2.68 3.71 3.13 ns
LVDS 24 High0.491.370.031.20–––––––n
LVPECL 24 High0.491.340.031.05–––––––ns
Notes:
1. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating
values.
2. Resistance is used to measure I/O propagation delays as defined in PCI specifications. See Figure 2-10 on
page 2-56 for connectivity. This resistor is not required during normal operation.
ProASIC3 DC and Switching Characteristics
2-22 v1.3
Table 2-25 • Summary of I/O Timing Characteristics—Software Default Settings
–2 Speed Grade, Commercial-Case Conditions: T
J
= 70°C, Worst Case V
CC
= 1.425 V, Worst Case
V
CCI
=3.0V
Standard Plus I/O Banks
I/O Standard
Drive Strength (mA)
Slew Rate
Capacitive Load (pF)
External Resistor
t
DOUT
(ns)
t
DP
(ns)
t
DIN
(ns)
t
PY
(ns)
t
EOUT
(ns)
t
ZL
(ns)
t
ZH
(ns)
t
LZ
(ns)
t
HZ
(ns)
t
ZLS
(ns)
t
ZHS
(ns)
Units
3.3 V LVTTL /
3.3 V LVCMOS
12 mA High 35 pF 0.49 2.36 0.03 0.75 0.32 2.40 1.93 2.08 2.41 4.07 3.60 ns
2.5 V LVCMOS 12 mA High 35 pF 0.49 2.39 0.03 0.97 0.32 2.44 2.35 2.11 2.32 4.11 4.02 ns
1.8 V LVCMOS 8 mA High 35 pF 0.49 3.03 0.030.900.322.873.032.192.324.544.70 ns
1.5 V LVCMOS 4 mA High 35 pF 0.49 3.61 0.031.060.323.353.612.262.345.025.28 ns
3.3 V PCI Per PCI spec. High 10 pF 25
2
0.49 1.72 0.03 0.64 0.32 1.76 1.27 2.08 2.41 3.42 2.94 ns
3.3 V PCI-X Per PCI-X spec. High 10 pF 25
2
0.49 1.72 0.03 0.64 0.32 1.76 1.27 2.08 2.41 3.42 2.94 ns
Notes:
1. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating
values.
2. Resistance is used to measure I/O propagation delays as defined in PCI specifications. See Figure 2-10 on
page 2-56 for connectivity. This resistor is not required during normal operation.
Table 2-26 • Summary of I/O Timing Characteristics—Software Default Settings
–2 Speed Grade, Commercial-Case Conditions: T
J
= 70°C, Worst Case V
CC
= 1.425 V,
Worst Case V
CCI
= 3.0 V
Standard I/O Banks
I/O Standard
Drive Strength (mA)
Slew Rate
Capacitive Load (pF)
External Resistor
t
DOUT
(ns)
t
DP
(ns)
t
DIN
(ns)
t
PY
(ns)
t
EOUT
(ns)
t
ZL
(ns)
t
ZH
(ns)
t
LZ
(ns)
t
HZ
(ns)
Units
3.3 V LVTTL /
3.3 V LVCMOS
8 mA High 35 pF 0.49 3.29 0.03 0.75 0.32 3.36 2.80 1.79 2.01 ns
2.5 V LVCMOS 8 mA High 35 pF 0.49 3.56 0.03 0.96 0.32 3.40 3.56 1.78 1.91 ns
1.8 V LVCMOS 4 mA High 35 pF 0.49 4.74 0.03 0.90 0.32 4.02 4.74 1.80 1.85 ns
1.5 V LVCMOS 2 mA High 35 pF 0.49 5.71 0.03 1.06 0.32 4.71 5.71 1.83 1.83 ns
Notes:
1. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating
values.
2. Resistance is used to measure I/O propagation delays as defined in PCI specifications. See Figure 2-10 on
page 2-56 for connectivity. This resistor is not required during normal operation.
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