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A3P250-FGG144

Part # A3P250-FGG144
Description IC FPGA 97 I/O 144FBGA
Category IC
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

IV v1.0
Temperature Grade Offerings
Speed Grade and Temperature Grade Matrix
References made to ProASIC3 devices also apply to ARM-enabled ProASIC3 devices. The ARM-enabled part numbers start
with M7 (CoreMP7) and M1 (Cortex-M1).
Contact your local Actel representative for device availability: http://www.actel.com/contact/default.aspx.
A3P015 and A3P030
The A3P015 and A3P030 are architecturally compatible; there are no RAM or PLL features.
Package A3P015 A3P030 A3P060 A3P125 A3P250 A3P400 A3P600 A3P1000
ARM7 Devices
M7A3P1000
Cortex-M1 Devices
M1A3P250 M1A3P400 M1A3P600 M1A3P1000
QN68 C, I–––
QN132 C, I C, I C, I C, I
VQ100 C, I C, I C, I C, I
TQ144 C, I C, I
PQ208 C, I C, I C, I C, I C, I
FG144 C, I C, I C, I C, I C, I C, I
FG256 C, I C, I C, I C, I
FG484 C, I C, I C, I
Notes:
1. C = Commercial temperature range: 0°C to 70°C ambient temperature
2. I = Industrial temperature range: –40°C to 85°C ambient temperature
Temperature Grade –F
1
Std. –1 –2
C
2
✓✓✓✓
I
3
✓✓✓
Notes:
1. The DC and switching characteristics for the –F speed grade targets are based only on simulation.
The characteristics provided for the –F speed grade are subject to change after establishing FPGA specifications. Some
restrictions might be added and will be reflected in future revisions of this document. The –F speed grade is only
supported in the commercial temperature range.
2. C = Commercial temperature range: 0°C to 70°C ambient temperature
3. I = Industrial temperature range: –40°C to 85°C ambient temperature
v1.0 1-1
1 – ProASIC3 Device Family Overview
General Description
ProASIC3, the third-generation family of Actel flash FPGAs, offers performance, density, and
features beyond those of the ProASIC
PLUS®
family. Nonvolatile flash technology gives ProASIC3
devices the advantage of being a secure, low-power, single-chip solution that is live at power-up
(LAPU). ProASIC3 is reprogrammable and offers time-to-market benefits at an ASIC-level unit cost.
These features enable designers to create high-density systems using existing ASIC or FPGA design
flows and tools.
ProASIC3 devices offer 1 kbit of on-chip, reprogrammable, nonvolatile FlashROM storage as well as
clock conditioning circuitry based on an integrated phase-locked loop (PLL). The A3P015 and
A3P030 devices have no PLL or RAM support. ProASIC3 devices have up to 1 million system gates,
supported with up to 144 kbits of true dual-port SRAM and up to 300 user I/Os.
ProASIC3 devices support the ARM7 soft IP core and Cortex-M1 devices. The ARM-enabled devices
have Actel ordering numbers that begin with M7A3P (CoreMP7) and M1A3P (Cortex-M1) and do
not support AES decryption.
Flash Advantages
Reduced Cost of Ownership
Advantages to the designer extend beyond low unit cost, performance, and ease of use. Unlike
SRAM-based FPGAs, flash-based ProASIC3 devices allow all functionality to be live at power-up; no
external boot PROM is required. On-board security mechanisms prevent access to all the
programming information and enable secure remote updates of the FPGA logic. Designers can
perform secure remote in-system reprogramming to support future design iterations and field
upgrades with confidence that valuable intellectual property (IP) cannot be compromised or
copied. Secure ISP can be performed using the industry-standard AES algorithm. The ProASIC3
family device architecture mitigates the need for ASIC migration at higher user volumes. This
makes the ProASIC3 family a cost-effective ASIC replacement solution, especially for applications in
the consumer, networking/ communications, computing, and avionics markets.
Security
The nonvolatile, flash-based ProASIC3 devices do not require a boot PROM, so there is no
vulnerable external bitstream that can be easily copied. ProASIC3 devices incorporate FlashLock,
which provides a unique combination of reprogrammability and design security without external
overhead, advantages that only an FPGA with nonvolatile flash programming can offer.
ProASIC3 devices utilize a 128-bit flash-based lock and a separate AES key to secure programmed
intellectual property and configuration data. In addition, all FlashROM data in ProASIC3 devices
can be encrypted prior to loading, using the industry-leading AES-128 (FIPS192) bit block cipher
encryption standard. The AES standard was adopted by the National Institute of Standards and
Technology (NIST) in 2000 and replaces the 1977 DES standard. ProASIC3 devices have a built-in AES
decryption engine and a flash-based AES key that make them the most comprehensive
programmable logic device security solution available today. ProASIC3 devices with AES-based
security allow for secure, remote field updates over public networks such as the Internet, and
ensure that valuable IP remains out of the hands of system overbuilders, system cloners, and IP
thieves. The contents of a programmed ProASIC3 device cannot be read back, although secure
design verification is possible.
ARM-enabled ProASIC3 devices do not support user-controlled AES security mechanisms. Since the
ARM core must be protected at all times, AES encryption is always on for the core logic, so
bitstreams are always encrypted. There is no user access to encryption for the FlashROM
programming data.
ProASIC3 Device Family Overview
1-2 v1.0
Security, built into the FPGA fabric, is an inherent component of the ProASIC3 family. The flash cells
are located beneath seven metal layers, and many device design and layout techniques have been
used to make invasive attacks extremely difficult. The ProASIC3 family, with FlashLock and AES
security, is unique in being highly resistant to both invasive and noninvasive attacks. Your valuable
IP is protected and secure, making remote ISP possible. A ProASIC3 device provides the most
impenetrable security for programmable logic designs.
Single Chip
Flash-based FPGAs store their configuration information in on-chip flash cells. Once programmed,
the configuration data is an inherent part of the FPGA structure, and no external configuration
data needs to be loaded at system power-up (unlike SRAM-based FPGAs). Therefore, flash-based
ProASIC3 FPGAs do not require system configuration components such as EEPROMs or
microcontrollers to load device configuration data. This reduces bill-of-materials costs and PCB
area, and increases security and system reliability.
Live at Power-Up
The Actel flash-based ProASIC3 devices support Level 0 of the LAPU classification standard. This
feature helps in system component initialization, execution of critical tasks before the processor
wakes up, setup and configuration of memory blocks, clock generation, and bus activity
management. The LAPU feature of flash-based ProASIC3 devices greatly simplifies total system
design and reduces total system cost, often eliminating the need for CPLDs and clock generation
PLLs that are used for these purposes in a system. In addition, glitches and brownouts in system
power will not corrupt the ProASIC3 device's flash configuration, and unlike SRAM-based FPGAs,
the device will not have to be reloaded when system power is restored. This enables the reduction
or complete removal of the configuration PROM, expensive voltage monitor, brownout detection,
and clock generator devices from the PCB design. Flash-based ProASIC3 devices simplify total
system design and reduce cost and design risk while increasing system reliability and improving
system initialization time.
Firm Errors
Firm errors occur most commonly when high-energy neutrons, generated in the upper atmosphere,
strike a configuration cell of an SRAM FPGA. The energy of the collision can change the state of the
configuration cell and thus change the logic, routing, or I/O behavior in an unpredictable way.
These errors are impossible to prevent in SRAM FPGAs. The consequence of this type of error can be
a complete system failure. Firm errors do not exist in the configuration memory of ProASIC3 flash-
based FPGAs. Once it is programmed, the flash cell configuration element of ProASIC3 FPGAs
cannot be altered by high-energy neutrons and is therefore immune to them. Recoverable (or soft)
errors occur in the user data SRAM of all FPGA devices. These can easily be mitigated by using error
detection and correction (EDAC) circuitry built into the FPGA fabric.
Low Power
Flash-based ProASIC3 devices exhibit power characteristics similar to an ASIC, making them an ideal
choice for power-sensitive applications. ProASIC3 devices have only a very limited power-on current
surge and no high-current transition period, both of which occur on many FPGAs.
ProASIC3 devices also have low dynamic power consumption to further maximize power savings.
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