08C to +708C –558C to +1258C
AD9696/AD9698 AD9696/AD9698
Test KN/KQ/KR TQ
Parameter Temp Level Min Typ Max Min Typ Max Units
POWER SUPPLY
6
Positive Supply Current
7
(+5.0 V)
AD9696 Full VI 26 32 26 32 mA
AD9698 Full VI 52 64 52 64 mA
Negative Supply Current
8
(–5.2 V)
AD9696 Full VI 2.5 4.0 2.5 4.0 mA
AD9698 Full VI 5.0 8.0 5.0 8.0 mA
Power Dissipation
AD9696 +5.0 V Full V 130 130 mW
AD9696 ±5.0 V Full V 146 146 mW
AD9698 +5.0 V Full V 260 260 mW
AD9698 ±5.0 V Full V 292 292 mW
Power Supply Rejection Ratio
9
+25°CVI 70 70 dB
Full VI 65 65 dB
NOTES
1
Absolute maximum ratings are limiting values, to be applied individually,
and beyond which the serviceability of the circuit may be impaired. Functional
operability is not necessarily implied. Exposure to absolute maximum rating
conditions for an extended period of time may affect device reliability.
2
Typical thermal impedances:
AD9696 Metal Can θ
JA
= 170°C/W θ
JC
= 50°C/W
AD9696 Ceramic DIP θ
JA
= 110°C/W θ
JC
= 20°C/W
AD9696 Plastic DIP θ
JA
= 160°C/W θ
JC
= 30°C/W
AD9696 Plastic SOIC θ
JA
= 180°C/W θ
JC
= 30°C/W
AD9698 Ceramic DIP θ
JA
= 90°C/W θ
JC
= 25°C/W
AD9698 Plastic DIP θ
JA
= 100°C/W θ
JC
= 20°C/W
AD9698 Plastic SOIC θ
JA
= 120°C/W θ
JC
= 20°C/W
3
Load circuit has 420 Ω from +V
S
to output; 460 Ω from output to ground.
4
R
S
≤100 Ω.
5
Propagation delays measured with 100 mV pulse; 10 mV overdrive.
6
Supply voltages should remain stable within ±5% for normal operation.
7
Specification applies to both +5 V and ±5 V supply operation.
8
Specification applies to only ±5 V supply operation.
9
Measured with nominal values ± 5% of +V
S
and –V
S
.
10
Although fall time is faster than rise time, the complementary outputs cross at
midpoint of logic swing because of delay on start of falling edge.
Specifications subject to change without notice.
EXPLANATION OF TEST LEVELS
Test Level
I – 100% production tested.
II – 100% production tested at +25°C, and sample tested at
specified temperatures.
III – Sample tested only.
IV – Parameter is guaranteed by design and characterization
testing.
V – Parameter is a typical value only.
VI – All devices are 100% production tested at +25°C.
100% production tested at temperature extremes for
extended temperature devices; sample tested at temp-
erature extremes for commercial/industrial devices.
ORDERING GUIDE
Package
Model Package Temperature Option
1
AD9696KN Plastic DIP 0°C to +70°C N-8
AD9696KR SOIC 0°C to +70°C R-8
AD9696KQ Cerdip 0°C to +70°C Q-8
AD9696TQ Cerdip –55°C to +125°C Q-8
AD9696TZ/883B
2
Gullwing –55°C to +125°C Z-8A
AD9698KN Plastic DIP 0°C to +70°C N-16
AD9698KR SOIC 0°C to +70°C R-16A
AD9698KQ Cerdip 0°C to +70°C Q-16
AD9698TQ Cerdip –55°C to +125°C Q-16
AD9698TZ/883B
3
Gullwing –55°C to +125°C Z-16
NOTES
1
N = Plastic DIP, Q = Cerdip, R = Small Outline (SOIC), Z = Ceramic Leaded
Chip Carrier.
2
Refer to AD9696TZ/883B military data sheet.
3
Refer to AD9698TZ/883B military data sheet.
AD9696/AD9698
–3–
REV. B
