INTEL A80960KB-20

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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

© INTEL CORPORATION, 2004 August, 2004 Order Number: 270565-008
80960KB
80960KB
EMBEDDED 32-BIT MICROPROCESSOR
WITH INTEGRATED FLOATING-POINT UNIT
Figure 1. The 80960KB Processor’s Highly Parallel Architecture
High-Performance Embedded
Architecture
25 MIPS Burst Execution at 25 MHz
9.4 MIPS* Sustained Execution at
25 MHz
512-Byte On-Chip Instruction Cache
Direct Mapped
Parallel Load/Decode for Uncached
Instructions
Multiple Register Sets
Sixteen Global 32-Bit Registers
Sixteen Local 32-Bit Registers
Four Local Register Sets Stored
On-Chip
Register Scoreboarding
4 Gigabyte, Linear Address Space
Pin Compatible with 80960KA
Built-in Interrupt Controller
31 Priority Levels, 256 Vectors
3.4 µs Latency @ 25 MHz
Easy to Use, High Bandwidth 32-Bit Bus
66.7 Mbytes/s Burst
Up to 16 Bytes Transferred per Burst
132-Lead Packages:
Pin Grid Array (PGA)
Plastic Quad Flat-Pack (PQFP)
On-Chip Floating Point Unit
Supports IEEE 754 Floating Point
Standard
Four 80-Bit Registers
13.6 Million Whetstones/s (Single
Precision) at 25 MHz
SIXTEEN
32-BIT GLOBAL
REGISTERS
64- BY 32-BIT
LOCAL
REGISTER
CACHE
32-BIT
INSTRUCTION
EXECUTION
UNIT
INSTRUCTION
FETCH UNIT
512-BYTE
INSTRUCTION
CACHE
INSTRUCTION
DECODER
MICRO-
INSTRUCTION
SEQUENCER
MICRO-
INSTRUCTION
ROM
32-BIT
BUS CONTROL
LOGIC
32-BIT
BURST
BUS
FOUR
80-BIT FP
REGISTERS
80-BIT
FPU
Information in this document is provided in connection with Intel products. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in
Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel
disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright
or other intellectual property right. Intel products are not intended for use in medical, life saving, or life
sustaining applications. Intel may make changes to specifications and product descriptions at any time, without
notice. Contact your local Intel sales office or your distributor to obtain the latest specifications and before
placing your product order.
Intel retains the right to make changes to specifications and product descriptions at any time, without notice.
*Third party brands and names are the property of their respective owners.
Copies of documents which have an ordering number and are referenced in this document, or other Intel
literature, may be obtained from:
Intel Corporation
P.O. Box 7641
Mt. Prospect IL 60056-7641
or call 1-800-879-4683.
Many documents are available for download from Intel’s website at http:\\www.intel.com.
Copyright © Intel Corporation 1997, 2004
Contents
iii
80960KB
EMBEDDED 32-BIT MICROPROCESSOR
1.0 THE i960® PROCESSOR .......................................................................................................................... 1
1.1 Key Performance Features ................................................................................................................. 2
1.1.1 Memory Space And Addressing Modes ................................................................................... 4
1.1.2 Data Types ............................................................................................................................... 4
1.1.3 Large Register Set ................................................................................................................... 4
1.1.4 Multiple Register Sets .............................................................................................................. 5
1.1.5 Instruction Cache ..................................................................................................................... 5
1.1.6 Register Scoreboarding ........................................................................................................... 5
1.1.7 High Bandwidth Local Bus ....................................................................................................... 6
1.1.8 Interrupt Handling .................................................................................................................... 6
1.1.9 Debug Features ....................................................................................................................... 6
1.1.10 Fault Detection ....................................................................................................................... 7
1.1.11 Built-in Testability ................................................................................................................... 7
2.0 ELECTRICAL SPECIFICATIONS ............................................................................................................ 10
2.1 Power and Grounding ....................................................................................................................... 10
2.2 Power Decoupling Recommendations ............................................................................................. 10
2.3 Connection Recommendations ........................................................................................................ 11
2.4 Characteristic Curves ....................................................................................................................... 11
2.5 Test Load Circuit ............................................................................................................................... 14
2.7 DC Characteristics ............................................................................................................................ 15
2.6 Absolute Maximum Ratings .............................................................................................................. 15
2.8 AC Specifications ............................................................................................................................. 16
2.8.1 AC Specification Tables ......................................................................................................... 17
3.0 MECHANICAL DATA ................................................................................................................................ 21
3.1 Packaging ......................................................................................................................................... 21
3.1.1 Pin Assignment ...................................................................................................................... 21
3.2 Pinout ............................................................................................................................................... 25
3.3 Package Thermal Specification ........................................................................................................ 29
4.0 WAVEFORMS .......................................................................................................................................... 33
5.0 REVISION HISTORY ............................................................................................................................... 38
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