2
93C46/56/57/66/86
Doc. No. 25056-00 2/98 M-1
ABSOLUTE MAXIMUM RATINGS*
Temperature Under Bias ................. –55°C to +125°C
Storage Temperature....................... –65°C to +150°C
Voltage on any Pin with
Respect to Ground
(1)
............ –2.0V to +V
CC
+2.0V
V
CC
with Respect to Ground ............... –2.0V to +7.0V
Package Power Dissipation
Capability (Ta = 25°C)................................... 1.0W
Lead Soldering Temperature (10 secs) ............ 300°C
Output Short Circuit Current
(2)
........................ 100 mA
*COMMENT
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of
the device at these or any other conditions outside of those
listed in the operational sections of this specification is not
implied. Exposure to any absolute maximum rating for
extended periods may affect device performance and
reliability.
RELIABILITY CHARACTERISTICS
Symbol Parameter Min. Max. Units Reference Test Method
N
END
(3)
Endurance 1,000,000 Cycles/Byte MIL-STD-883, Test Method 1033
T
DR
(3)
Data Retention 100 Years MIL-STD-883, Test Method 1008
V
ZAP
(3)
ESD Susceptibility 2000 Volts MIL-STD-883, Test Method 3015
I
LTH
(3)(4)
Latch-Up 100 mA JEDEC Standard 17
Note:
(1) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC
voltage on output pins is V
CC
+0.5V, which may overshoot to V
CC
+2.0V for periods of less than 20 ns.
(2) Output shorted for no more than one second. No more than one output shorted at a time.
(3) This parameter is tested initially and after a design or process change that affects the parameter.
(4) Latch-up protection is provided for stresses up to 100 mA on address and data pins from –1V to V
CC
+1V.
(5) Standby Current (ISB
2
)=0µA (<900nA) for 93C46/56/57/66, (ISB
2
)=2µA for 93C86.
D.C. OPERATING CHARACTERISTICS
V
CC
= +1.8V to +6.0V, unless otherwise specified.
Limits
Symbol Parameter Min. Typ. Max. Units Test Conditions
I
CC1
Power Supply Current 3 mA f
SK
= 1MHz
(Operating Write) V
CC
= 5.0V
I
CC2
Power Supply Current 500 µAf
SK
= 1MHz
(Operating Read) V
CC
= 5.0V
I
SB1
Power Supply Current 10 µA CS = 0V
(Standby) (x8 Mode) ORG=GND
I
SB2
(5)
Power Supply Current 0 µA CS=0V
(Standby) (x16Mode) ORG=Float or V
CC
I
LI
Input Leakage Current 1 µAV
IN
= 0V to V
CC
I
LO
Output Leakage Current 1 µAV
OUT
= 0V to V
CC
,
(Including ORG pin) CS = 0V
V
IL1
Input Low Voltage -0.1 0.8 4.5V≤V
CC
<5.5V
V
IH1
Input High Voltage 2 V
CC
+1
V
IL2
Input Low Voltage 0 V
CC
X0.2 1.8V≤V
CC
<2.7V
V
IH2
Input High Voltage V
CC
X0.7 V
CC
+1
V
OL1
Output Low Voltage 0.4 4.5V≤V
CC
<5.5V
V
OH1
Output High Voltage 2.4 I
OL
= 2.1mA
I
OH
= -400µA
V
OL2
Output Low Voltage 0.2 1.8V≤V
CC
<2.7V
V
OH2
Output High Voltage V
CC
-0.2 I
OL
= 1mA
I
OH
= -100µA
V
V
V
V
V
V
V