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8B104

Part # 8B104
Description
Category IC
Availability Out of Stock
Qty 0



Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Page:P11-P10
HOTTECH CHIP CERAMIC CAPACITORS
GUANGDONG HOTTECH INDUSTRIAL CO,. LTD.
Tape
Unit: mm
TYPE A B W P0 P1 P2
0201
0.38±0.05 0.68±0.05 8.00±0.20 4.00±0.10 2.00±0.10 2.00±0.05
0402
0.65±0.10 1.15±0.10 8.00±0.20 4.00±0.10 2.00±0.10 2.00±0.05
0603
1.10±0.10 1.90±0.10 8.00±0.20 4.00±0.10 4.00±0.10 2.00±0.05
0805
1.65±0.20 2.40±0.20 8.00±0.20 4.00±0.10 4.00±0.10 2.00±0.05
1206
2.00±0.20 3.60±0.20 8.00±0.20 4.00±0.10 4.00±0.10 2.00±0.05
1210
2.80±0.10 3.50±0.10 8.00±0.20 4.00±0.10 4.00±0.10 2.00±0.05
1812
3.60±0.20 4.90±0.20 12.00±0.10 4.00±0.10 4.00±0.10 2.00±0.05
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HOTTECH CHIP CERAMIC CAPACITORS
GUANGDONG HOTTECH INDUSTRIAL CO,. LTD.
8.WELDING TEMPERATURE
Suitable reflow temperature
1-2/Sec ramp
Preheat 150-183℃:2-3 minutes
Time above 183℃:60-100 seconds
Peak Temperature230±10
Module should only be in oven for 5.5-6 minute
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