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HOTTECH CHIP CERAMIC CAPACITORS
GUANGDONG HOTTECH INDUSTRIAL CO,. LTD.
4. DIELECTRIC CHARACTERISTIC INTRODUCTION AND TEST METHOD
ITEM STANDARD TEST METHOD
Capacitance 0.5PF-47uF
COG：
C≤1000PF ：1MHz±10%
1.0±0.2Vrms
C＞1000PF：1KHz±10%
1.0±0.2Vrms
X7R/X5R：
1KHz±10% 1.0±0.2Vrms
Y5V/Z5U：
1KHz±10% 1.0±0.2Vrms ≤10uF
120Hz 0.5±0.2Vrms ＞10uF
Tolerance
B=±0.1PF C=±0.25PF D=±0.5.PF
F=±1% G=±2% J=±5%
K=±10% M=±20%
Rated Voltage 16、25、50、100、200、500、1000、2000 V(DC)
Dissipation
Factor
COG/NPO DF≤0.15%
X7R/X5R DF ≤ 2.5%( ≥50V) , ≤ 3.0%(25V) ,≤
3.5%(16V)
Y5V/Z5U DF ≤ 7%(C ≥ 100nF) . ≤
3.5%(C<100nF)
Insulation
Resistance（IR）
COG/NPO C≤10NF IR＞50000MΩ;
C＞10NF IR＞5000ΩF
Test voltage: rated
Time: 1 minute
Temperature: 18-25℃
Humidity: <80%
X7R/X5R C≤25NF IR＞10000MΩ;
C＞25NF RXC＞100ΩF
Y5V/Z5U C≤25NF IR＞4000MΩ;
C＞25NF RXC＞100ΩF
Dielectric
withstanding
voltage
No damage after test
Apply 2.5x rated voltage to both terminations
for 5 seconds, charge and discharge current are
less than 50mA. (This test doesn’t apply to
high-voltage MLCC)
Termination
Adhesion
No damage after test Test Condition: 5N 10±1S
Bending
Strength
No damage after test and capacitance tolerance shall not be
more than 10%
After soldering capacitor on the PCB, 1mm per
1 second of bending for this PCB shall be
applied.
Solderability
Temperature 235±5℃
Completely immerse the capacitor in the
molthen rosin for 2s and then put it in the
10mm molthen solder with a temperature of
235±5℃（265±5℃）for 2(5)s. after that
pick it up, clean the solvent and inspect it
under 10x or more microscope.
Time 1±1S
Cover ≥95
Resistance to
soldering Heat
Tempertaure 265±5℃
Time 1±1S
Cover ≥95
△C/C ≤0.5% or 0.5PF
Temperature
Cycling
Dielectric COG/NPO X7R/X5R Y5V/Z5U
Temperature: -55 ± 3 ℃ ~125 ± 3 ℃
COG/X7R
-25±3℃~85±3℃ Y5V
-10±3℃~85±3℃ Z5U
Cycle times: 5 times per 30s
Resume time: 24h
△C/C ≤1% ≤±10% ≤±30%
No damage after test
