Ferrite EMI Disks and Plates

Ferrite Disks and Plates provide a simple, cost-effective solution for radiated and inductively-coupled

electromagnetic interference. After the PC board soldering process, a ferrite disk or plate can be

installed directly on the source of EMI (such as active devices or unwanted antennas).

Features:

• Easy installation • Each part for volume production is provided with permanent, double sided 3,5 mil acrylic adhesive

with 218 oz./inch

adhesion. • Samples and sample kits are available with removable and reusable adhesive for "trial

and error" testing • Variety of sizes offered • For frequencies above 250 MHz, H series material is generally better than

M series material • Custom parts also available.

Applications:

• Ferrite disks and plates can be utilized either as inductively-coupled components or EMI shields on PC board com-

ponents and traces. (Inductive coupling occurs when the ferrite affects the conducted wave form leaving the active

component. The rise time of the wave form is

effectively slowed by the ferrite, and the overshoot and associated

ringing

are attenuated. EMI shielding occurs when the ferrite absorbs

the radiated emissions from active components, effectively

protecting other boards or components in the vicinity from radiated contamination). • Can be used to locate unwanted

EMI antennas. • Flat Flex & Ribbon cables. • Can also provide retrot, auxiliary EMI attenuation.

Example Application Graph Explanation:

The zero line on the graph represents the base line noise recorded for an

unprotected microprocessor. The curves (dB down) represent the performance

of the Laird Technologies’ ferrite plates relative to the baseline. The addition of

the ferrite plates to the top of the processor in this specic application exhibits

up to a 5 dB EMI reduction relative to the unprotected part. In the example

application graph above, the ferrite plate MP1040-100 exhibits up to a 1 dB

advantage over the HP1040-100 from 1-100 MHz, while the HP1040-100

exhibits a 0,5 dB advantage between 200 and 400 MHz. Performance can

vary with different sizes, materials, processors and applications.

Frequency MHz

dB down (relative to baseline noise)

1 10 100

1000

- 6

- 5

- 4

- 3

- 2

- 1

MP1040-100 and HP1040-100

EXAMPLE APPLICATION

MP 1040-100

HP 1040-100

Plate

ADHESIVE

Disk

ADHESIVE

PART

NUMBER

(inches)

HM0787-100

19.99

(0.787)

1.27

(0.050)

HM0787-200

19.99

(0.787)

1.91

(0.075)

HM1400-200

35.56

(1.400)

1.91

(0.075)

HM1400-300

35.56

(1.400)

2.54

(0.100)

MM0650-100

16.51

(0.650)

1.27

(0.050)

MM0787-100

20.00

(0.787)

1.27

(0.050)

MM0787-200

20.00

(0.787)

1.91

(0.075)

MM1400-200

35.56

(1.400)

1.91

(0.075)

MM1400-300

35.56

(1.400)

2.54

(0.100)

HP1040-100

26.42

(1.040)

26.42

(1.040)

1.27

(0.050)

HP1040-200

26.42

(1.040)

26.42

(1.040)

1.91

(0.075)

MP0315-200

8.00

(0.315)

8.00

(0.315)

2.00

(0.079)

MP0350-000

26.42

(1.040)

8.89

(0.350)

1.27

(0.050)

MP0433-000

11.00

(0.433)

11.00

(0.433)

1.96

(0.077)

MP0512-200

13.00

(0.512)

13.00

(0.512)

2.00

(0.079)

MP0590-200

21.00

(0.827)

15.00

(0.591)

2.00

(0.079)

MP0591-200

15.00

(0.591)

15.00

(0.591)

2.00

(0.079)

MP0760-100

19.30

(0.760)

19.30

(0.760)

1.27

(0.050)

MP1040-100

26.42

(1.040)

26.42

(1.040)

1.27

(0.050)

MP1040-200

26.42

(1.040)

26.42

(1.040)

1.91

(0.075)

MP1040-300

26.42

(1.040)

26.42

(1.040)

2.25

(0.089)

MP1496-000

38.00

(1.496)

38.00

(1.496)

2.00

(0.079)

PART NUMBER SYSTEM EXAMPLE

H M 0787 100

H - Material

M - Material

M - Disk

P - Plate

Part Size

Indentication

Thickness

Code

Visit www .lairdtech.com for more information on Laird Technologies engineered EMI, antenna and thermal interface product lines.

NOTICE: Although the information and recommendations set forth herein (hereinafter “information”) are presented in good faith and believed to be correct as of the date hereof,

Laird Technologies makes no representation or warranties as to the completeness or accuracy thereof. Information is supplied upon the condition that the persons receiving same

will make their own determination as to its suitability for their purposes prior to use. In no event will Laird Technologies be responsible for damages of any nature whatsoever

resulting from the use or reliance upon information or the product to which information refers. Nothing contained herein is to be construed as a recommendation to use any

product, process, equipment or formulation in conflict with any patent, and Laird Technologies makes no representation or warranty, expressed or implied, that the use thereof

will not infringe any patent. The data set forth in all tables, charts, graphs and figures herein are based on samples tested and are not guaranteed for all samples or applications.

Such data are intended as guides and do not reflect product specifications for any particular product. NO REPRESENTATION OR WARRANTIES, EITHER EXPRESSED OR IMPLIED,

OR MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR OF ANY OTHER NATURE ARE MADE HEREUNDER WITH RESPECT TO INFORMATION OR THE PRODUCT TO

WHICH INFORMATION REFERS.

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