Name: 89V54RD
SKU: 89V54RD

Data Sheet

FlashFlex51 MCU

SST89E52RD2/RD / SST89E54RD2/RD / SST89E58RD2/RD

SST89V52RD2/RD / SST89V54RD2/RD / SST89V58RD2/RD

16.0 PACKAGING DIAGRAMS

FIGURE 16-1: 40-pin Plastic Dual In-line Pins (PDIP)

SST Package Code: PI

FIGURE 16-2: 44-lead Plastic Lead Chip Carrier (PLCC)

SST Package Code: NJ

40-pdip-PI-7

Pin #1 Identifier

Base Plane

Seating Plane

.220 Max.

12˚

4 places

.600 BSC

.100 BSC

.100 †

.200

.015

.022

.045

.055

.063

.090

.015 Min.

.065

.075

2.020

2.070

.008

.012

0˚

15˚

.600

.625

.530

.557

Note: 1. Complies with JEDEC publication 95 MS-011 AC dimensions (except as noted), although some dimensions may be more stringent.

† = JEDEC min is .115; SST min is

less

stringent

2. All linear dimensions are in inches (min/max).

3. Dimensions do not include mold flash. Maximum allowable mold flash is .010 inches.

.025

.045

.013

.021

.590

.630

.100

.112

.020 Min.

.165

.180

TOP VIEW SIDE VIEW BOTTOM VIEW

144

.026

.032

.500

REF.

44-plcc-NJ-7

Note: 1. Complies with JEDEC publication 95 MS-018 AC dimensions (except as noted), although some dimensions may be more stringent.

† = JEDEC min is .650; SST min is

less

stringent

2. All linear dimensions are in inches (min/max).

3. Dimensions do not include mold flash. Maximum allowable mold flash is .008 inches.

4. Coplanarity: 4 mils.

.050

BSC.

.050

BSC.

.026

.032

.042

.056

.646

†

.656

.042

.048

.042

.048

Optional

Pin #1 Identifier

.646

†

.656

.685

.695

.685

.695

.020 R.

MAX.

.147

.158

x45˚

Data Sheet

FlashFlex51 MCU

SST89E52RD2/RD / SST89E54RD2/RD / SST89E58RD2/RD

SST89V52RD2/RD / SST89V54RD2/RD / SST89V58RD2/RD

FIGURE 16-3: 44-lead Thin Quad Flat Pack (TQFP)

SST Package Code: TQJ

FIGURE 16-4: 40-contact Very-very-thin Quad Flat No-lead (WQFN)

SST Package Code: QI

Note: 1. Complies with JEDEC publication 95 MS-026 ACB dimensions, although some dimensions may be more stringent.

2. All linear dimensions are in millimeters (min/max).

3. Coplanarity: 0.1 (±0.05) mm.

4. Package body dimensions do not include mold flash. Maximum allowable mold flash is .25mm.

44-tqfp-TQJ-7

.45

.75

10.00 ± 0.10

12.00 ± 0.25

1.00 ref

0˚- 7˚

1.2

max.

.95

1.05

.05

.15

Pin #1 Identifier

.30

.45

.09

.20

.80 BSC

12.00 ± 0.25

10.00 ± 0.10

1mm

Note: 1. Complies with JEDEC JEP95 MO-220I, variant WJJD-5 except external paddle nominal dimensions.

2. From the bottom view, the pin #1 indicator may be either a 45-degree chamfer or a half-circle notch.

3. The external paddle is electrically connected to the die back-side and possibly to certain V

leads.

This paddle should be soldered to the PC board; it is suggested to connect this paddle to the V

of the unit.

Connection of this paddle to any other voltage potential will result in shorts and/or electrical malfunction of the device.

4. Untoleranced dimensions are nominal target dimensions.

5. All linear dimensions are in millimeters (max/min).

40-wqfn-6x6-QI-1

4.1

0.5 BSC

See notes

2 and 3

Pin #1

0.30

0.18

0.075

4.1

0.2

6.00 ± 0.10

0.05 Max

0.45

0.35

0.80

0.70

Pin #1

TOP VIEW BOTTOM VIEWSIDE VIEW

1mm

Data Sheet

FlashFlex51 MCU

SST89E52RD2/RD / SST89E54RD2/RD / SST89E58RD2/RD

SST89V52RD2/RD / SST89V54RD2/RD / SST89V58RD2/RD

TABLE 16-1: Revision History

Number Description Date

• Initial Release

Mar 2004

• Changed MPNs of SST89E/V5xRD2 PDIP devices to SST89E/V5xRD

• Removed SST89E/V516RD2 devices and associated MPNs

• Removed all industrial temperature PDIP devices and associated MPNs

• Clarified Surface Mount Temperatures in “Absolute Maximum Stress Ratings” on

page 63

• Changes in Tables 14-6 and 14-7:

– Removed the minimum V

=2V for I

Power-down (also Figure 14-13)

– Removed the 12 MHz values for I

Sep 2004

• Corrected MPN breakdown definition for “2” to read “Port 4 present”

• Corrected the SPI control Register definition for CPHA on page 29

• Added SST89E/V5xRD industrial temperature PDIP devices and associated MPNs

• Added RoHS compliance information on page 1 and in the “Product Ordering Infor-

mation” on page 76

• Corrected the solder temperature profile under “Absolute Maximum Stress Rat-

ings” on page 63

• Removed references to External Host Mode programming

Mar 2005

• Made changes to add WQFN package

Mar 2006

• Revised Figure 3-1 on page 11. Changed 7HHH to 1HHH.

Apr 2006

• Revised Figure 3-1 on page 11. Changed 8000H to 2000H.

• Changed document status from Preliminary Specification to Data Sheet.

May 2006

Silicon Storage Technology, Inc. • 1171 Sonora Court • Sunnyvale, CA 94086 • Telephone 408-735-9110 • Fax 408-735-9036

Part #	89V54RD
Description
Category	IC
Availability	In Stock
Qty	61

Manufacturer	Available	Qty
SST	Freelance Stock: 9 Ships Immediately	Request For Quote
SST Date Code: 0619	Freelance Stock: 5 Ships Immediately	Request For Quote
SST	Freelance Stock: 20 Ships Immediately	Request For Quote
Silicon Storage Technology Date Code: 0619	Freelance Stock: 27 Ships Immediately	Request For Quote

89V54RD

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