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89V54RD

Part # 89V54RD
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Data Sheet
FlashFlex51 MCU
SST89E52RD2/RD / SST89E54RD2/RD / SST89E58RD2/RD
SST89V52RD2/RD / SST89V54RD2/RD / SST89V58RD2/RD
61
©2006 Silicon Storage Technology, Inc. S71255-05-000 5/06
12.0 POWER-SAVING MODES
The device provides two power saving modes of operation
for applications where power consumption is critical. The
two modes are idle and power-down, see Table 12-1.
12.1 Idle Mode
Idle mode is entered setting the IDL bit in the PCON regis-
ter. In idle mode, the program counter (PC) is stopped. The
system clock continues to run and all interrupts and periph-
erals remain active. The on-chip RAM and the special func-
tion registers hold their data during this mode.
The device exits idle mode through either a system inter-
rupt or a hardware reset. Exiting idle mode via system
interrupt, the start of the interrupt clears the IDL bit and
exits idle mode. After exit the Interrupt Service Routine, the
interrupted program resumes execution beginning at the
instruction immediately following the instruction which
invoked the idle mode. A hardware reset starts the device
similar to a power-on reset.
12.2 Power-down Mode
The power-down mode is entered by setting the PD bit in
the PCON register. In the power-down mode, the clock is
stopped and external interrupts are active for level sensitive
interrupts only. SRAM contents are retained during power-
down, the minimum V
DD
level is 2.0V.
The device exits power-down mode through either an
enabled external level sensitive interrupt or a hardware
reset. The start of the interrupt clears the PD bit and exits
power-down. Holding the external interrupt pin low restarts
the oscillator, the signal must hold low at least 1024 clock
cycles before bringing back high to complete the exit. Upon
interrupt signal being restored to logic V
IH,
the first instruc-
tion of the interrupt service routine will execute. A hardware
reset starts the device similar to power-on reset.
To exit properly out of power-down, the reset or external
interrupt should not be executed before the V
DD
line is
restored to its normal operating voltage. Be sure to hold
V
DD
voltage long enough at its normal operating level for
the oscillator to restart and stabilize (normally less than
10 ms).
TABLE 12-1: Power Saving Modes
Mode Initiated by State of MCU Exited by
Idle Mode Software
(Set IDL bit in PCON)
MOV PCON, #01H;
CLK is running.
Interrupts, serial port and tim-
ers/counters are active. Pro-
gram Counter is stopped.
ALE and PSEN# signals at a
HIGH level during Idle. All
registers remain unchanged.
Enabled interrupt or hardware reset.
Start of interrupt clears IDL bit and
exits idle mode, after the ISR RETI
instruction, program resumes execu-
tion beginning at the instruction follow-
ing the one that invoked idle mode. A
user could consider placing two or
three NOP instructions after the
instruction that invokes idle mode to
eliminate any problems. A hardware
reset restarts the device similar to a
power-on reset.
Power-down
Mode
Software
(Set PD bit in PCON)
MOV PCON, #02H;
CLK is stopped. On-chip
SRAM and SFR data is main-
tained. ALE and PSEN# sig-
nals at a LOW level during
power -down. External Inter-
rupts are only active for level
sensitive interrupts, if
enabled.
Enabled external level sensitive inter-
rupt or hardware reset. Start of inter-
rupt clears PD bit and exits power-
down mode, after the ISR RETI
instruction program resumes execution
beginning at the instruction following
the one that invoked power-down
mode. A user could consider placing
two or three NOP instructions after the
instruction that invokes power-down
mode to eliminate any problems. A
hardware reset restarts the device sim-
ilar to a power-on reset.
T12-1.0 1255
62
Data Sheet
FlashFlex51 MCU
SST89E52RD2/RD / SST89E54RD2/RD / SST89E58RD2/RD
SST89V52RD2/RD / SST89V54RD2/RD / SST89V58RD2/RD
©2006 Silicon Storage Technology, Inc. S71255-05-000 5/06
13.0 SYSTEM CLOCK AND CLOCK OPTIONS
13.1 Clock Input Options and Recom-
mended Capacitor Values for Oscillator
Shown in Figure 13-1 are the input and output of an inter-
nal inverting amplifier (XTAL1, XTAL2), which can be con-
figured for use as an on-chip oscillator.
When driving the device from an external clock source,
XTAL2 should be left disconnected and XTAL1 should be
driven.
At start-up, the external oscillator may encounter a higher
capacitive load at XTAL1 due to interaction between the
amplifier and its feedback capacitance. However, the
capacitance will not exceed 15 pF once the external signal
meets the V
IL
and V
IH
specifications.
Crystal manufacturer, supply voltage, and other factors
may cause circuit performance to differ from one applica-
tion to another. C1 and C2 should be adjusted appropri-
ately for each design. Table 13-1, shows the typical values
for C1 and C2 vs. crystal type for various frequencies
More specific information about on-chip oscillator design
can be found in the FlashFlex51 Oscillator Circuit Design
Considerations application note.
13.2 Clock Doubling Option
By default, the device runs at 12 clocks per machine cycle
(x1 mode). The device has a clock doubling option to
speed up to 6 clocks per machine cycle. Please refer to
Table 13-2 for detail.
Clock double mode can be enabled either via the external
host mode or the IAP mode. Please refer to Table 4-2 for
the IAP mode enabling commands (When set, the EDC#
bit in SFST register will indicate 6 clock mode.).
The clock double mode is only for doubling the inter-
nal system clock and the internal flash memory, i.e.
EA#=1. To access the external memory and the peripheral
devices, careful consideration must be taken. Also note
that the crystal output (XTAL2) will not be doubled.
FIGURE 13-1: Oscillator Characteristics
TABLE 13-1:Recommended Values for C1 and
C2 by Crystal Type
Crystal C1 = C2
Quartz 20-30pF
Ceramic 40-50pF
T13-1.0 1255
TABLE 13-2: Clock Doubling Features
Device Standard Mode (x1) Clock Double Mode (x2)
Clocks per
Machine Cycle
Max. External Clock Frequency
(MHz)
Clocks per
Machine Cycle
Max. External Clock Frequency
(MHz)
SST89E5xRD2/RD 12 40 6 20
SST89V5xRD2/RD 12 33 6 16
T13-2.0 1255
1255 F32.0
XTAL2
XTAL1
V
SS
C
1
Using the On-Chip Oscillator
External Clock Drive
C
2
XTAL2
XTAL1
V
SS
External
Oscillator
Signal
NC
Data Sheet
FlashFlex51 MCU
SST89E52RD2/RD / SST89E54RD2/RD / SST89E58RD2/RD
SST89V52RD2/RD / SST89V54RD2/RD / SST89V58RD2/RD
63
©2006 Silicon Storage Technology, Inc. S71255-05-000 5/06
14.0 ELECTRICAL SPECIFICATION
Note: This specification contains preliminary information on new products in production.
Specifications are subject to change without notice.
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Ambient Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
Voltage on EA# Pin to V
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +14.0V
D.C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to V
DD
+0.5V
Transient Voltage (<20ns) on Any Other Pin to V
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to V
DD
+1.0V
Maximum I
OL
per I/O Pins P1.5, P1.6, P1.7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA
Maximum I
OL
per I/O for All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15mA
Package Power Dissipation Capability (T
A
= 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5W
Through Hole Lead Soldering Temperature (10 Seconds). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
Surface Mount Solder Reflow Temperature
1
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds
1. Excluding certain with-Pb 32-PLCC units, all packages are 260°C capable in both non-Pb and with-Pb solder versions.
Certain with-Pb 32-PLCC package types are capable of 240
°C for 10 seconds; please consult the factory for the latest information.
Output Short Circuit Current
2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
2. Outputs shorted for no more than one second. No more than one output shorted at a time.
(Based on package heat transfer limitations, not device power consumption.
TABLE 14-1: Operating Range
Symbol Description Min. Max Unit
T
A
Ambient Temperature Under Bias
Standard 0 +70
°C
Industrial -40 +85 °C
V
DD
Supply Voltage
SST89E5xRD2/RD 4.5 5.5 V
SST89V5xRD2/RD 2.7 3.6 V
f
OSC
Oscillator Frequency
SST89E5xRD2/RD 0 40 MHz
SST89V5xRD2/RD 0 33 MHz
Oscillator Frequency for IAP
SST89E5xRD2/RD .25 40 MHz
SST89V5xRD2/RD .25 33 MHz
T14-1.0 1255
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