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8302401EC

Part # 8302401EC
Description OPTOCOUPL LOGIC-OUT OPEN COLLECTOR DC-IN 4-CH 16PDIP - Bul
Category IC
Availability Out of Stock
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1 + $45.41350



Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

1
3
2
4
8
6
7
5
V
CC
GND
V
OUT
Hermetically Sealed, Low I
F
,
Wide V
CC
, High Gain
Optocouplers
Technical Data
Features
• Dual Marked with Device
Part Number and DSCC
Drawing Number
• Manufactured and Tested on
a MIL-PRF-38534 Certified
Line
• QML-38534, Class H and K
• Five Hermetically Sealed
Package Configurations
• Performance Guaranteed,
Over -55°C to +125°C
• Low Input Current
Requirement: 0.5 mA
• High Current Transfer
Ratio: 1500% Typical @
I
F
= 0.5 mA
• Low Output Saturation
Voltage: 0.11 V Typical
• 1500 Vdc Withstand Test
Voltage
• High Radiation Immunity
• 6N138/9, HCPL-2730/31
Function Compatibility
• Reliability Data
Applications
• Military and Space
• High Reliability Systems
• Telephone Ring Detection
• Microprocessor System
Interface
• Transportation, Medical, and
Life Critical Systems
• Isolated Input Line Receiver
• EIA RS-232-C Line Receiver
• Voltage Level Shifting
• Isolated Input Line Receiver
• Isolated Output Line Driver
• Logic Ground Isolation
Harsh Industrial Environments
• Current Loop Receiver
• System Test Equipment
Isolation
• Process Control
Input/Output Isolation
Description
These units are single, dual, and
quad channel, hermetically sealed
optocouplers. The products are
capable of operation and storage
over the full military temperature
range and can be purchased as
either standard product or with
full MIL-PRF-38534 Class Level
H or K testing or from the appro-
priate DSCC Drawing. All devices
are manufactured and tested on a
MIL-PRF-38534 certified line and
are included in the DSCC Quali-
fied Manufacturers List QML-
38534 for Hybrid Microcircuits.
Each channel contains a GaAsP
light emitting diode which is
optically coupled to an integrated
high gain photon detector. The
high gain output stage features
an open collector output providing
both lower saturation voltage and
higher signaling speed than
possible with conventional photo-
Darlington optocouplers. The
shallow depth and small junctions
offered by the IC process
provides better radiation
immunity than conventional
photo transistor optocouplers.
The supply voltage can be
operated as low as 2.0 V without
adversely affecting the
parametric performance.
Functional Diagram
Multiple Channel Devices
Available
Truth Table
(Positive Logic)
Input Output
On (H) L
Off (L) H
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
*See matrix for available extensions.
5962-89810
HCPL-573X
HCPL-673X
5962-89785
5962-98002
6N140A*
HCPL-675X
83024
HCPL-570X
HCPL-177K
The connection of a 0.1
µ
F bypass capacitor between V
CC
and GND is recommended.
2
These devices have a 300%
minimum CTR at an input current
of only 0.5 mA making them ideal
for use in low input current
applications such as MOS, CMOS,
low power logic interfaces or line
receivers. Compatibility with high
voltage CMOS logic systems is
assured by specifying I
CCH
and
I
OH
at 18 Volts.
Upon special request, the follow-
ing device selections can be
made: CTR minimum of up to
600% at 0.5 mA, and lower
output leakage current levels to
100 µA.
Package styles for these parts are
8 and 16 pin DIP through hole
(case outlines P and E respec-
tively), 16 pin DIP flat pack (case
outline F), and leadless ceramic
chip carrier (case outline 2).
Devices may be purchased with a
variety of lead bend and plating
options. See Selection Guide
table for details. Standard
Military Drawing (SMD) parts are
available for each package and
lead style.
Because the same electrical die
(emitters and detectors) are used
for each channel of each device
listed in this data sheet, absolute
maximum ratings, recommended
operating conditions, electrical
specifications, and performance
characteristics shown in the
figures are similar for all parts
except as noted. Additionally, the
same package assembly processes
and materials are used in all
devices. These similarities justify
the use of a common data base
for die related reliability and
certain limited radiation test
results.
Selection Guide-Package Styles and Lead Configuration Options
16 pin 20 Pad
Package 16 pin DIP 8 pin DIP 8 pin DIP Flat Pack LCCC
Lead Style Through Hole Through Hole Through Hole Unformed Leads Surface Mount
Channels 4 1 2 4 2
Common Channel Wiring V
CC
, GND None V
CC
, GND V
CC
, GND None
Agilent Part # & Options
Commercial 6N140A* HCPL-5700 HCPL-5730 HCPL-6750 HCPL-6730
MIL-PRF-38534 Class H 6N140A/883B HCPL-5701 HCPL-5731 HCPL-6751 HCPL-6731
MIL-PRF-38534 Class K HCPL-177K HCPL-570K HCPL-573K HCPL-675K HCPL-673K
Standard Lead Finish Gold Plate Gold Plate Gold Plate Gold Plate Solder Pads
Solder Dipped Option #200 Option #200 Option #200
Butt Cut/Gold Plate Option #100 Option #100 Option #100
Gull Wing/Soldered Option #300 Option #300 Option #300
Crew Cut/Gold Plate Option #600 Option #600 Option #600
Class H SMD Part #
Prescript for all below None 5962- 5962- None 5962-
Either Gold or Solder 8302401EX 8981001PX 8978501PX 8302401FX 89785022X
Gold Plate 8302401EC 8981001PC 8978501PC 8302401FC
Solder Dipped 8302401EA 8981001PA 8978501PA 89785022A
Butt Cut/Gold Plate 8302401YC 8981001YC 8978501YC
Butt Cut/Soldered 8302401YA 8981001YA 8978501YA
Gull Wing/Soldered 8302401XA 8981001XA 8978501ZA
Crew Cut/Gold Plate 8302401ZC Available Available
Crew Cut/Soldered 8302401ZA Available Available
Class K SMD Part #
Prescript for all below 5962- 5962- 5962- 5962- 5962-
Either Gold or Solder 9800201KEX 8981002KPX 8978503KPX 9800201KFX 8978504K2X
Gold Plate 9800201KEC 8981002KPC 8978503KPC 9800201KFC
Solder Dipped 9800201KEA 8981002KPA 8978503KPA 8978504K2A
Butt Cut/Gold Plate 9800201KYC 8981002KYC 8978503KYC
Butt Cut/Soldered 9800201KYA 8981002KYA 8978503KYA
Gull Wing/Soldered 9800201KXA 8981002KXA 8978503KZA
Crew Cut/Gold Plate 9800201KZC Available Available
Crew Cut/Soldered 9800201KZA Available Available
*JEDEC registered part.
3
Functional Diagrams
16 pin DIP 8 pin DIP 8 pin DIP 16 pin Flat Pack 20 Pad LCCC
Through Hole Through Hole Through Hole Unformed Leads Surface Mount
4 Channels 1 Channel 2 Channels 4 Channels 2 Channels
Note: All DIP and flat pack devices have common V
CC
and ground. LCCC (leadless ceramic chip carrier) package has isolated channels
with separate V
CC
and ground connections.
5
7
6
8
12
10
11
9
GND
V
O4
V
O3
1
3
2
4
16
14
15
13
V
CC
V
O2
V
O1
1
3
2
4
8
6
7
5
V
CC
GND
V
O2
V
O1
5
7
6
8
12
10
11
9
GND
V
O4
V
O3
1
3
2
4
16
14
15
13
V
CC
V
O2
V
O1
Outline Drawings
16 Pin DIP Through Hole, 4 Channels
Leadless Device MarkingLeaded Device Marking
1
3
2
4
8
6
7
5
V
CC
GND
V
OUT
4.45 (0.175)
MAX.
20.06 (0.790)
20.83 (0.820)
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
0.89 (0.035)
1.65 (0.065)
8.13 (0.320)
MAX.
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
3.81 (0.150)
MIN.
GND
1
V
O2
19
20
2
3
V
O1
87
V
CC2
V
CC1
10
GND
2
15
13
12
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
50434
Agilent DESIGNATOR
Agilent P/N
DSCC SMD*
DSCC SMD*
PIN ONE/
ESD IDENT
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
Agilent CAGE CODE*
*QUALIFIED PARTS ONLY
A QYYWWZ
XXXXXX
XXXX
XXXXXX
XXX 50434
Agilent DESIGNATOR
Agilent P/N
PIN ONE/
ESD IDENT
COUNTRY OF MFR.
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
DSCC SMD*
DSCC SMD*
Agilent CAGE CODE*
*QUALIFIED PARTS ONLY
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